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    • 6. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20090256260A1
    • 2009-10-15
    • US12394911
    • 2009-02-27
    • Hirofumi Nakamura
    • Hirofumi Nakamura
    • H01L23/52H01L31/02H01L29/84
    • H01L27/14685H01L27/14618H01L27/14636H01L27/14683H01L2224/13
    • A semiconductor device including a semiconductor element and a functional member fixed thereto with an adhesive film is provided, where the performance or reliability degradation due to moisture entered by way of the adhesive film itself or the interfaces between the adhesive film and members adjacent thereto can be suppressed with a simple structure. The semiconductor element has an active region for realizing a predetermined function, formed on a surface of the element. The functional member has a predetermined function and is fixed on a surface side of the semiconductor element with the adhesive film. A metal film covers a region including at least all outer side faces of the semiconductor element, all outer side faces of the adhesive film, an interface between the adhesive film and the semiconductor element, and an interface between the adhesive film and the functional member.
    • 提供一种半导体器件,其包括具有粘合剂膜的半导体元件和固定到其上的功能元件,其中由于通过粘合剂膜本身进入的水分的性能或可靠性劣化或者粘合剂膜与其相邻的构件之间的界面可以是 用简单的结构抑制。 半导体元件具有用于实现形成在元件的表面上的预定功能的有源区域。 功能元件具有预定的功能,并用粘合剂膜固定在半导体元件的表面侧。 金属膜覆盖包括半导体元件的至少所有外侧面,粘合膜的所有外侧面,粘合膜和半导体元件之间的界面以及粘合膜和功能元件之间的界面的区域。