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1. 发明授权

US07709795B2 Infrared sensor unit and process of fabricating the same 失效
标题翻译：红外传感器单元及其制造工艺
公开(公告)号：US07709795B2
公开(公告)日：2010-05-04
申请号：US12063850
申请日：2006-08-16
申请人： Hiroshi Yamanaka , Tsutomu Ichihara , Yoshifumi Watabe , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Yoichi Nishijima , Satoshi Hyodo
发明人： Hiroshi Yamanaka , Tsutomu Ichihara , Yoshifumi Watabe , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Yoichi Nishijima , Satoshi Hyodo
IPC分类号： G01J5/20
CPC分类号： G01J5/10 , G01J5/20 , H01L31/0284 , H01L31/103
摘要： An infrared sensor unit has a thermal infrared sensor and an associated semiconductor device commonly developed on a semiconductor substrate. A dielectric top layer covers the substrate to conceal the semiconductor device formed in the top surface of the substrate. The thermal infrared sensor carried on a sensor mount which is supported above the semiconductor device by means of a thermal insulation support. The sensor mount and the support are made of a porous material which is superimposed on top of the dielectric top layer.
摘要翻译：红外传感器单元具有通常在半导体衬底上显影的热红外传感器和相关的半导体器件。电介质顶层覆盖衬底以隐藏形成在衬底顶表面中的半导体器件。热红外传感器承载在通过绝热支撑件支撑在半导体器件上方的传感器座上。传感器支架和支撑件由多孔材料制成，该多孔材料叠加在电介质顶层的顶部。

2. 发明申请

US20090114819A1 INFRARED SENSOR UNIT AND PROCESS OF FABRICATING THE SAME 失效
标题翻译：红外传感器单元及其制造方法
公开(公告)号：US20090114819A1
公开(公告)日：2009-05-07
申请号：US12063850
申请日：2006-08-16
申请人： Hiroshi Yamanaka , Tsutomu Ichihara , Yoshifumi Watabe , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Yoichi Nishijima , Satoshi Hyodo
发明人： Hiroshi Yamanaka , Tsutomu Ichihara , Yoshifumi Watabe , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Yoichi Nishijima , Satoshi Hyodo
IPC分类号： H01L27/14 , H01L21/00
CPC分类号： G01J5/10 , G01J5/20 , H01L31/0284 , H01L31/103
摘要： An infrared sensor unit has a thermal infrared sensor and an associated semiconductor device commonly developed on a semiconductor substrate. A dielectric top layer covers the substrate to conceal the semiconductor device formed in the top surface of the substrate. The thermal infrared sensor carried on a sensor mount which is supported above the semiconductor device by means of a thermal insulation support. The sensor mount and the support are made of a porous material which is superimposed on top of the dielectric top layer.
摘要翻译：红外传感器单元具有通常在半导体衬底上显影的热红外传感器和相关的半导体器件。电介质顶层覆盖衬底以隐藏形成在衬底顶表面中的半导体器件。热红外传感器承载在通过绝热支撑件支撑在半导体器件上方的传感器座上。传感器支架和支撑件由多孔材料制成，该多孔材料叠加在电介质顶层的顶部。

3. 发明授权

US08097850B2 Infrared sensor 有权
标题翻译：红外传感器
公开(公告)号：US08097850B2
公开(公告)日：2012-01-17
申请号：US12302024
申请日：2007-05-23
申请人： Yuichi Uchida , Hiroshi Yamanaka , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Youichi Nishijima
发明人： Yuichi Uchida , Hiroshi Yamanaka , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Youichi Nishijima
IPC分类号： G01J5/20
CPC分类号： G01J5/10 , H01L27/14618 , H01L27/14625 , H01L27/14665 , H01L2924/0002 , H01L2924/00
摘要： To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.
摘要翻译：为了改善绝热性，热红外传感元件被承载在多孔材料的传感器座上，并且通过突出在基底上的锚固螺柱与衬底间隔开。传感器支架形成有一对共面梁，其上承载有从感测元件延伸的引线。引线和梁被固定到锚栓的上端以将感测元件保持在基板上方的预定高度处。梁和引线通过分子间粘附而彼此组合，使得感测元件以及传感器座可以一起被支撑到锚栓上。

4. 发明申请

US20100230595A1 INFRARED SENSOR 有权
标题翻译：红外传感器
公开(公告)号：US20100230595A1
公开(公告)日：2010-09-16
申请号：US12302024
申请日：2007-05-23
申请人： Yuichi Uchida , Hiroshi Yamanaka , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Youichi Nishijima
发明人： Yuichi Uchida , Hiroshi Yamanaka , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Youichi Nishijima
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/0224 , H01L31/09
CPC分类号： G01J5/10 , H01L27/14618 , H01L27/14625 , H01L27/14665 , H01L2924/0002 , H01L2924/00
摘要： To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.
摘要翻译：为了改善绝热性，热红外传感元件被承载在多孔材料的传感器座上，并且通过突出在基底上的锚固螺柱与衬底间隔开。传感器支架形成有一对共面梁，其上承载有从感测元件延伸的引线。引线和梁被固定到锚栓的上端以将感测元件保持在基板上方的预定高度处。梁和引线通过分子间粘附而彼此组合，使得感测元件以及传感器座可以一起被支撑到锚栓上。

5. 发明授权

US09478682B2 IR sensor package including a cover member and a sensor chip recessed into the package body 有权
标题翻译：红外传感器封装包括一个盖构件和一个嵌入封装体内的传感器芯片
公开(公告)号：US09478682B2
公开(公告)日：2016-10-25
申请号：US13806111
申请日：2011-06-23
申请人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
发明人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
IPC分类号： H01L31/0232 , H01L31/024 , G01J5/04 , G01J5/06 , G01J5/08 , G01J5/12
CPC分类号： H01L31/024 , G01J5/04 , G01J5/045 , G01J5/06 , G01J5/08 , G01J5/0806 , G01J5/0831 , G01J5/12 , H01L2924/0002 , H01L2924/00
摘要： The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
摘要翻译：红外线传感器包括：红外线传感器芯片，其中在半导体衬底的一个表面侧上排列有包括由热电堆形成的温度敏感部分的多个像素部分; 以及处理红外线传感器芯片的输出信号的IC芯片。一种包装体，包括并排设置红外线传感器芯片和IC芯片的封装主体，以及具有透射红外线的透镜并与封装主体气密结合的封装盖。该封装件设置有盖构件，该盖构件包括窗孔，红外线通过该孔穿过红外线传感器芯片，并使像素部之间的热接点和冷接点的温度变化量相等，由IC加热引起的温度变化芯片。

6. 发明申请

US20130093037A1 INFARED SENSOR 有权
标题翻译：感染传感器
公开(公告)号：US20130093037A1
公开(公告)日：2013-04-18
申请号：US13806111
申请日：2011-06-23
申请人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
发明人： Masao Kirihara , Hiroshi Yamanaka , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Mitsuhiko Ueda
IPC分类号： H01L31/024
CPC分类号： H01L31/024 , G01J5/04 , G01J5/045 , G01J5/06 , G01J5/08 , G01J5/0806 , G01J5/0831 , G01J5/12 , H01L2924/0002 , H01L2924/00
摘要： The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
摘要翻译：红外线传感器包括：红外线传感器芯片，其中在半导体衬底的一个表面侧上排列有包括由热电堆形成的温度敏感部分的多个像素部分; 以及处理红外线传感器芯片的输出信号的IC芯片。一种包装体，包括并排设置红外线传感器芯片和IC芯片的封装主体，以及具有透射红外线的透镜并与封装主体气密结合的封装盖。该封装件设置有盖构件，该盖构件包括窗孔，红外线通过该孔穿过红外线传感器芯片，并使像素部之间的热接点和冷接点的温度变化量相等，由IC加热引起的温度变化芯片。

7. 发明授权

US08254209B2 Acoustic wave sensor 失效
标题翻译：声波传感器
公开(公告)号：US08254209B2
公开(公告)日：2012-08-28
申请号：US11572588
申请日：2005-07-27
申请人： Hiroshi Yamanaka , Yoshifumi Watabe , Yoshiaki Honda , Kousaku Kitada , Hiroshi Kawada , Tomoo Ohtsuka , Kazuo Sawada , Hiromichi Goto
发明人： Hiroshi Yamanaka , Yoshifumi Watabe , Yoshiaki Honda , Kousaku Kitada , Hiroshi Kawada , Tomoo Ohtsuka , Kazuo Sawada , Hiromichi Goto
IPC分类号： G01S15/06
CPC分类号： G01H11/06 , B06B1/02 , G01L9/0025 , G01S3/808 , G01S7/524 , G01S7/526
摘要： In an acoustic wave sensor for detecting a distance to an object and an orientation where the object is located with using acoustic waves, an acoustic wave generating device generating an acoustic wave by applying thermal impact to the air with no mechanical vibration is used as a wave transmitting device, and an electric capacitance microphone converting variation of pressure due to acoustic wave to variation of an electric signal is used as each wave receiving device. Therefore, dead zone caused by reverberation component included in the acoustic wave transmitted from the wave transmitting device and dead zone caused by reverberation component included in wave receiving signals outputted from the wave receiving devices can be shortened and angular sensitivity of the acoustic wave sensor can be increased, in comparison with a conventional acoustic wave sensor using piezoelectric devices as the wave transmitting device and the wave receiving devices.
摘要翻译：在声波传感器中，通过使用声波来检测物体的距离和物体的位置的声波传感器，使用通过对机械振动对空气进行热冲击来产生声波的声波发生装置作为波作为每个波接收装置，使用将由声波引起的压力变化的电容麦克风变换为电信号的变化。因此，可以缩短由包含在从波形接收装置输出的波形接收信号中的由波发送装置发送的声波和由混响成分引起的死区所引起的混响分量造成的死区，并且能够使声波传感器的角度灵敏度与使用压电装置作为波发送装置和波接收装置的常规声波传感器相比增加。

8. 发明申请

US20080291784A1 Acoustic Wave Sensor 失效
标题翻译：声波传感器
公开(公告)号：US20080291784A1
公开(公告)日：2008-11-27
申请号：US11572588
申请日：2005-07-27
申请人： Hiroshi Yamanaka , Yoshifumi Watabe , Yoshiaki Honda , Kousaku Kitada , Hiroshi Kawada , Tomoo Ohtsuka , Kazuo Sawada , Hiromichi Goto
发明人： Hiroshi Yamanaka , Yoshifumi Watabe , Yoshiaki Honda , Kousaku Kitada , Hiroshi Kawada , Tomoo Ohtsuka , Kazuo Sawada , Hiromichi Goto
IPC分类号： G01S15/06
CPC分类号： G01H11/06 , B06B1/02 , G01L9/0025 , G01S3/808 , G01S7/524 , G01S7/526
摘要： In an acoustic wave sensor for detecting a distance to an object and an orientation where the object is located with using acoustic waves, an acoustic wave generating device generating an acoustic wave by applying thermal impact to the air with no mechanical vibration is used as a wave transmitting device, and an electric capacitance microphone converting variation of pressure due to acoustic wave to variation of an electric signal is used as each wave receiving device. Therefore, dead zone caused by reverberation component included in the acoustic wave transmitted from the wave transmitting device and dead zone caused by reverberation component included in wave receiving signals outputted from the wave receiving devices can be shortened and angular sensitivity of the acoustic wave sensor can be increased, in comparison with a conventional acoustic wave sensor using piezoelectric devices as the wave transmitting device and the wave receiving devices.
摘要翻译：在声波传感器中，通过使用声波来检测物体的距离和物体的位置的声波传感器，使用通过对机械振动对空气进行热冲击来产生声波的声波发生装置作为波作为每个波接收装置，使用将由声波引起的压力变化的电容麦克风变换为电信号的变化。因此，可以缩短由包含在从波形接收装置输出的波形接收信号中的由波发送装置发送的声波和由混响成分引起的死区所引起的混响分量造成的死区，并且能够使声波传感器的角度灵敏度与使用压电装置作为波发送装置和波接收装置的常规声波传感器相比增加。

9. 发明授权

US08609647B2 Nitrogen-containing spirocyclic compounds and pharmaceutical uses thereof 有权
标题翻译：含氮螺环化合物及其药物用途
公开(公告)号：US08609647B2
公开(公告)日：2013-12-17
申请号：US12847025
申请日：2010-07-30
申请人： Satoru Noji , Makoto Shiozaki , Tomoya Miura , Yoshinori Hara , Hiroshi Yamanaka , Katsuya Maeda , Akimi Hori , Masafumi Inoue , Yasunori Hase
发明人： Satoru Noji , Makoto Shiozaki , Tomoya Miura , Yoshinori Hara , Hiroshi Yamanaka , Katsuya Maeda , Akimi Hori , Masafumi Inoue , Yasunori Hase
IPC分类号： C07D487/04 , A61K31/519 , A61P19/02 , A61P37/00 , A61P17/06 , A61P27/04 , A61P29/00
CPC分类号： C07D487/10 , A61K31/437 , A61K31/438 , A61K31/519 , A61K31/55 , C07D471/10 , C07D519/00
摘要： A compound of the following general formula [I]: wherein each symbol has the same meaning as defined herein, or a pharmaceutically acceptable salt thereof, or a solvate thereof, and a pharmaceutical use of the same in treating organ transplant rejection, graft versus host reaction after transplantation, autoimmune disease, allergic disease and chronic myeloproliferative disease.
摘要翻译：下列通式[I]的化合物：其中每个符号具有如本文所定义的相同含义，或其药学上可接受的盐或其溶剂合物，以及其用于治疗器官移植排斥，移植物抗宿主移植后反应，自身免疫性疾病，过敏性疾病和慢性骨髓增生性疾病。

10. 发明授权

US06340923B1 High frequency relay 失效
标题翻译：高频继电器
公开(公告)号：US06340923B1
公开(公告)日：2002-01-22
申请号：US09739774
申请日：2000-12-20
申请人： Hiroshi Yamanaka , Toshiyuki Suzuki , Kazunobu Nakata
发明人： Hiroshi Yamanaka , Toshiyuki Suzuki , Kazunobu Nakata
IPC分类号： H01H5300
CPC分类号： H01H50/10 , H01H50/14 , H01H50/54 , H01H51/2272
摘要： A high frequency relay comprises a contact base block having pairs of fixed contacts, contact members with movable contacts, and an electromagnet for moving the contact members to open and close the fixed contacts by the movable contacts. The contact base block comprises an injection-molded base having projections on its front surface, first metal films formed as the fixed contacts on top surfaces of the projections, second metal films formed as connection terminals for outside devices on a rear surface of the base, each of which corresponds to one of the first metal films, through holes each having a conductive material on its inner surface to make an electrical connection between one of the first metal films and the corresponding second metal film in the shortest distance, and a third metal film formed on the base to provide electrical isolation from the first and second metal films, which works as electromagnetic shield as well as a ground.
摘要翻译：高频继电器包括具有成对的固定触点的触点基座，具有可动触点的触点构件，以及用于使触点构件移动以通过可动触点打开和闭合固定触点的电磁体。接触基块包括在其表面上具有突起的注射成型基底，在突起的顶表面上形成为固定触点的第一金属膜，形成在基底的后表面上的用于外部装置的连接端子的第二金属膜，每一个对应于第一金属膜中的一个，在其内表面上各自具有导电材料的通孔，以在最短距离内形成第一金属膜之一和相应的第二金属膜之间的电连接;以及第三金属形成在基底上的膜，以提供与第一和第二金属膜的电隔离，其作为电磁屏蔽以及地面。

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