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    • 6. 发明授权
    • Polishing apparatus and program thereof
    • 抛光装置及其程序
    • US08206197B2
    • 2012-06-26
    • US12596333
    • 2008-04-17
    • Hidetaka NakaoMasafumi InoueKoichi Takeda
    • Hidetaka NakaoMasafumi InoueKoichi Takeda
    • B24B49/00B24B1/00
    • H01L21/67219B24B37/042B24B37/345G05B19/41865G05B2219/32304G05B2219/45232H01L21/02074H01L21/67276Y02P90/20
    • A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42a, 42b, 42c, 42d) for cleaning the polishing object after polishing and a transport unit (44) for transporting the polishing object; a transport mechanism (50) for transporting the polishing object between the loading section (14), the polishing lines (20, 30) and the cleaning line (40); and a control section for controlling the polishing lines (20, 30), the cleaning line (40) and the transport mechanism (50). The control section determines a polishing start time in each of the first and second polishing lines (20, 30) based on a predicted polishing time in each of the first and second polishing lines (20, 30), a predicted transport time in the transport mechanism (50), a predicted cleaning time in the cleaning line (40) and a predicted cleaning start time to start cleaning by driving the transport unit (44) of the cleaning line (40).
    • 抛光装置包括用于放置其中容纳有多个抛光对象的盒(12)的装载部(14); 用于抛光抛光对象的第一抛光线(20)和第二抛光线(30); 清洁线(40),其具有用于清洁抛光后的抛光对象物的清洁机(42a,42b,42c,42d)和用于输送抛光对象物的输送单元(44) 用于在加载部分(14),抛光线(20,30)和清洁线(40)之间传送抛光对象的传送机构(50); 以及用于控制研磨线(20,30),清洁线(40)和输送机构(50)的控制部。 控制部分基于第一和第二研磨线(20,30)中的每一个中的预测的抛光时间来确定第一和第二抛光线(20,30)中的每一个中的抛光开始时间,运送中预测的运送时间 机构(50),清洁管线(40)中的预测清洁时间和通过驱动清洗管线(40)的输送单元(44)开始清洁的预测清洁开始时间。
    • 9. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US07270594B2
    • 2007-09-18
    • US11602336
    • 2006-11-21
    • Takuji HayamaMasafumi InoueKunihiko Sakurai
    • Takuji HayamaMasafumi InoueKunihiko Sakurai
    • B24B49/00
    • B24B47/22B24B37/30B24B49/16H01L21/30625
    • A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.
    • 抛光装置具有安装有研磨面(10)的研磨台(12)和用于将工件(W)压靠在研磨面(10)上的顶环(20)。 顶环(20)具有壳体(40)和可在壳体(40)中垂直移动以用于保持工件(W)的外周边缘的保持环(44)。 所述抛光装置包括可垂直移动所述顶环(20)的垂直移动机构,与所述顶环(20)一起可垂直移动的托架(28);可在垂直位置上调节的止动件(32),以防止所述顶环 支架(28)和用于检测止动件(32)和支架(28)之间的距离的传感器(36)。 抛光装置还包括控制单元(34),当保持环(44)与抛光表面(10)接触时,可操作以在垂直位置调节止动件(32),而壳体(40)的下表面 所述顶环(20)位于距所述研磨面(10)的预定高度处,使得所述止动件(32)与所述支架(28)之间的距离等于 在抛光时从抛光表面(10)的外壳(40)和预定的高度。
    • 10. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US07156719B2
    • 2007-01-02
    • US10530277
    • 2003-11-04
    • Takuji HayamaMasafumi InoueKunihiko Sakurai
    • Takuji HayamaMasafumi InoueKunihiko Sakurai
    • B24B49/00
    • B24B47/22B24B37/30B24B49/16H01L21/30625
    • A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located, at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.
    • 抛光装置具有安装有研磨面(10)的研磨台(12)和用于将工件(W)压靠在研磨面(10)上的顶环(20)。 顶环(20)具有壳体(40)和可在壳体(40)中垂直移动以用于保持工件(W)的外周边缘的保持环(44)。 所述抛光装置包括可垂直移动所述顶环(20)的垂直移动机构,与所述顶环(20)一起可垂直移动的托架(28);可在垂直位置上调节的止动件(32),以防止所述顶环 支架(28)和用于检测止动件(32)和支架(28)之间的距离的传感器(36)。 抛光装置还包括控制单元(34),当保持环(44)与抛光表面(10)接触时,可操作以在垂直位置调节止动件(32),而壳体(40)的下表面 所述顶环(20)的距离与所述抛光表面(10)的预定高度相对应,使得所述止动件(32)和所述支架(28)之间的距离等于 在抛光时来自抛光表面(10)的壳体(40)和预定高度。