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    • 7. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110220996A1
    • 2011-09-15
    • US12885031
    • 2010-09-17
    • Hiroyuki KUTSUKAKEKenji GomikawaYoshiko KatoNorihisa AraiTomoaki Hatano
    • Hiroyuki KUTSUKAKEKenji GomikawaYoshiko KatoNorihisa AraiTomoaki Hatano
    • H01L27/088H01L21/762
    • H01L27/11519H01L21/76229H01L27/11521H01L27/11526H01L27/11546
    • According to one embodiment, a semiconductor device includes a semiconductor substrate, an element isolation insulating film, a source layer, a drain layer, a gate electrode, a gate insulating film, a first punch-through stopper layer, and a second punch-through stopper layer. The semiconductor substrate is a first conductivity type. The element isolation insulating film divides an upper layer portion of the semiconductor substrate into a plurality of first active regions. The source layer and the drain layer are a second conductivity type and are formed in spaced to each other in an upper portion of each of the first active regions. The gate electrode is provided in a region directly above a channel region on the semiconductor substrate located between the source layer and the drain layer. The gate insulating film is provided between the semiconductor substrate and the gate electrode. The first punch-through stopper layer of the first conductivity type is formed in a region of the first active region directly below the source layer and the second punch-through stopper layer of the first conductivity type is formed in a region of the first active region directly below the drain layer. The first punch-through stopper layer and the second punch-through stopper layer each has an effective impurity concentration higher than the semiconductor substrate. The first punch-through stopper layer and the source layer are separated in the channel region. The second punch-through stopper layer and the drain layer are separated in the channel region.
    • 根据一个实施例,半导体器件包括半导体衬底,元件隔离绝缘膜,源极层,漏极层,栅电极,栅极绝缘膜,第一穿通阻挡层和第二穿通 塞层。 半导体衬底是第一导电类型。 元件隔离绝缘膜将半导体衬底的上层部分分成多个第一有源区。 源层和漏极层是第二导电类型,并且在每个第一有源区的上部彼此间隔开形成。 栅电极设置在位于源层和漏极层之间的半导体衬底上的沟道区的正上方的区域中。 栅极绝缘膜设置在半导体衬底和栅电极之间。 第一导电类型的第一穿通阻挡层形成在源极的正下方的第一有源区的区域中,并且第一导电类型的第二穿通阻挡层形成在第一有源区的区域中 直接在漏极层下面。 第一穿通阻止层和第二穿通阻止层各自具有高于半导体衬底的有效杂质浓度。 第一穿通阻止层和源极层在沟道区域中分离。 第二穿通阻止层和漏极层在沟道区域中分离。
    • 8. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08399953B2
    • 2013-03-19
    • US12885031
    • 2010-09-17
    • Hiroyuki KutsukakeKenji GomikawaYoshiko KatoNorihisa AraiTomoaki Hatano
    • Hiroyuki KutsukakeKenji GomikawaYoshiko KatoNorihisa AraiTomoaki Hatano
    • H01L29/00H01L29/167H01L21/336
    • H01L27/11519H01L21/76229H01L27/11521H01L27/11526H01L27/11546
    • A semiconductor device includes a semiconductor substrate, an element isolation insulating film dividing an upper portion of the substrate into a plurality of first active regions, a source layer and a drain layer, a gate electrode, a gate insulating film, a first punch-through stopper layer, and a second punch-through stopper layer. The source layer and the drain layer are formed in spaced to each other in an upper portion of each of the first active regions. The first punch-through stopper layer is formed in a region of the first active region directly below the source layer and the second punch-through stopper layer is formed in a region of the first active region directly below the drain layer. The first punch-through stopper layer and the second punch-through stopper layer each has an effective impurity concentration higher than the semiconductor substrate. The first punch-through stopper layer and the source layer are separated in the channel region. The second punch-through stopper layer and the drain layer are separated in the channel region.
    • 半导体器件包括半导体衬底,将衬底的上部分成多个第一有源区的元件隔离绝缘膜,源极层和漏极层,栅极电极,栅极绝缘膜,第一穿通 阻挡层和第二穿通止挡层。 源极层和漏极层在每个第一有源区域的上部彼此间隔开地形成。 第一穿通阻挡层形成在源层正下方的第一有源区的区域中,并且第二穿通阻挡层形成在漏极层正下方的第一有源区的区域中。 第一穿通阻止层和第二穿通阻止层各自具有高于半导体衬底的有效杂质浓度。 第一穿通阻止层和源极层在沟道区域中分离。 第二穿通阻止层和漏极层在沟道区域中分离。
    • 10. 发明授权
    • Non-volatile semiconductor memory device and depletion-type MOS transistor
    • 非易失性半导体存储器件和耗尽型MOS晶体管
    • US08093664B2
    • 2012-01-10
    • US12359643
    • 2009-01-26
    • Kenji GomikawaMitsuhiro Noguchi
    • Kenji GomikawaMitsuhiro Noguchi
    • H01L29/66
    • H01L29/7838H01L27/11526H01L27/11534
    • A peripheral circuit includes at least a first transistor. The first transistor comprises a gate electrode formed on a surface of a semiconductor layer via a gate insulating film. A channel region of a first conductivity type having a first impurity concentration is formed on a surface of the semiconductor layer directly below and in the vicinity of the gate electrode. A source-drain diffusion region of the first conductivity type is formed on the surface of the semiconductor layer to sandwich the gate electrode and has a second impurity concentration greater than the first impurity concentration. An overlapping region of the first conductivity type is formed on the surface of the semiconductor layer directly below the gate electrode where the channel region and the source-drain diffusion region overlap. The overlapping region has a third impurity concentration greater than the second impurity concentration.
    • 外围电路至少包括第一晶体管。 第一晶体管包括通过栅极绝缘膜形成在半导体层的表面上的栅电极。 具有第一杂质浓度的第一导电类型的沟道区形成在栅电极正下方和附近的半导体层的表面上。 第一导电类型的源极 - 漏极扩散区形成在半导体层的表面上以夹着栅电极,并且具有大于第一杂质浓度的第二杂质浓度。 第一导电类型的重叠区域形成在沟道区域和源极 - 漏极扩散区域重叠的栅电极正下方的半导体层的表面上。 重叠区域具有大于第二杂质浓度的第三杂质浓度。