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    • 2. 发明授权
    • Molded products for high voltage apparatus comprising brominated epoxy
resins
    • 包含溴化环氧树脂的高压设备的成型产品
    • US5880179A
    • 1999-03-09
    • US774068
    • 1996-12-23
    • Hiromi ItoTakumi KikuchiHirofumi FujiokaHirozoh KanegaeYoshifumi ItabashiFumio Nogami
    • Hiromi ItoTakumi KikuchiHirofumi FujiokaHirozoh KanegaeYoshifumi ItabashiFumio Nogami
    • B29C39/10B29K63/00B29L31/34C08G59/20C08G59/22C08G59/24C08G59/26C08G59/30C08G59/40C08G59/42C08K3/22C08K3/36C08K5/5415C08K5/56C08L63/00H01B3/40C08L63/02H01F27/30H02K1/04
    • H01B3/40C08G59/226C08G59/245C08G59/26C08G59/30C08G59/42C08L63/00
    • "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.
    • “包含环氧树脂(A),酸酐(B),固化促进剂(C),至少一种偶联剂(D)和填料(E))的成型用环氧树脂组合物的高压设备用成型体 )。 环氧树脂(A)是双官能溴化双酚A或溴化双酚F“环氧树脂和至少一种双酚A,双酚F或双酚环氧树脂”。 偶联剂(D)选自环氧硅烷型偶联剂,苯基氨基硅烷型偶联剂,巯基硅烷型偶联剂和钛酸酯型偶联剂,其平均粒径不大于60μm,其中 直径不大于5μm的颗粒的含量不小于5重量%。 填料(E)包括二氧化硅填料或氧化铝填料中的至少一种。 酸酐(B)的酸酐基与环氧树脂(A)的环氧基数的比例为0.5〜1.5; 相对于100重量份的环氧树脂(A),固化促进剂(C)的使用量为0.5〜10重量份。 相对于100重量份的填料(E),偶联剂(D)的量为0.05〜5重量份。 填料(E)的含量为树脂组合物的35〜95重量%。 环氧树脂组合物具有优异的机械强度和韧性等机械性能,耐热性优异。
    • 8. 发明授权
    • Molding apparatus and method in which a mold cavity gasket is deformed
by separately applied pressure
    • 其中模腔衬垫由分开施加的压力变形的成型设备和方法
    • US5597523A
    • 1997-01-28
    • US292269
    • 1994-08-18
    • Kunito SakaiKazuharu OshioHirozoh Kanegae
    • Kunito SakaiKazuharu OshioHirozoh Kanegae
    • B29C45/26B29C45/02B29C45/14
    • H02K15/12B29C45/2608
    • A molding apparatus having an upper mold, a lower mold, and a cylindrical mold cavity defined between the upper mold and the lower mold and adapted to receive a molding material such as epoxy resin. An annular recess is defined in the lower mold adjacent to the mold cavity. A gasket is fit in the recess and made of lead. An oil passage is defined in the lower mold. Silicon oil as a pressure medium is fed to the recess through the oil passage so as to press the gasket against the upper mold. Then, the gasket is deformed to form a seal around a portion of the mold cavity where the upper and lower molds mate with one another. An annular spacer is placed in the bottom of the recess. An annular groove is defined below and along the bottom of the recess so as to allow the silicon oil to flow below and along the annular spacer, whereby sufficient pressure is exerted uniformly on the gasket to cause deformation of the gasket.
    • 一种具有上模具,下模具和限定在上模具和下模具之间并适于容纳诸如环氧树脂的模制材料的圆柱形模腔的模制设备。 在下模中限定了与模腔相邻的环形凹部。 凹槽内装有垫圈,由铅制成。 油通道限定在下模具中。 作为压力介质的硅油通过油路供给到凹部,以将垫圈压靠在上模上。 然后,垫圈变形以在模具腔的一部分周围形成密封,其中上模和下模相互配合。 环形间隔件放置在凹槽的底部。 在凹槽的下方并沿着凹部的底部限定环形槽,以便允许硅油沿着环形间隔件流动并沿着环形间隔件流动,从而在垫圈上均匀地施加足够的压力以引起垫圈的变形。