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1. 发明申请

US20050116138A1 Method of manufacturing a solid state image sensing device 审中-公开
标题翻译：制造固体摄像装置的方法
公开(公告)号：US20050116138A1
公开(公告)日：2005-06-02
申请号：US10946035
申请日：2004-09-22
申请人： Kenji Hanada , Masaki Nakanishi , Kunio Shigemura , Takaomi Nishi , Koji Shida , Izumi Tezuka , Shunichi Abe , Yoshihiro Tomita , Mitsuaki Seino , Tohru Komatsu
发明人： Kenji Hanada , Masaki Nakanishi , Kunio Shigemura , Takaomi Nishi , Koji Shida , Izumi Tezuka , Shunichi Abe , Yoshihiro Tomita , Mitsuaki Seino , Tohru Komatsu
IPC分类号： G02B7/02 , G01J1/00 , H01J40/14 , H01L21/76 , H01L27/00 , H01L27/14 , H04N5/225 , H04N5/335
CPC分类号： H01L24/97 , H01L24/45 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H04N5/2254 , H04N5/2257 , H01L2224/85 , H01L2924/00014 , H01L2924/00
摘要： The reliability and production yield of a solid state image sensing device is improved. Over a surface of a wiring substrate, a sensor chip and a lens-barrel having the sensor chip housed therein are mounted. To the lens-barrel, a lens holder for retaining a lens is connected. Over a back surface of the wiring substrate, a logic chip, a memory chip and a passive part are mounted, and they are sealed with a sealing resin. The lens-barrel and lens holder are each threaded. They are thermally welded while the threads are fitted to each other. The passive part is bonded to the wiring substrate via a Sn—Ag type Pb-free solder. After the wiring substrate is subjected to plasma washing treatment, the sensor chip is mounted over the wiring substrate and an electrode pad of the sensor chip and an electrode of the wiring substrate are electrically connected via a bonding wire.
摘要翻译：提高了固态摄像装置的可靠性和产量。在布线基板的表面上安装传感器芯片和容纳有传感器芯片的透镜筒。连接透镜镜筒，用于保持透镜的透镜保持器。在布线基板的背面上安装有逻辑芯片，存储芯片和无源部件，并且用密封树脂密封。透镜镜筒和镜头支架均为螺纹。它们在螺纹彼此安装时被热焊接。无源部分通过Sn-Ag型无铅焊料与布线基板接合。在布线基板进行等离子体洗涤处理之后，将传感器芯片安装在布线基板上，并且传感器芯片的电极焊盘和布线基板的电极经由接合线电连接。

2. 发明授权

US08557633B2 Electronic device and manufacturing method of the same 有权
标题翻译：电子器件及其制造方法相同
公开(公告)号：US08557633B2
公开(公告)日：2013-10-15
申请号：US13079939
申请日：2011-04-05
申请人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
发明人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
IPC分类号： H01L21/00
CPC分类号： H01L25/162 , H01L23/3121 , H01L23/4824 , H01L23/5227 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/83 , H01L25/50 , H01L27/0617 , H01L27/0629 , H01L2224/0401 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48624 , H01L2224/48644 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/3463 , H05K3/3494 , H05K2201/045 , H05K2203/081 , H05K2203/1476 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00 , H01L2224/43 , H01L2924/01006
摘要： A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.
摘要翻译：提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热射流在280℃以上的温度进行热处理来进行。因此，可以使用高熔点焊料将半导体芯片IC1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。因此，半导体芯片IC1可以以高连接强度安装在PCB 38上。

3. 发明申请

US20060110859A1 Electronic device and manufacturing method of the same 失效
标题翻译：电子器件及其制造方法相同
公开(公告)号：US20060110859A1
公开(公告)日：2006-05-25
申请号：US11281476
申请日：2005-11-18
申请人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
发明人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
IPC分类号： H01L21/58 , H05K3/34
CPC分类号： H01L25/162 , H01L23/3121 , H01L23/4824 , H01L23/5227 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/83 , H01L25/50 , H01L27/0617 , H01L27/0629 , H01L2224/0401 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48624 , H01L2224/48644 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/3463 , H05K3/3494 , H05K2201/045 , H05K2203/081 , H05K2203/1476 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00 , H01L2224/43 , H01L2924/01006
摘要： A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.
摘要翻译：提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热喷射器在280℃以上的温度进行热处理来进行。因此，可以使用高熔点焊料将半导体芯片IC 1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。因此，半导体芯片IC 1可以以高连接强度安装在PCB 38上。

4. 发明申请

US20110183474A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20110183474A1
公开(公告)日：2011-07-28
申请号：US13079939
申请日：2011-04-05
申请人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
发明人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
IPC分类号： H01L21/56
CPC分类号： H01L25/162 , H01L23/3121 , H01L23/4824 , H01L23/5227 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/83 , H01L25/50 , H01L27/0617 , H01L27/0629 , H01L2224/0401 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48624 , H01L2224/48644 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/3463 , H05K3/3494 , H05K2201/045 , H05K2203/081 , H05K2203/1476 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00 , H01L2224/43 , H01L2924/01006
摘要： A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.
摘要翻译：提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热射流在280℃以上的温度进行热处理来进行。因此，可以使用高熔点焊料将半导体芯片IC1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。因此，半导体芯片IC1可以以高连接强度安装在PCB 38上。

5. 发明申请

US20080253100A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：US20080253100A1
公开(公告)日：2008-10-16
申请号：US12137869
申请日：2008-06-12
申请人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
发明人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
IPC分类号： H05K7/06
CPC分类号： H01L25/162 , H01L23/3121 , H01L23/4824 , H01L23/5227 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/83 , H01L25/50 , H01L27/0617 , H01L27/0629 , H01L2224/0401 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48624 , H01L2224/48644 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/3463 , H05K3/3494 , H05K2201/045 , H05K2203/081 , H05K2203/1476 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00 , H01L2224/43 , H01L2924/01006
摘要： A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.
摘要翻译：提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热喷射器在280℃以上的温度进行热处理来进行。因此，可以使用高熔点焊料将半导体芯片IC 1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。因此，半导体芯片IC 1可以以高连接强度安装在PCB 38上。

6. 发明授权

US07396701B2 Electronic device and manufacturing method of the same 失效
标题翻译：电子器件及其制造方法相同
公开(公告)号：US07396701B2
公开(公告)日：2008-07-08
申请号：US11281476
申请日：2005-11-18
申请人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
发明人： Kunio Shigemura , Kenji Hanada , Masaki Nakanishi , Takafumi Nishita , Masayoshi Shinoda , Seiichi Tomoi
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L25/162 , H01L23/3121 , H01L23/4824 , H01L23/5227 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/83 , H01L25/50 , H01L27/0617 , H01L27/0629 , H01L2224/0401 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48624 , H01L2224/48644 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/3463 , H05K3/3494 , H05K2201/045 , H05K2203/081 , H05K2203/1476 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00 , H01L2224/43 , H01L2924/01006
摘要： A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.
摘要翻译：提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接。通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热喷射器在280℃以上的温度进行热处理来进行。因此，可以使用高熔点焊料将半导体芯片IC 1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。因此，半导体芯片IC 1可以以高连接强度安装在PCB 38上。

7. 发明申请

US20060091487A1 Manufacturing method of solid-state image sensing device 审中-公开
公开(公告)号：US20060091487A1
公开(公告)日：2006-05-04
申请号：US11304618
申请日：2005-12-16
申请人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
发明人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
IPC分类号： H01L31/0232 , H01L31/062 , H01L33/00
CPC分类号： H01L24/05 , H01L24/03 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/85 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L31/0203 , H01L31/02325 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/13144 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/48599 , H01L2224/81801 , H01L2224/82 , H01L2224/85051 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/86 , H01L2224/97 , H01L2924/00014 , H01L2924/014 , H01L2924/12043 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2224/85 , H01L2924/01079 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

8. 发明授权

US07005310B2 Manufacturing method of solid-state image sensing device 失效
标题翻译：固态摄像装置的制造方法
公开(公告)号：US07005310B2
公开(公告)日：2006-02-28
申请号：US10651087
申请日：2003-08-29
申请人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
发明人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
IPC分类号： H01L21/00 , H04N5/225
CPC分类号： H01L24/97 , H01L24/45 , H01L24/48 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/4848 , H01L2224/85444 , H01L2224/85447 , H01L2924/01029 , H01L2924/12043 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/305 , H05K3/323 , H05K3/361 , H05K2201/10977 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.
摘要翻译：传感器芯片和容纳在其中的传感器芯片的透镜架安装在布线基板的表面上，并且在其中容纳透镜的透镜架与透镜安装座联接。在布线基板的后表面上安装有逻辑芯片，存储芯片和无源部件，并用密封树脂密封。传感器芯片的电极焊盘通过接合线电连接到布线基板的表面上的电极，但是在布线基板的表面上的电极上还形成有凸块，并且该凸块与接合线。在布线基板的表面上，用各向异性导电膜和接合材料粘结柔性基板。当制造相机模块时，在组装布线基板的背面侧之后组装布线基板的表面侧。

9. 发明申请

US20080248611A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件的制造方法
公开(公告)号：US20080248611A1
公开(公告)日：2008-10-09
申请号：US12037984
申请日：2008-02-27
申请人： Kenji HANADA , Norihisa Toma , Masaki Nakanishi , Takahiro Naito , Naotaka Tanaka
发明人： Kenji HANADA , Norihisa Toma , Masaki Nakanishi , Takahiro Naito , Naotaka Tanaka
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L21/563 , H01L23/3128 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/3511 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The quality and reliability of a semiconductor device can be improved by eliminating a warp of a chip and performing a chip-stack. A wiring substrate, the first semiconductor chip connected via the first gold bump on the wiring substrate, the second semiconductor chip stacked via the second gold bump on the first semiconductor chip, and a sealing body are comprised. A first gold bump is connected to the wiring substrate, heating, and injection by pressure welding of the first gold bump is done under normal temperature after that at the hole-like electrode of the first semiconductor chip. Since injection by pressure welding of the second gold bump of the second semiconductor chip is done under normal temperature into the hole-like electrode of the first semiconductor chip and the second semiconductor chip is stacked, the chip-stack can be performed under normal temperature. The chip after the second stage can be stacked in the state where there is no warp in the first stage chip, by this, and the quality and reliability of the semiconductor device (semiconductor package) can be improved.
摘要翻译：可以通过消除芯片翘曲和执行芯片堆叠来提高半导体器件的质量和可靠性。布线基板，经由布线基板上的第一金凸块连接的第一半导体芯片，经由第一半导体芯片上的第二金凸块堆叠的第二半导体芯片和密封体。第一金凸块连接到布线基板，通过第一金凸块的压焊进行加热和注入，在第一半导体芯片的孔状电极之后的常温下进行。由于通过第二半导体芯片的第二金凸块的压焊而进行的注入是在常温下进入第一半导体芯片的孔状电极而第二半导体芯片堆叠的，所以可以在常温下进行芯片堆叠。由此，可以在第一级芯片中没有翘曲的状态下堆叠第二级之后的芯片，并且可以提高半导体器件（半导体封装）的质量和可靠性。

10. 发明申请

US20090003591A1 Quantum Cryptographic Communication Method 审中-公开
标题翻译：量子密码通信方法
公开(公告)号：US20090003591A1
公开(公告)日：2009-01-01
申请号：US12224625
申请日：2007-02-15
申请人： Yumiko Murakami , Masaki Nakanishi , Shigeru Yamashita
发明人： Yumiko Murakami , Masaki Nakanishi , Shigeru Yamashita
IPC分类号： H04L9/00 , H04L9/28
CPC分类号： H04L9/0852
摘要： A sender (1) adds decoy photons to a secret photon having confidential information, then, subjects each photon to a different rotational manipulation, and passes the photons along a quantum channel (3) (S11 and S12). A receiver (2) receives those photons and then obtains information about the position of the decoy photons from the sender (1) through a classical channel (4). Using the information, the receiver (2) subjects each of the decoy and secret photons to a different rotational manipulation and transmits the photons in a rearranged order (S13 and S14). The receiver (1) obtains information about the position and manipulation quantities of the decoy photons from the receiver (2) and decodes the decoy photons. If the quantum state of the decoys is identical to their initial quantum state, the sender (1) determines that no eavesdropper (5) should be present (S15 and S16), cancels only the encryption of the secret photon performed by himself or herself in S12, and transmits the secret photon (S17). The receiver (2) cancels the encryption of the secret photon performed by himself or herself in S13 and thereby obtains the confidential information (S18). The present method can securely send quantum information as well as classical information such as key information, and also effectively detect eavesdropping.
摘要翻译：发送者（1）将诱饵光子添加到具有机密信息的秘密光子，然后使每个光子受到不同的旋转操纵，并沿着量子通道（3）传递光子（S11和S12）。接收器（2）接收那些光子，然后通过经典通道（4）获得关于来自发送器（1）的诱饵光子的位置的信息。使用该信息，接收机（2）使诱饵和秘密光子中的每一个进行不同的旋转操作，并以重新排列的顺序发送光子（S13和S14）。接收器（1）从接收器（2）获取关于诱饵光子的位置和操纵量的信息，并解码诱饵光子。如果诱饵的量子状态与其初始量子态相同，则发送者（1）确定不应存在窃听者（5）（S15和S16），仅取消本人自己执行的秘密光子的加密 S12，并发送秘密光子（S17）。接收机（2）在S13中抵消由自己执行的秘密光子的加密，从而获得机密信息（S18）。本方法可以安全地发送量子信息以及诸如密钥信息的经典信息，并且还有效地检测窃听。

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