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1. 发明授权

US07873205B2 Apparatus and method for classifying defects using multiple classification modules 有权
标题翻译：使用多个分类模块分类缺陷的装置和方法
公开(公告)号：US07873205B2
公开(公告)日：2011-01-18
申请号：US10809464
申请日：2004-03-26
申请人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda , Atsushi Miyamoto , Takehiro Hirai
发明人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda , Atsushi Miyamoto , Takehiro Hirai
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06K9/6277 , G06K9/6292 , G06T2207/30141 , G06T2207/30148
摘要： A classification model optimum for realization of a defect classification request by a user is not known by the user. Then, the user sets a classification model which is not necessarily suitable and makes classification, resulting in degradation in classification performance. Therefore, the present invention automatically generates plural potential classification models and combines class likelihoods calculated from the plural classification models to classify. To combine, an index about the adequacy of each model, in other words, an index indicating a reliable level of likelihood calculated from the each potential classification model, is also calculated. Considering the calculated result, the class likelihoods calculated from the plural classification models are combined to execute classification.
摘要翻译：用户实现缺陷分类请求最优的分类模型是用户不知道的。然后，用户设置不一定适合的分类模型，进行分类，导致分类性能下降。因此，本发明自动生成多个潜在分类模型，并且将从多个分类模型计算出的类似度进行分类。为了组合，还计算了关于每个模型的充分性的指数，换句话说，表示从每个潜在分类模型计算的可靠的似然水平的指数。考虑到计算结果，将从多个分类模型计算的类似度组合起来进行分类。

2. 发明授权

US07583832B2 Method and its apparatus for classifying defects 有权
标题翻译：分类缺陷的方法及其设备
公开(公告)号：US07583832B2
公开(公告)日：2009-09-01
申请号：US10378016
申请日：2003-02-28
申请人： Hirohito Okuda , Toshifumi Honda , Yuji Takagi , Atsushi Miyamoto
发明人： Hirohito Okuda , Toshifumi Honda , Yuji Takagi , Atsushi Miyamoto
IPC分类号： G06K9/00 , G06K9/62 , H04N9/47
CPC分类号： G06T7/001
摘要： A highly reliable defect automatic classifying method and apparatus capable of flexibly coping with a request for classifying a defect given by each user without having to collect lots of teach data items. A classifying class arrangement is defined by a user by combining classes supplied by the system itself or classes defined by the user and, further, a priori knowledge on the defect class is given by the user as a restriction so as to carry out restricted learning.
摘要翻译：一种高度可靠的缺陷自动分类方法和装置，其能够灵活地应对用于分类每个用户给出的缺陷的请求，而不需要收集大量的教学数据项。分类类安排由用户通过组合由系统本身提供的类或由用户定义的类来定义，此外，由用户给出缺陷类的先验知识作为限制，以便进行有限的学习。

3. 发明授权

US07602962B2 Method of classifying defects using multiple inspection machines 失效
标题翻译：使用多台检测机分类缺陷的方法
公开(公告)号：US07602962B2
公开(公告)日：2009-10-13
申请号：US10762091
申请日：2004-01-20
申请人： Atsushi Miyamoto , Hirohito Okuda , Toshifumi Honda , Yuji Takagi , Takashi Hiroi
发明人： Atsushi Miyamoto , Hirohito Okuda , Toshifumi Honda , Yuji Takagi , Takashi Hiroi
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06K9/6253 , G06T2207/30148
摘要： The present invention provides a method of classifying defects wherein defects are detected in a first inspection machine. The detected defects are then reviewed by a second inspection machine. A sampling rate for review by the second inspection machine is determined by a defect classifier in the first inspection machine.
摘要翻译：本发明提供了在第一检查机中检测到缺陷的缺陷分类方法。然后检测到的缺陷由第二台检查机检查。由第二检查机检查的采样率由第一检查机中的缺陷分类器确定。

4. 发明申请

US20050121612A1 Defect inspection apparatus and defect inspection method 有权
公开(公告)号：US20050121612A1
公开(公告)日：2005-06-09
申请号：US11042021
申请日：2005-01-24
申请人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
发明人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
IPC分类号： G01N23/225 , G06T1/00 , H01L21/66 , G21K7/00 , G01N23/00
CPC分类号： G06T7/0004 , G01N23/225
摘要： An apparatus and a method for automatically inspecting a defect by an electron beam using an X-ray detector. The composition of a defective portion is analyzed with higher rapidity and the cause of the defect is easily and accurately determined based on an X-ray spectrum. The X-ray spectrum and the image of foreign particles formed on a process QC wafer are registered as reference data, and the defects generated on a process wafer are classified by collation with the reference data. The use of both the X-ray spectrum and the detected image optimizes the operating conditions for X-ray detection. A defect of which the X ray is to be detected is selected based on the result of classification of defect images automatically collected, and the defect is classified according to the features including both the composition and the external appearance.

5. 发明授权

US07205555B2 Defect inspection apparatus and defect inspection method 有权
标题翻译：缺陷检查装置和缺陷检查方法
公开(公告)号：US07205555B2
公开(公告)日：2007-04-17
申请号：US11042021
申请日：2005-01-24
申请人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
发明人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
IPC分类号： H01J37/153 , G01N23/00 , G21K7/00
CPC分类号： G06T7/0004 , G01N23/225
摘要： An apparatus and a method for automatically inspecting a defect by an electron beam using an X-ray detector. The composition of a defective portion is analyzed with higher rapidity and the cause of the defect is easily and accurately determined based on an X-ray spectrum. The X-ray spectrum and the image of foreign particles formed on a process QC wafer are registered as reference data, and the defects generated on a process wafer are classified by collation with the reference data. The use of both the X-ray spectrum and the detected image optimizes the operating conditions for X-ray detection. A defect of which the X ray is to be detected is selected based on the result of classification of defect images automatically collected, and the defect is classified according to the features including both the composition and the external appearance.
摘要翻译：使用X射线检测器通过电子束自动检查缺陷的装置和方法。以更高的速度分析缺陷部分的组成，并且基于X射线光谱容易且准确地确定缺陷的原因。将X射线光谱和在过程QC晶片上形成的异物的图像作为参考数据进行登记，并且通过与参考数据进行核对对在处理晶片上产生的缺陷进行分类。使用X射线光谱和检测到的图像优化用于X射线检测的操作条件。基于自动收集的缺陷图像的分类结果来选择要检测X射线的缺陷，并且根据包括组成和外观的特征对缺陷进行分类。

6. 发明授权

US07170593B2 Method of reviewing detected defects 有权
标题翻译：检查检测到的缺陷的方法
公开(公告)号：US07170593B2
公开(公告)日：2007-01-30
申请号：US11248697
申请日：2005-10-11
申请人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
发明人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
IPC分类号： G01N21/00 , G21K7/00
CPC分类号： G01N21/9501 , G01N21/956
摘要： A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract a defect area.
摘要翻译：一种解决通常用于通过基于图案匹配计算差分图像来检测半导体缺陷的技术的问题的方法，其要求必须拾取参考图像以在区域中拾取检查位置的图像半导体图案没有周期性，导致低的生产量。检查位置的图像被划分为局部区域，每个局部区域与已经存储的图像的局部区域匹配，并且确定如此匹配的局部区域之间的差异来提取缺陷区域。

7. 发明授权

US06965429B2 Method of reviewing detected defects 有权
标题翻译：检查检测到的缺陷的方法
公开(公告)号：US06965429B2
公开(公告)日：2005-11-15
申请号：US10224087
申请日：2002-08-19
申请人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
发明人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
IPC分类号： G01B11/30 , G01N21/95 , G01N21/956 , G06T1/00 , H01L21/66 , G01N21/00
CPC分类号： G01N21/9501 , G01N21/956
摘要： A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract area.
摘要翻译：一种解决通常用于通过基于图案匹配计算差分图像来检测半导体缺陷的技术的问题的方法，其要求必须拾取参考图像以在区域中拾取检查位置的图像半导体图案没有周期性，导致低的生产量。检查位置的图像被划分为局部区域，每个局部区域与已经存储的图像的局部区域匹配，并且确定如此匹配的局部区域之间的差异来提取区域。

8. 发明授权

US06855930B2 Defect inspection apparatus and defect inspection method 有权
标题翻译：缺陷检查装置和缺陷检查方法
公开(公告)号：US06855930B2
公开(公告)日：2005-02-15
申请号：US10256585
申请日：2002-09-27
申请人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
发明人： Hirohito Okuda , Yuji Takagi , Toshifumi Honda
IPC分类号： G01N23/225 , G06T1/00 , H01L21/66 , G01N23/00
CPC分类号： G06T7/0004 , G01N23/225
摘要： An apparatus and a method for automatically inspecting a defect by an electron beam using an X-ray detector. The composition of a defective portion is analyzed with higher rapidity and the cause of the defect is easily and accurately determined based on an X-ray spectrum. The X-ray spectrum and the image of foreign particles formed on a process QC wafer are registered as reference data, and the defects generated on a process wafer are classified by collation with the reference data. The use of both the X-ray spectrum and the detected image optimizes the operating conditions for X-ray detection. A defect of which the X ray is to be detected is selected based on the result of classification of defect images automatically collected, and the defect is classified according to the features including both the composition and the external appearance.
摘要翻译：使用X射线检测器通过电子束自动检查缺陷的装置和方法。以更高的速度分析缺陷部分的组成，并且基于X射线光谱容易且准确地确定缺陷的原因。将X射线光谱和在过程QC晶片上形成的异物的图像作为参考数据进行登记，并且通过与参考数据进行核对对在处理晶片上产生的缺陷进行分类。使用X射线光谱和检测到的图像优化用于X射线检测的操作条件。基于自动收集的缺陷图像的分类结果来选择要检测X射线的缺陷，并且根据包括组成和外观的特征对缺陷进行分类。

9. 发明授权

US06622054B1 Method monitoring a quality of electronic circuits and its manufacturing condition and system for it 失效
标题翻译：监控电子电路质量的方法及其制造条件和系统
公开(公告)号：US06622054B1
公开(公告)日：2003-09-16
申请号：US09413468
申请日：1999-10-06
申请人： Hirohito Okuda , Toshifumi Honda , Hisae Yamamura , Yuji Takagi , Hideaki Doi , Shigeshi Yoshinaga
发明人： Hirohito Okuda , Toshifumi Honda , Hisae Yamamura , Yuji Takagi , Hideaki Doi , Shigeshi Yoshinaga
IPC分类号： G05B1302
CPC分类号： G05B19/41875 , G05B23/0216 , G05B23/024 , G05B2219/37572 , G05B2219/45029 , H05K1/0269 , H05K3/0005 , H05K3/3484 , Y02P90/04 , Y02P90/22
摘要： With a view to providing a monitoring system for the quality and manufacturing conditions of electronic circuits capable of facilitating the grasping of correlation's between diverse manufacturing conditions and manufacturing states, statistically characteristic images are selected out of a group of images retrieved from a detection information database by specifying at least one out of the values of feature quantities, design information and manufacturing conditions, and are displayed.
摘要翻译：为了提供电子电路的质量和制造条件的监测系统，能够便于掌握不同的制造条件和制造状态之间的相关性，从通过检测信息数据库检索的一组图像中选出统计特征图像指定特征量，设计信息和制造条件的值中的至少一个，并且被显示。

10. 发明申请

US20060038986A1 Method of reviewing detected defects 有权
公开(公告)号：US20060038986A1
公开(公告)日：2006-02-23
申请号：US11248697
申请日：2005-10-11
申请人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
发明人： Toshifumi Honda , Yuji Takagi , Hirohito Okuda
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/956
摘要： A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract a defect area.

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