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1. 发明授权

US5443932A Exposure method 失效
标题翻译：曝光方法
公开(公告)号：US5443932A
公开(公告)日：1995-08-22
申请号：US161099
申请日：1993-12-03
申请人： Hirohisa Ohta , Kunitaka Ozawa , Eigo Kawakami , Shunichi Uzawa
发明人： Hirohisa Ohta , Kunitaka Ozawa , Eigo Kawakami , Shunichi Uzawa
IPC分类号： G03F7/20 , G03F9/00 , H01L21/027 , H01L21/30
CPC分类号： G03F9/7023 , G03F7/201
摘要： An exposure method includes disposing a mask and a semiconductor wafer opposed to each other in a close proximity relation with respect to a Z-axis direction and printing a pattern of the mask on each of different shot areas of the semiconductor wafer in a step-and-repeat manner, with a predetermined exposure energy. In this method, the spacing between the mask and the wafer for the paralleling of them is made larger than the spacing therebetween as assumed at the time of mask-to-wafer alignment with respect to X-Y plane or the spacing between the mask and the wafer as assumed at the time of exposure of the wafer to the mask. After the paralleling of the mask and the wafer, the mask and the wafer are moved closer to each other in the Z-axis direction and alignment and exposure is performed. This ensures that the alignment and exposure are effected at an optimum spacing while, on the other hand, contact of the mask and the wafer at the time of paralleling is precluded.
摘要翻译：曝光方法包括以相对于Z轴方向彼此紧密相对的方式设置掩模和半导体晶片，并且在半导体晶片的不同照射区域的每一个上以均匀的方式印刷掩模的图案，并且以预定的曝光能量。在这种方法中，掩模和与它们并联的晶片之间的间隔被制成大于它们之间的间隔，如假设在相对于XY平面的掩模到晶片对准时或掩模和晶片之间的间隔如在晶片暴露于掩模时所假设的那样。在掩模和晶片平行之后，掩模和晶片在Z轴方向上彼此靠近移动，并进行对准和曝光。这确保了对准和曝光以最佳间隔进行，另一方面，阻止了并联时的掩模与晶片的接触。

2. 发明授权

US5008703A Exposure apparatus and control of the same 失效
标题翻译：曝光装置和控制相同
公开(公告)号：US5008703A
公开(公告)日：1991-04-16
申请号：US407434
申请日：1989-09-06
申请人： Eigo Kawakami , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa
发明人： Eigo Kawakami , Kunitaka Ozawa , Koji Uda , Isamu Shimoda , Shunichi Uzawa
IPC分类号： G03F7/20 , H01L21/027 , H01L21/30
CPC分类号： G03F7/7075 , G03F7/709
摘要： Exposure apparatus and control of the same, for exposing a semiconductor wafer to a mask with a predetermined radiation energy, for manufacture of semiconductor devices, is disclosed. During a time period in which the mask-to-wafer alignment or the exposure of the wafer to the mask is made, the operation of any other driving device that has no participation in the aligning operation or the exposure operation, is prohibited. This ensures high-precision pattern printing.

3. 发明授权

US5226523A Conveying apparatus and method of controlling the same 失效
标题翻译：输送装置及其控制方法
公开(公告)号：US5226523A
公开(公告)日：1993-07-13
申请号：US963517
申请日：1992-10-20
申请人： Eigo Kawakami , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Mitsutoshi Kuno , Kazunori Iwamoto , Takao Kariya
发明人： Eigo Kawakami , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Mitsutoshi Kuno , Kazunori Iwamoto , Takao Kariya
IPC分类号： G03F7/20 , G05B19/23
CPC分类号： G03F7/70741 , G03F7/7075 , G05B19/231
摘要： A conveying apparatus includes a plurality of position limiting devices provided along the direction of conveyance and a selecting device operable to select one of or those of the plurality of position limiting devices which are effective in view of a target position, before a start of conveyance. The selecting device is further operable to select, again, one of or those of the plurality of position limiting devices which are effective in view of the current position of an article being conveyed, after a start of conveyance.
摘要翻译：传送装置包括沿着传送方向设置的多个位置限制装置，以及选择装置，可操作以在开始传送之前选择在目标位置有效的多个位置限制装置中的一个或那些位置限制装置。选择装置还可操作以在开始运送之后再次选择多个位置限制装置中的一个或那些位置限制装置中的一个或那些位置限制装置，其在待传送物品的当前位置有效。

4. 发明授权

US5157700A Exposure apparatus for controlling intensity of exposure radiation 失效
标题翻译：用于控制接触辐射强度的曝光装置
公开(公告)号：US5157700A
公开(公告)日：1992-10-20
申请号：US401615
申请日：1989-08-31
申请人： Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
发明人： Hiroshi Kurosawa , Mitsuaki Amemiya , Shigeru Terashima , Koji Uda , Isamu Shimoda , Shunichi Uzawa , Kunitaka Ozawa , Makiko Mori , Ryuichi Ebinuma , Shinichi Hara , Nobutoshi Mizusawa , Eigo Kawakami
IPC分类号： G03F7/20
CPC分类号： G03F7/70691 , G03F7/70058 , G03F7/70091 , G03F7/702
摘要： An exposure apparatus usable with synchrotron radiation source wherein the synchrotron radiation is generated by electron injection into a ring. The exposure apparatus is to transfer a semiconductor element pattern of a mask onto a semiconductor wafer by the synchrotron radiation. The apparatus includes a shutter for controlling the exposure of the wafer. The shutter controls the exposure with the illuminance distribution on the wafer surface taken into account. The illuminance distribution is determined in response to the electron injection, and thereafter, the illuminance distribution is corrected in a predetermined manner. By this, the illuminance distribution data for controlling the shutter always correspond to the actual illuminance distribution. The entire shot areas of the semiconductor wafer are exposed with high precision.

5. 发明授权

US5142156A Alignment method for printing a pattern of an original onto different surface areas of a substrate 失效
标题翻译：一种将原始图案印在基板不同表面上的对准方法
公开(公告)号：US5142156A
公开(公告)日：1992-08-25
申请号：US588947
申请日：1990-09-27
申请人： Kunitaka Ozawa , Shunichi Uzawa , Hirohisa Ohta , Makiko Mori , Noriyuki Nose
发明人： Kunitaka Ozawa , Shunichi Uzawa , Hirohisa Ohta , Makiko Mori , Noriyuki Nose
IPC分类号： G03F7/20 , G03F9/00 , G05D3/12 , H01L21/027 , H01L21/30
CPC分类号： G03F7/70883 , G03F9/70
摘要： An alignment method for use in an exposure apparatus for printing a pattern of an original onto different surface areas of a substrate, the alignment method comprising the steps of: providing alignment marks around the pattern of the original and placing the original on an original supporting stage; providing a reference mark on an X-Y stage for supporting the substrate and being movable in X and Y directions, and moving the X-Y stage so as to place the reference mark at those positions, in sequence, which correspond to the alignment marks of the original, respectively, and which are preset in respect to a stage coordinate system; detecting, in sequence, positional errors of the alignment marks of the original with respect to the corresponding set positions, respectively, by using the reference mark and through the movement of the X-Y stage, wherein the positional errors are detected by use of positional error detectors which are provided to be associated with the alignment marks of the original, respectively; calculating a rotational error of the original with respect to the stage coordinate system, in .theta. direction, by using the positional errors; and rotationally moving the original supporting table in the .theta. direction so as to correct the rotational error.

6. 发明授权

US6018395A Alignment system 失效
标题翻译：校准系统
公开(公告)号：US6018395A
公开(公告)日：2000-01-25
申请号：US766928
申请日：1996-12-16
申请人： Makiko Mori , Shunichi Uzawa , Kunitaka Ozawa , Hirohisa Ohta , Noriyuki Nose
发明人： Makiko Mori , Shunichi Uzawa , Kunitaka Ozawa , Hirohisa Ohta , Noriyuki Nose
IPC分类号： G03F9/00 , G01B11/00
CPC分类号： G03F9/70
摘要： An alignment method useable with an original having a pattern and a substrate having a surface area on which the pattern of the original is printed. The alignment method comprises detecting plural marks, calculating plural times, the amount of rotational deviation on the basis of different combinations of marks, calculating the quantity of rotational correction of the original and the substrate by using the computed rotational deviations, and aligning on the basis of the calculated quantity of the rotational deviation.
摘要翻译：可用于具有图案的原稿的对准方法和具有印刷原稿图案的表面积的基板。对准方法包括基于不同的标记组合来检测多个标记，多次计算旋转偏差量，通过使用计算出的旋转偏差来计算原件和基板的旋转校正量，并基于的计算量的旋转偏差。

7. 发明授权

US5182615A Exposure apparatus 失效
标题翻译：曝光装置
公开(公告)号：US5182615A
公开(公告)日：1993-01-26
申请号：US563420
申请日：1990-08-07
申请人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
发明人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Nobutoshi Mizusawa , Shigeyuki Suda , Noriyuki Nose , Takao Kariya
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F7/70691 , G03F9/7049
摘要： An exposure apparatus for printing a pattern of a mask to a wafer includes a mask moving mechanism for moving the mask; a wafer moving mechanism or moving the wafer along a predetermined movement coordinate; a measuring system for measuring an error with respect to the movement coordinate, resulting from the movement of the mask by the mask moving mechanism; and a memorizing device for memorizing a data table prepared on the basis of the error measured by the measuring system; wherein the wafer moving mechanism uses the data in the data table when it moves the wafer for positioning of the wafer with respect to the mask.

8. 发明授权

US5112133A Alignment system 失效
标题翻译：对齐系统
公开(公告)号：US5112133A
公开(公告)日：1992-05-12
申请号：US769495
申请日：1991-10-01
申请人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Ryuichi Ebinuma , Takao Kariya
发明人： Hiroshi Kurosawa , Koji Uda , Kunitaka Ozawa , Shunichi Uzawa , Ryuichi Ebinuma , Takao Kariya
IPC分类号： G03F9/00 , H01L21/027 , H01L21/30 , H01L21/68
CPC分类号： G03F9/70 , H01L21/681 , H01L21/682 , Y10T307/786
摘要： An alignment system usable in an exposure apparatus for printing a pattern of a mask on a wafer, for aligning the mask and the wafer, is disclosed. The system includes a plurality of position detecting devices; a plurality of driving stages corresponding to the position detecting devices, respectively, each driving stage being adapted to move a corresponding one of the position detecting devices two-dimensionally along a plane which is substantially opposed to the mask; a plurality of contacts corresponding to the position detecting devices, respectively, each contact being provided at an end portion of a corresponding one of the position detecting devices, along the plane and facing the pattern side; a detecting device for detecting mutual approach of the position detecting devices through at least one of the contacts; and a control device for controlling movement of at least one of the driving stages in accordance with the detection by the detecting device.

9. 发明授权

US5566922A Gate valve device 失效
标题翻译：闸阀装置
公开(公告)号：US5566922A
公开(公告)日：1996-10-22
申请号：US481826
申请日：1995-06-07
申请人： Yutaka Tanaka , Kunitaka Ozawa , Takao Kariya , Shunichi Uzawa
发明人： Yutaka Tanaka , Kunitaka Ozawa , Takao Kariya , Shunichi Uzawa
IPC分类号： F16K3/18 , H01L21/027 , F16K25/00
CPC分类号： F16K3/188
摘要： A gate valve device which includes a partition wall having an opening, a valve member movable along the partition wall to open or close the opening, a driving system for moving the valve member, and a pressing mechanism for pressing the valve member toward the partition wall. The pressing mechanism has a pressing member projectable toward and retractable from the valve member, wherein the pressing mechanism presses the valve member against the partition wall when the valve member is in a position closing the opening.
摘要翻译：一种闸阀装置，包括具有开口的分隔壁，可沿着分隔壁移动以打开或关闭开口的阀构件，用于移动阀构件的驱动系统，以及用于将阀构件朝向分隔壁。按压机构具有可从阀构件朝向和伸出的按压构件，其中当阀构件处于关闭开口的位置时，按压机构将阀构件压靠在隔壁上。

10. 发明授权

US5498501A Exposure method 失效
标题翻译：曝光方法
公开(公告)号：US5498501A
公开(公告)日：1996-03-12
申请号：US416503
申请日：1995-04-04
申请人： Isamu Shimoda , Takao Kariya , Nobutoshi Mizusawa , Kunitaka Ozawa , Shunichi Uzawa
发明人： Isamu Shimoda , Takao Kariya , Nobutoshi Mizusawa , Kunitaka Ozawa , Shunichi Uzawa
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F7/70066 , G03F7/2022 , G03F7/7045 , Y10S438/949
摘要： A method of manufacturing of semiconductor devices, includes exposing different portions of a semiconductor substrate with a first exposure apparatus having a first exposure range; placing and aligning the semiconductor substrate with respect to a second exposure range of a second exposure apparatus, which range is larger than the first exposure range of the first exposure apparatus; detecting an alignment error of each of the portions of the semiconductor substrate as covered by the second exposure range of the second exposure apparatus; calculating an overall alignment error of those portions of the semiconductor substrate with respect to the entire second exposure range of the second exposure apparatus, on the basis of the detected alignment errors; and controlling the exposure operation of the second exposure apparatus on the basis of the calculated overall alignment error.
摘要翻译：一种半导体器件的制造方法，包括用具有第一曝光范围的第一曝光装置曝光半导体衬底的不同部分; 将半导体衬底相对于第二曝光装置的第二曝光范围放置和对准，该范围大于第一曝光装置的第一曝光范围; 检测由第二曝光装置的第二曝光范围所覆盖的半导体衬底的每个部分的对准误差; 基于检测到的对准误差，计算半导体衬底的这些部分相对于第二曝光装置的整个第二曝光范围的总体对准误差; 并根据计算的整体对准误差来控制第二曝光装置的曝光操作。

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