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    • 5. 发明授权
    • Chamber for uniform heating of large area substrates
    • 用于均匀加热大面积基材的室
    • US07442900B2
    • 2008-10-28
    • US11396477
    • 2006-04-03
    • Makoto InagawaAkihiro Hosokawa
    • Makoto InagawaAkihiro Hosokawa
    • F27B5/14C23C16/00C23C16/54H01L21/324
    • H01L21/67109C23C16/54F27B17/0025
    • Embodiments of the present invention generally provide an apparatus for providing a uniform thermal profile to a plurality of large area substrates during thermal processing. In one embodiment, an apparatus for thermal processing large area substrates includes a chamber having a plurality of processing zones disposed therein that are coupled to a lift mechanism. The lift mechanism is adapted to vertically position the plurality of processing zones within the chamber. Each processing zone further includes an upper heated plate, a lower heated plate adapted to support a first substrate thereon and an unheated plate adapted to support a second substrate thereon, wherein the unheated plate is disposed between the upper and lower heated plates.
    • 本发明的实施例通常提供一种用于在热处理期间向多个大面积基板提供均匀热分布的装置。 在一个实施例中,用于热处理大面积基板的装置包括具有设置在其中的多个处理区域的室,其联接到升降机构。 提升机构适于将多个处理区域垂直地定位在室内。 每个处理区还包括上加热板,适于在其上支撑第一基板的下加热板和适于在其上支撑第二基板的未加热板,其中未加热板设置在上加热板和下加热板之间。
    • 8. 发明申请
    • Partially suspended rolling magnetron
    • 部分悬浮磁控管
    • US20070193881A1
    • 2007-08-23
    • US11347667
    • 2006-02-03
    • Makoto InagawaAkihiro HosokawaJohn White
    • Makoto InagawaAkihiro HosokawaJohn White
    • C23C14/00
    • H01J37/3408H01J37/3435H01J37/3455
    • A magnetron scanning and support mechanism in which the magnetron is partially supported from an overhead scanning mechanism through multiple springs coupled to different horizontal locations on the magnetron and partially supported from below at multiple locations on the target, on which it slides or rolls. In one embodiment, the yoke plate is continuous and uniform. In another embodiment, the magnetron's magnetic yoke is divided into two flexible yokes, for example, of complementary serpentine shape and each supporting magnets of respective polarity. The yokes separated by a gap sufficiently small that the two yokes are magnetically coupled. Each yoke has its own set of spring supports from above and rolling/sliding supports from below to allow the magnetron shape to conform to that of the target. Alternatively, narrow slots are formed in a unitary yoke.
    • 一种磁控管扫描和支撑机构,其中磁控管通过耦合到磁控管上的不同水平位置的多个弹簧部分地从顶部扫描机构支撑,并且在其上滑动或滚动的靶上的多个位置处从下方部分支撑。 在一个实施例中,轭板是连续且均匀的。 在另一个实施例中,磁控管的磁轭被分成两个柔性轭,例如互补的蛇形形状和各个极性的每个支撑磁体。 磁轭分开足够小的间隙,使得两个磁轭磁耦合。 每个轭具有其自己的一组弹簧支撑件,从上方起滚动/滑动支撑件,从而允许磁控管形状与靶材的形状一致。 或者,窄槽形成为单一轭。
    • 10. 发明申请
    • Electron beam welding of sputtering target tiles
    • 溅射靶砖的电子束焊接
    • US20060283705A1
    • 2006-12-21
    • US11245590
    • 2005-10-07
    • Yoshiaki TanaseAkihiro Hosokawa
    • Yoshiaki TanaseAkihiro Hosokawa
    • B23K26/20B23K15/00
    • B23K26/24B23K15/0093B23K15/06B23K20/122B23K20/129C23C14/3414
    • Embodiments of the invention provide a method of welding sputtering target tiles to form a large sputtering target. Embodiments of a sputtering target assembly with welded sputtering target tiles are also provided. In one embodiment, a method for welding sputtering target tiles in an electron beam welding chamber comprises providing strips or powder of sputtering target material on a pre-determined at least one interfacial line between at least two sputtering target tiles, that are yet to be placed, on a surface of support, placing the at least two sputtering target tiles side by side with edges of the at least two sputtering target tiles abutting and forming at least one interfacial line on top of the strips or powder of sputtering target material, pumping out the gas in the electron beam welding chamber, preheating the at least two sputtering target tiles and the strips or powder of sputtering target material to a pre-heat temperature less than the temperature at which the at least two target tiles begin to melt, undergo a change in physical state, or undergo substantial decomposition, and welding the at least two sputtering target tiles placed side by side into a large sputtering target.
    • 本发明的实施例提供了一种焊接溅射靶砖以形成大型溅射靶的方法。 还提供了具有焊接溅射靶瓦的溅射靶组件的实施例。 在一个实施例中,用于在电子束焊接室中焊接溅射靶瓦的方法包括在至少两个尚未被放置的溅射靶瓦之间的预定的至少一个界面线上提供溅射靶材料的条带或粉末 在支撑体的表面上,将至少两个溅射靶瓦并排放置在所述至少两个溅射靶瓷砖的边缘邻接并且在溅射靶材料的条或粉末的顶部上形成至少一个界面线,泵出 电子束焊接室中的气体,将至少两个溅射靶砖和溅射靶材料的条或粉末预热至小于至少两个靶砖开始熔化的温度的预热温度,经历 物理状态的变化或者经历显着的分解,并将至少两个并排放置的溅射靶砖焊接到大的溅射靶中。