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1. 发明申请

US20120244970A1 BASEBALL 审中-公开
标题翻译：棒球
公开(公告)号：US20120244970A1
公开(公告)日：2012-09-27
申请号：US13425812
申请日：2012-03-21
申请人： Kazuhiro Kume , Takashi Ono , Yohei Yamashita
发明人： Kazuhiro Kume , Takashi Ono , Yohei Yamashita
IPC分类号： A63B37/02
CPC分类号： A63B37/02 , A63B37/0062 , A63B37/0065 , A63B37/0069 , A63B2102/18 , A63B2208/12
摘要： A baseball includes an inner core, and an outer layer covering the outer circumferential surface of the inner core. The inner core has a surface hardness of not less than 60 and not more than 80 in Asker C hardness, and has an elastic modulus of not less than 0.6 MPa and not more than 1.0 MPa. In this way, a baseball can be obtained which can achieve a trajectory comparable to that of a ball for hardball after hitting and which can achieve an impact force comparable to a ball for rubber-ball baseball.
摘要翻译：棒球包括内芯和覆盖内芯的外圆周表面的外层。内芯在Asker C硬度中的表面硬度不小于60且不大于80，弹性模量不低于0.6MPa且不大于1.0MPa。以这种方式，可以获得棒球，其可以实现与击球后的硬球的轨迹相当的轨迹，并且可以实现与用于橡胶球棒球的球相当的冲击力。

2. 发明申请

US20120178557A1 BASEBALL OR SOFTBALL BAT WITH MODIFIED RESTITUTION CHARACTERISTICS 有权
标题翻译：具有修改后的特性的BASEBALL或者SOFTBALL BAT
公开(公告)号：US20120178557A1
公开(公告)日：2012-07-12
申请号：US13345553
申请日：2012-01-06
申请人： Michiharu TSUKAMOTO , Yohei Yamashita , Toshiaki Kida , Kazuhiko Shindome , Chui Mei Or
发明人： Michiharu TSUKAMOTO , Yohei Yamashita , Toshiaki Kida , Kazuhiko Shindome , Chui Mei Or
IPC分类号： A63B59/06 , B32B37/12 , B32B38/00
CPC分类号： B29C49/44 , A63B59/50 , A63B2102/18 , A63B2102/182 , A63B2209/02 , A63B2209/10 , B29C63/28 , B29C63/34 , B29D22/00 , B29L2022/02 , B29L2031/52
摘要： A softball or baseball bat with modified restitution characteristics is provided. The bat can comprise a substantially rigid shell coupled with a single or multi-piece insert. The shell can comprise a tip end, a barrel, a handle taper, and a handle. The insert can be press-fit or adhered to the inside of the barrel of the shell. The insert can be a single or multi-piece design and can be single or multi-layered. The insert can comprise a material capable of impact absorption. Portions of the insert can be separated from the shell with a separation layer to improve restitution in certain areas of the bat. The insert can also comprise multiple layers that are separated from each other with a separation layer to improve restitution in certain areas of the bat. The material and thickness of the insert and the shell can be varied to meet applicable restitution requirements.
摘要翻译：提供了具有修复恢复特性的垒球或棒球棒。蝙蝠可以包括与单件或多件式插入件联接的基本上刚性的外壳。壳体可以包括尖端，筒，手柄锥形和手柄。插入件可以压配合或粘附到壳体的桶的内部。插入件可以是单件或多件式设计，可以是单层或多层。插入件可以包括能够冲击吸收的材料。插入物的一部分可以与具有分离层的壳分离，以改善蝙蝠的某些区域的恢复。插入物还可以包括多个层，其中分离层彼此分离，以改善蝙蝠的某些区域的恢复。插入件和外壳的材料和厚度可以变化，以满足适用的恢复要求。

3. 发明申请

US20070054498A1 Method for applying resin film to face of semiconductor wafer 有权
标题翻译：将树脂膜施加到半导体晶片的面上的方法
公开(公告)号：US20070054498A1
公开(公告)日：2007-03-08
申请号：US11514901
申请日：2006-09-05
申请人： Kentaro Iizuka , Takashi Sampei , Nobuyasu Kitahara , Yohei Yamashita
发明人： Kentaro Iizuka , Takashi Sampei , Nobuyasu Kitahara , Yohei Yamashita
IPC分类号： H01L21/31
CPC分类号： H01L21/6715 , Y10S438/906
摘要： A method for applying a resin film to the face of a semiconductor wafer, comprising: an assembly holding step of holding an assembly on the surface of chuck means, with the back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to the back of the frame and the back of the semiconductor wafer; a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto the face of the semiconductor wafer in the assembly after the assembly holding step; and a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer. The method further comprises a cleaning step of rotating the chuck means and also supplying a cleaning fluid to the surface of the frame after the spreading step, thereby cleaning the solution which has adhered to the surface of the frame.
摘要翻译：一种将树脂膜施加到半导体晶片的表面的方法，包括：组件保持步骤，其将组件保持在卡盘装置的表面上，其中组件的背面与卡盘装置的表面相对，组件包括具有形成在框架的中心部分中的安装开口的框架，以及通过将安装带粘贴到框架的后部和半导体晶片的背面而安装在框架的安装开口中的半导体晶片; 液滴供给步骤，在组装保持步骤之后，在组件中将溶解有树脂的溶液的液滴供给到半导体晶片的表面上; 以及随后在液滴供给步骤旋转卡盘装置的扩散步骤，从而使液滴在半导体晶片的整个表面上扩展。该方法还包括一个清洁步骤，用于旋转卡盘装置，并且在扩展步骤之后还将清洁流体提供给框架的表面，从而清洁粘附到框架表面的溶液。

4. 发明授权

US08882617B2 Baseball 有权
标题翻译：棒球
公开(公告)号：US08882617B2
公开(公告)日：2014-11-11
申请号：US13198205
申请日：2011-08-04
申请人： Kazuhiro Kume , Takashi Ono , Yohei Yamashita
发明人： Kazuhiro Kume , Takashi Ono , Yohei Yamashita
IPC分类号： A63B37/02
CPC分类号： A63B37/02 , A63B37/00 , A63B37/0045 , A63B37/0049 , A63B37/0061 , A63B37/0064 , A63B37/0069 , A63B37/0074 , A63B37/0075 , A63B37/0076 , A63B2102/18
摘要： There is provided a baseball including an inner core, and an outer core covering an outer circumferential surface of the inner core, the inner core being formed to have a dimension of 20% or more and 80% or less of an outer diameter of the inner core and the outer core of the baseball, and having a dynamic viscoelasticity loss coefficient (tan δ) of 0.3 or less, the outer core being formed to have a thickness of 10% or more and 40% or less of the outer diameter of the inner core and the outer core of the baseball, and having an elastic modulus of 1.5 MPa or less. As a result, there can be obtained a baseball that achieves a high level of safety when the baseball hits against a human body and achieves a hit distance equal to and longer than that of a ball for hardball.
摘要翻译：提供了一种棒状物，其包括内芯和覆盖内芯的外圆周表面的外芯，内芯形成为内径为外径的20％以上且80％以下的尺寸芯棒和棒芯的外芯，并且动态粘弹性损失系数（tanδ）为0.3以下，外芯形成为具有10％以上且40％以下的外径的厚度内芯和棒的外芯，弹性模量为1.5MPa以下。结果，可以获得当棒球撞击人体并达到等于并长于用于硬球的击球距离时能达到高安全性的棒球。

5. 发明授权

US07799700B2 Method for applying resin film to face of semiconductor wafer 有权
标题翻译：将树脂膜施加到半导体晶片的面上的方法
公开(公告)号：US07799700B2
公开(公告)日：2010-09-21
申请号：US11514901
申请日：2006-09-05
申请人： Kentaro Iizuka , Takashi Sampei , Nobuyasu Kitahara , Yohei Yamashita
发明人： Kentaro Iizuka , Takashi Sampei , Nobuyasu Kitahara , Yohei Yamashita
IPC分类号： H01L21/31 , H01L21/00
CPC分类号： H01L21/6715 , Y10S438/906
摘要： A method for applying a resin film to the face of a semiconductor wafer, comprising: an assembly holding step of holding an assembly on the surface of chuck means, with the back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to the back of the frame and the back of the semiconductor wafer; a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto the face of the semiconductor wafer in the assembly after the assembly holding step; and a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer. The method further comprises a cleaning step of rotating the chuck means and also supplying a cleaning fluid to the surface of the frame after the spreading step, thereby cleaning the solution which has adhered to the surface of the frame.
摘要翻译：一种将树脂膜施加到半导体晶片的表面的方法，包括：组件保持步骤，其将组件保持在卡盘装置的表面上，其中组件的背面与卡盘装置的表面相对，组件包括具有形成在框架的中心部分中的安装开口的框架，以及通过将安装带粘贴到框架的后部和半导体晶片的背面而安装在框架的安装开口中的半导体晶片; 液滴供给步骤，在组装保持步骤之后，在组件中将溶解有树脂的溶液的液滴供给到半导体晶片的表面上; 以及随后在液滴供给步骤旋转卡盘装置的扩散步骤，从而使液滴在半导体晶片的整个表面上扩展。该方法还包括一个清洁步骤，用于旋转卡盘装置，并且在扩展步骤之后还将清洁流体提供给框架的表面，从而清洁粘附到框架表面的溶液。

6. 发明申请

US20070293690A1 Process for Production of Azulene Derivatives and Intermediates for the Synthesis of the Same 审中-公开
标题翻译：用于合成薁衍生物和中间体的方法
公开(公告)号：US20070293690A1
公开(公告)日：2007-12-20
申请号：US11631634
申请日：2005-07-07
申请人： Hiroshi Tomiyama , Masayuki Yokota , Atsushi Noda , Yoshinori Kobayashi , Junko Ogasawara , Yasumasa Hayashi , Masatoshi Inakoshi , Hirofumi Nakamura , Tokuo Koide , Kenichiro Sakamoto , Yohei Yamashita , Akio Miyafuji , Takayuki Suzuki , Noriyuki Kawano , Junji Miyata , Masakazu Imamura , Takashi Sugane
发明人： Hiroshi Tomiyama , Masayuki Yokota , Atsushi Noda , Yoshinori Kobayashi , Junko Ogasawara , Yasumasa Hayashi , Masatoshi Inakoshi , Hirofumi Nakamura , Tokuo Koide , Kenichiro Sakamoto , Yohei Yamashita , Akio Miyafuji , Takayuki Suzuki , Noriyuki Kawano , Junji Miyata , Masakazu Imamura , Takashi Sugane
IPC分类号： C07D309/02
CPC分类号： C07C49/255 , C07C45/48 , C07C45/63 , C07C45/71 , C07C49/245 , C07H7/04 , C07H15/04
摘要： A process for producing an azulene derivative useful as a Na+-glucose cotransporter inhibitor, which is high in yield, is simple in operation, is low in cost, is suited for environmental protection, and is advantageous industrially, the process being characterized by reducing and deprotecting at least one compound selected from penta-acyl compounds and tetra-acyl compounds or salts thereof to obtain a C-glycoside compound; and a useful intermediate for synthesis of such an azulene derivative, obtained in the course of the above process.
摘要翻译：制备用作产率高的Na + + - 葡萄糖共转运蛋白抑制剂的薁衍生物的方法操作简单，成本低，适用于环境保护，在工业上有利该方法的特征在于将至少一种选自五酰基化合物和四酰基化合物或其盐的化合物还原和去保护以获得C-糖苷化合物; 以及在上述方法中获得的这种薁衍生物的合成的有用中间体。

7. 发明授权

US08814733B2 Baseball or softball bat with modified restitution characteristics 有权
标题翻译：棒球或垒球棒具有修正的恢复特征
公开(公告)号：US08814733B2
公开(公告)日：2014-08-26
申请号：US13345553
申请日：2012-01-06
申请人： Yohei Yamashita , Toshiaki Kida , Kazuhiko Shindome , Chui Mei Or
发明人： Michiharu Tsukamoto , Yohei Yamashita , Toshiaki Kida , Kazuhiko Shindome
IPC分类号： A63B59/06
CPC分类号： B29C49/44 , A63B59/50 , A63B2102/18 , A63B2102/182 , A63B2209/02 , A63B2209/10 , B29C63/28 , B29C63/34 , B29D22/00 , B29L2022/02 , B29L2031/52
摘要： A softball or baseball bat with modified restitution characteristics is provided. The bat can comprise a substantially rigid shell coupled with a single or multi-piece insert. The shell can comprise a tip end, a barrel, a handle taper, and a handle. The insert can be press-fit or adhered to the inside of the barrel of the shell. The insert can be a single or multi-piece design and can be single or multi-layered. The insert can comprise a material capable of impact absorption. Portions of the insert can be separated from the shell with a separation layer to improve restitution in certain areas of the bat. The insert can also comprise multiple layers that are separated from each other with a separation layer to improve restitution in certain areas of the bat. The material and thickness of the insert and the shell can be varied to meet applicable restitution requirements.
摘要翻译：提供了具有修复恢复特性的垒球或棒球棒。蝙蝠可以包括与单件或多件式插入件联接的基本上刚性的外壳。壳体可以包括尖端，筒，手柄锥形和手柄。插入件可以压配合或粘附到壳体的桶的内部。插入件可以是单件或多件式设计，可以是单层或多层。插入件可以包括能够冲击吸收的材料。插入物的一部分可以与具有分离层的壳分离，以改善蝙蝠的某些区域的恢复。插入物还可以包括多个层，其中分离层彼此分离，以改善蝙蝠的某些区域的恢复。插入件和外壳的材料和厚度可以变化，以满足适用的恢复要求。

8. 发明申请

US20120035008A1 BASEBALL 有权
标题翻译：棒球
公开(公告)号：US20120035008A1
公开(公告)日：2012-02-09
申请号：US13198205
申请日：2011-08-04
申请人： Kazuhiro Kume , Takashi Ono , Yohei Yamashita
发明人： Kazuhiro Kume , Takashi Ono , Yohei Yamashita
IPC分类号： A63B37/12
CPC分类号： A63B37/02 , A63B37/00 , A63B37/0045 , A63B37/0049 , A63B37/0061 , A63B37/0064 , A63B37/0069 , A63B37/0074 , A63B37/0075 , A63B37/0076 , A63B2102/18
摘要： There is provided a baseball including an inner core, and an outer core covering an outer circumferential surface of the inner core, the inner core being formed to have a dimension of 20% or more and 80% or less of an outer diameter of the inner core and the outer core of the baseball, and having a dynamic viscoelasticity loss coefficient (tanδ) of 0.3 or less, the outer core being formed to have a thickness of 10% or more and 40% or less of the outer diameter of the inner core and the outer core of the baseball, and having an elastic modulus of 1.5 MPa or less. As a result, there can be obtained a baseball that achieves a high level of safety when the baseball hits against a human body and achieves a hit distance equal to and longer than that of a ball for hardball.
摘要翻译：提供了一种棒状物，其包括内芯和覆盖内芯的外圆周表面的外芯，内芯形成为内径为外径的20％以上且80％以下的尺寸芯部和棒状的外芯，并且动态粘弹性损失系数（tanδ）为0.3以下，外芯形成为内侧的外径的10％以上且40％以下的厚度芯棒和棒芯的外芯，弹性模量为1.5MPa以下。结果，可以获得当棒球撞击人体并达到等于并长于用于硬球的击球距离时能达到高安全性的棒球。

9. 发明授权

US07713845B2 Laser processing method for wafer 有权
标题翻译：晶圆激光加工方法
公开(公告)号：US07713845B2
公开(公告)日：2010-05-11
申请号：US11901774
申请日：2007-09-19
申请人： Yukio Morishige , Kenji Asano , Yohei Yamashita
发明人： Yukio Morishige , Kenji Asano , Yohei Yamashita
IPC分类号： H01L21/00
CPC分类号： H01L21/6715 , B23K26/0006 , B23K26/009 , B23K26/1224 , B23K26/18 , B23K26/364 , B23K26/40 , B23K2103/172 , B23K2103/42 , B23K2103/50
摘要： A laser processing method for a wafer such that a laser beam is applied to a work surface of the wafer along a separation line formed on the work surface to thereby form a laser processed groove along the separation line on the work surface by ablation. The laser processing method includes a protective material coating step for coating the work surface of the wafer with a liquid protective material mainly containing a water-soluble silicone oil and a laser processed groove forming step for applying the laser beam to the work surface coated with the protective material along the separation line in the condition that the protective material has fluidity, thereby forming the laser processed groove along the separation line.
摘要翻译：一种用于晶片的激光加工方法，使得激光束沿着形成在工作表面上的分离线施加到晶片的工作表面，从而通过烧蚀在工作表面上沿分离线形成激光加工槽。激光加工方法包括用主要含有水溶性硅油的液体保护材料涂覆晶片的工作面的保护材料涂布工序和激光加工槽形成步骤，用于将激光束施加到涂覆有在保护材料具有流动性的条件下沿着分离线的保护材料，从而沿分离线形成激光加工槽。

10. 发明申请

US20080047408A1 Wafer dividing method 审中-公开
标题翻译：晶圆分割法
公开(公告)号：US20080047408A1
公开(公告)日：2008-02-28
申请号：US11892150
申请日：2007-08-20
申请人： Ryugo Oba , Hiroshi Morikazu , Kenji Furuta , Yohei Yamashita
发明人： Ryugo Oba , Hiroshi Morikazu , Kenji Furuta , Yohei Yamashita
IPC分类号： B26D3/00
CPC分类号： H01L21/78 , Y10T83/0524
摘要： A method of dividing a wafer having devices in areas sectioned by lattice pattern-like streets on the front surface and a metal layer formed on the rear surface along the streets, comprising the steps of cutting the wafer with a cutting blade from the front surface side along the streets to form a cut groove, leaving behind a remaining portion having a predetermined thickness from the rear surface; and applying a laser beam along the cut groove formed by the above cut groove forming step to cut the remaining portion and the metal layer.
摘要翻译：一种在前表面上由格子状街道划分的区域中的装置分割晶片的方法以及沿着街道形成在后表面上的金属层的方法，包括以下步骤：从前表面侧切割晶片沿着街道形成切割槽，从后表面留出具有预定厚度的剩余部分; 以及沿着由上述切槽形成步骤形成的切割槽施加激光束以切割剩余部分和金属层。

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