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1. 发明授权

US07209169B2 Imaging system using solid-state CMOS imaging device 失效
标题翻译：成像系统采用固态CMOS成像装置
公开(公告)号：US07209169B2
公开(公告)日：2007-04-24
申请号：US10084466
申请日：2002-02-28
申请人： Hiroyuki Matsumoto , Takashi Takahashi , Teruaki Odaka , Masashi Nakamura , Koji Shida
发明人： Hiroyuki Matsumoto , Takashi Takahashi , Teruaki Odaka , Masashi Nakamura , Koji Shida
IPC分类号： H04N3/14 , H04N9/73
CPC分类号： H04N5/2357 , H04N5/235 , H04N5/2351 , H04N5/2353 , H04N5/243
摘要： Turning on and off of the light source illuminating an object to be imaged is judged based on brightness changes in small and large areas set up in the frame and an electric charge storage time for each pixel is set up to be equal to the turning-on-and-off period of the light source or an integral multiple thereof. The charge storage time is changed over responsive to the turning-on-and-off period of the light source or the integral multiple thereof to set up a stored light amount for each pixel stepwise and difference in the stored light amount between steps is interpolated by continuous gain control of read-out signals of pixels.
摘要翻译：基于在帧中设置的小的和大的区域中的亮度变化来判断照射要成像的对象的光源的导通和关闭，并且每个像素的电荷存储时间被设置为等于接通光源的关闭周期或其整数倍。电荷存储时间响应于光源的接通和关闭周期或其整数倍而改变，以逐步建立每个像素的存储光量，并且步骤之间存储的光量的差异被内插对像素的读出信号进行连续增益控制。

2. 发明授权

US07230649B2 Image sensor system using CMOS image sensor and image sensor apparatus using CMOS image sensor 失效
标题翻译：使用CMOS图像传感器的图像传感器系统和使用CMOS图像传感器的图像传感器设备
公开(公告)号：US07230649B2
公开(公告)日：2007-06-12
申请号：US10291531
申请日：2002-11-12
申请人： Takashi Takahashi , Hiroyuki Matsumoto , Teruyuki Odaka , Masashi Nakamura , Koji Shida
发明人： Takashi Takahashi , Hiroyuki Matsumoto , Teruyuki Odaka , Masashi Nakamura , Koji Shida
IPC分类号： H04N5/225 , H04N3/14 , H04N5/335 , G06F1/00
CPC分类号： H04N5/23241 , H04N5/335
摘要： An image sensor such as the conventional CMOS image sensor, in which automatic controls including so-called automatic iris control and white balance adjustment for adjusting the sensor sensitivity, namely the charge accumulation time in each pixel, according to the brightness of the image sensing ambience are performed, involves the problem that, when the frame rate of the image sensor is slowed to save power consumption, the operation of the automatic control systems will also become slower and the image quality deteriorates. In the invented image sensor system using a CMOS image sensor, while a CMOS image sensor is operated at the full frame rate all the time, a circuit for processing image signals from the CMOS image sensor is operated at a speed close to that of full frame processing only when the power supply is turned on or when the image sensing ambience varies and switched to a lower frame processing speed when automatic controls, including iris control, have become stabilized.
摘要翻译：诸如常规CMOS图像传感器的图像传感器，其中包括所谓的自动光圈控制和用于调节传感器灵敏度的白平衡调整的自动控制，即每个像素中的电荷累积时间，根据图像感测环境的亮度涉及如下问题：当图像传感器的帧速率减慢以节省功耗时，自动控制系统的操作也将变慢并且图像质量恶化。在使用CMOS图像传感器的本发明的图像传感器系统中，一直以全帧速率操作CMOS图像传感器，用于处理来自CMOS图像传感器的图像信号的电路以接近全帧的速度运行只有当电源打开时或当图像感测环境变化并且当包括光圈控制的自动控制已经变得稳定时，才将其切换到较低的帧处理速度。

3. 发明申请

US20070097226A1 Image data processing semiconductor integrated circuit 审中-公开
标题翻译：图像数据处理半导体集成电路
公开(公告)号：US20070097226A1
公开(公告)日：2007-05-03
申请号：US11582994
申请日：2006-10-19
申请人： Koji Shida , Jun Suzuki , Yoichi Kato , Hidehito Yamada , Akihito Nishizawa
发明人： Koji Shida , Jun Suzuki , Yoichi Kato , Hidehito Yamada , Akihito Nishizawa
IPC分类号： H04N5/228
CPC分类号： H04N5/335 , H04N5/2258
摘要： The invention is intended to reduce the number of parts constituting an image capturing system using a solid-state image sensor and reduce the size and cost of a mobile electronic appliance having camera functionality. An analog front end circuit for an image capturing system, which samples pixel readout signals input from a solid-state image sensor, amplifies the sampled signals up to a predetermined level, and converts the amplified signals into digital signals, is formed, together with a DSP for digital image processing and a CPU responsible for arithmetic processing and control for camera functionality such as auto focusing and register setting, in a semiconductor integrated circuit on a single semiconductor chip.
摘要翻译：本发明旨在减少使用固态图像传感器构成图像捕获系统的部件的数量，并且减少具有相机功能的移动电子设备的尺寸和成本。用于对从固态图像传感器输入的像素读出信号进行采样的图像捕获系统的模拟前端电路将采样信号放大到预定电平，并将放大的信号转换为数字信号，形成为用于数字图像处理的DSP和负责在单个半导体芯片上的半导体集成电路中的用于诸如自动聚焦和寄存器设置的相机功能的算术处理和控制的CPU。

4. 发明授权

US07005310B2 Manufacturing method of solid-state image sensing device 失效
标题翻译：固态摄像装置的制造方法
公开(公告)号：US07005310B2
公开(公告)日：2006-02-28
申请号：US10651087
申请日：2003-08-29
申请人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
发明人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
IPC分类号： H01L21/00 , H04N5/225
CPC分类号： H01L24/97 , H01L24/45 , H01L24/48 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/4848 , H01L2224/85444 , H01L2224/85447 , H01L2924/01029 , H01L2924/12043 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/305 , H05K3/323 , H05K3/361 , H05K2201/10977 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.
摘要翻译：传感器芯片和容纳在其中的传感器芯片的透镜架安装在布线基板的表面上，并且在其中容纳透镜的透镜架与透镜安装座联接。在布线基板的后表面上安装有逻辑芯片，存储芯片和无源部件，并用密封树脂密封。传感器芯片的电极焊盘通过接合线电连接到布线基板的表面上的电极，但是在布线基板的表面上的电极上还形成有凸块，并且该凸块与接合线。在布线基板的表面上，用各向异性导电膜和接合材料粘结柔性基板。当制造相机模块时，在组装布线基板的背面侧之后组装布线基板的表面侧。

5. 发明授权

US5818655A Signal processing circuit and information recording/reproducing apparatus using the same, and method for optimizing coefficients of equalizer circuit 失效
公开(公告)号：US5818655A
公开(公告)日：1998-10-06
申请号：US506635
申请日：1995-07-25
申请人： Naoki Satoh , Seiichi Mita , Shoichi Miyazawa , Terumi Takashi , Yosuke Hori , Yoshiju Watanabe , Akihiko Hirano , Satoshi Minoshima , Hideki Miyasaka , Toshihiro Nitta , Tomoaki Hirai , Ryushi Shimokawa , Koji Shida , Yasuhide Ouchi
发明人： Naoki Satoh , Seiichi Mita , Shoichi Miyazawa , Terumi Takashi , Yosuke Hori , Yoshiju Watanabe , Akihiko Hirano , Satoshi Minoshima , Hideki Miyasaka , Toshihiro Nitta , Tomoaki Hirai , Ryushi Shimokawa , Koji Shida , Yasuhide Ouchi
IPC分类号： G11B5/035 , G11B5/09 , G11B20/10
CPC分类号： G11B20/10055 , G11B20/10009 , G11B20/10481 , G11B5/035 , G11B5/09
摘要： A signal processing circuit for a magnetic recording/reproducing apparatus, including at least an AGC, a PLL, a LPF, an equalizer circuit and a detection circuit, wherein a coefficient compensation circuit is formed by defining a constitution of the equalizer circuit, an error detection circuit is provided which operates by receiving input from the detection circuit, and the LSI is formed by a plurality of analog and digital chips, and the analog and digital chips are connected by current-output type D/A converters connected to at least the AGC and the PLL.

6. 发明授权

US07957686B2 Image forming apparatus and fuser unit cleaning method 失效
标题翻译：成像设备和定影单元清洗方法
公开(公告)号：US07957686B2
公开(公告)日：2011-06-07
申请号：US12340172
申请日：2008-12-19
申请人： Koji Shida
发明人： Koji Shida
IPC分类号： G03G15/20
CPC分类号： G03G15/2025 , G03G2215/00126
摘要： An image forming apparatus includes a fuser unit that includes a first roller and a second roller opposite to each other, a first conveyance unit, a second conveyance unit, a drive unit, and a control unit to control the drive unit to rotate one or both of the first roller and the second roller in a state where a sheet contacts with the first roller and the second roller and the sheet is held by the first conveyance unit and the second conveyance unit, or in a state where after the sheet is held by the first conveyance unit and the second conveyance unit, one or both of the first conveyance unit and the second conveyance unit move in a direction of approaching at least one of the first roller and the second roller and the sheet contacts with the first roller or the second roller.
摘要翻译：一种图像形成装置包括：定影单元，包括第一辊和彼此相对的第二辊，第一输送单元，第二输送单元，驱动单元和控制单元，用于控制驱动单元旋转一个或两个在与第一辊和第二辊接触的片材的状态下，第一辊和第二辊的第一辊和第二辊被第一输送单元和第二输送单元保持，或者在片被保持之后的状态第一输送单元和第二输送单元，第一输送单元和第二输送单元中的一个或两个沿着接近第一辊和第二辊中的至少一个的方向移动，并且片与第一辊或第二输送单元接触第二辊。

7. 发明申请

US20060091487A1 Manufacturing method of solid-state image sensing device 审中-公开
公开(公告)号：US20060091487A1
公开(公告)日：2006-05-04
申请号：US11304618
申请日：2005-12-16
申请人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
发明人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
IPC分类号： H01L31/0232 , H01L31/062 , H01L33/00
CPC分类号： H01L24/05 , H01L24/03 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/85 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L31/0203 , H01L31/02325 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/13144 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/48599 , H01L2224/81801 , H01L2224/82 , H01L2224/85051 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/86 , H01L2224/97 , H01L2924/00014 , H01L2924/014 , H01L2924/12043 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2224/85 , H01L2924/01079 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

8. 发明申请

US20050116138A1 Method of manufacturing a solid state image sensing device 审中-公开
标题翻译：制造固体摄像装置的方法
公开(公告)号：US20050116138A1
公开(公告)日：2005-06-02
申请号：US10946035
申请日：2004-09-22
申请人： Kenji Hanada , Masaki Nakanishi , Kunio Shigemura , Takaomi Nishi , Koji Shida , Izumi Tezuka , Shunichi Abe , Yoshihiro Tomita , Mitsuaki Seino , Tohru Komatsu
发明人： Kenji Hanada , Masaki Nakanishi , Kunio Shigemura , Takaomi Nishi , Koji Shida , Izumi Tezuka , Shunichi Abe , Yoshihiro Tomita , Mitsuaki Seino , Tohru Komatsu
IPC分类号： G02B7/02 , G01J1/00 , H01J40/14 , H01L21/76 , H01L27/00 , H01L27/14 , H04N5/225 , H04N5/335
CPC分类号： H01L24/97 , H01L24/45 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H04N5/2254 , H04N5/2257 , H01L2224/85 , H01L2924/00014 , H01L2924/00
摘要： The reliability and production yield of a solid state image sensing device is improved. Over a surface of a wiring substrate, a sensor chip and a lens-barrel having the sensor chip housed therein are mounted. To the lens-barrel, a lens holder for retaining a lens is connected. Over a back surface of the wiring substrate, a logic chip, a memory chip and a passive part are mounted, and they are sealed with a sealing resin. The lens-barrel and lens holder are each threaded. They are thermally welded while the threads are fitted to each other. The passive part is bonded to the wiring substrate via a Sn—Ag type Pb-free solder. After the wiring substrate is subjected to plasma washing treatment, the sensor chip is mounted over the wiring substrate and an electrode pad of the sensor chip and an electrode of the wiring substrate are electrically connected via a bonding wire.
摘要翻译：提高了固态摄像装置的可靠性和产量。在布线基板的表面上安装传感器芯片和容纳有传感器芯片的透镜筒。连接透镜镜筒，用于保持透镜的透镜保持器。在布线基板的背面上安装有逻辑芯片，存储芯片和无源部件，并且用密封树脂密封。透镜镜筒和镜头支架均为螺纹。它们在螺纹彼此安装时被热焊接。无源部分通过Sn-Ag型无铅焊料与布线基板接合。在布线基板进行等离子体洗涤处理之后，将传感器芯片安装在布线基板上，并且传感器芯片的电极焊盘和布线基板的电极经由接合线电连接。

9. 发明授权

US07877028B2 Apparatus and a method for forming an image on a sheet 有权
标题翻译：用于在片材上形成图像的装置和方法
公开(公告)号：US07877028B2
公开(公告)日：2011-01-25
申请号：US12332050
申请日：2008-12-10
申请人： Koji Shida
发明人： Koji Shida
IPC分类号： G03G15/00
CPC分类号： G03G15/2039 , G03G2215/00738
摘要： In the image forming apparatus according to the invention, a fixer fixes toner on the sheet and presses the sheet, and a media sensor measures a thickness of the sheet before pressurization and a thickness of the sheet after pressurization. Then, by calculating an amount of heat used if the fixer fixes the toner on the sheet on the basis of the measurement result, a control unit is able to control the temperature of the fixer on the basis of the calculated amount of heat. In this manner, it is possible to appropriately calculate an amount of heat per unit area required to fix toner on the sheet.
摘要翻译：在根据本发明的图像形成装置中，定影剂将片材上的调色剂固定并压制片材，并且介质传感器测量加压前片材的厚度和加压后片材的厚度。然后，通过计算定影剂基于测量结果将调色剂固定在片材上的热量，控制单元能够根据计算出的热量来控制定影剂的温度。以这种方式，可以适当地计算将调色剂固定在片材上所需的每单位面积的热量。

10. 发明授权

US06661594B2 Signal processing circuit and information recording/reproducing apparatus using the same, and method for optimizing coefficients of equalizer circuit 有权
标题翻译：信号处理电路和使用该信号的信息记录/再现装置，以及用于优化均衡器电路的系数的方法
公开(公告)号：US06661594B2
公开(公告)日：2003-12-09
申请号：US10277695
申请日：2002-10-23
申请人： Naoki Satoh , Seiichi Mita , Shoichi Miyazawa , Terumi Takashi , Yosuke Hori , Yoshiju Watanabe , Akihiko Hirano , Satoshi Minoshima , Hideki Miyasaka , Toshihiro Nitta , Tomoaki Hirai , Ryushi Shimokawa , Koji Shida , Yasuhide Ouchi
发明人： Naoki Satoh , Seiichi Mita , Shoichi Miyazawa , Terumi Takashi , Yosuke Hori , Yoshiju Watanabe , Akihiko Hirano , Satoshi Minoshima , Hideki Miyasaka , Toshihiro Nitta , Tomoaki Hirai , Ryushi Shimokawa , Koji Shida , Yasuhide Ouchi
IPC分类号： G11B535
CPC分类号： G11B20/10055 , G11B5/035 , G11B5/09 , G11B20/10009 , G11B20/10481
摘要： A signal processing circuit for a magnetic recording/reproducing apparatus, including at least an AGC, a PLL, a LPF, an equalizer circuit and a detection circuit, wherein a coefficient compensation circuit is formed by defining a constitution of the equalizer circuit, an error detection circuit is provided which operates by receiving input from the detection circuit, and the LSI is formed by a plurality of analog and digital chips, and the analog and digital chips are connected by current-output type D/A converters connected to at least the AGC and the PLL.
摘要翻译：一种用于至少包括AGC，PLL，LPF，均衡器电路和检测电路的磁记录/再现装置的信号处理电路，其中通过定义均衡器电路的结构形成系数补偿电路，错误提供检测电路，其通过接收来自检测电路的输入而工作，并且LSI由多个模拟和数字芯片形成，并且模拟和数字芯片通过电流输出型D / A转换器连接至少至少 AGC和PLL。

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