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1. 发明申请

US20090067323A1 Duplicate Transmission Path Switching Device 审中-公开
标题翻译：重复传输路径切换设备
公开(公告)号：US20090067323A1
公开(公告)日：2009-03-12
申请号：US11886644
申请日：2005-03-22
申请人： Hiroaki Matsushima , Eiichi Hayashi , Takaaki Morita
发明人： Hiroaki Matsushima , Eiichi Hayashi , Takaaki Morita
IPC分类号： G06F11/07
CPC分类号： H04L1/22 , H04L41/0663 , H04L41/0677
摘要： In switching by failure, no switching is performed when a packet of IP packet is lost or a packet has not arrived even when a predetermined time has elapsed, which are not recognized as a failure. There is provided a duplicate transmission path switching device for data packets having the same information configuration to a main transmission path and an auxiliary transmission path. The device includes a transmission failure monitoring unit for monitoring a transmission failure of the main transmission path; a switching receiving unit arranged at the downstream of the transmission failure monitoring unit capable of receiving a packet from the main transmission path during a normal mode, and switching to the auxiliary transmission path to acquire a packet from the auxiliary transmission path in a predetermined mode; and a switching command output unit used when the monitoring result shows that a transmission failure is present, for outputting a switching command capable of switching to the auxiliary transmission path before the transmission failure reaches the switching/receiving unit, to the switching/receiving unit.
摘要翻译：在通过故障切换时，即使经过了预定时间，也不会在IP分组丢失或分组未到达时进行切换，不能将其识别为故障。提供了具有与主传输路径和辅助传输路径相同的信息配置的数据分组的重复传输路径切换装置。该装置包括用于监视主传输路径的传输故障的传输故障监视单元; 一个切换接收单元，布置在传输故障监视单元的下游，能够在正常模式期间从主传输路径接收一个分组，并切换到辅助传输路径，以预定模式从辅助传输路径中获得分组; 以及切换命令输出单元，当监视结果表示存在传输故障时，用于在传输故障到达切换/接收单元之前输出能够切换到辅助传输路径的切换命令到切换/接收单元。

2. 发明授权

US07544537B2 Semiconductor IC-embedded substrate and method for manufacturing same 有权
标题翻译：半导体IC嵌入式基板及其制造方法
公开(公告)号：US07544537B2
公开(公告)日：2009-06-09
申请号：US11527829
申请日：2006-09-27
申请人： Kenichi Kawabata , Takaaki Morita
发明人： Kenichi Kawabata , Takaaki Morita
IPC分类号： H01L21/50 , H01L21/48
CPC分类号： H01L23/5389 , H01L21/568 , H01L21/6835 , H01L23/5383 , H01L23/5384 , H01L23/544 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2221/68368 , H01L2223/54473 , H01L2224/0401 , H01L2224/04105 , H01L2224/1134 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13171 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/83132 , H01L2224/83136 , H01L2224/92244 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H05K1/185 , H05K3/4652 , H05K2201/09518 , H05K2201/09563 , H05K2201/096 , H05K2201/09781 , H05K2201/09918 , H05K2201/10674 , H05K2203/016 , H05K2203/1469 , H05K2203/166 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor IC-embedded substrate suitable for embedding a semiconductor IC in which the electrode pitch is extremely narrow. The substrate comprises a semiconductor IC 120 in which stud bumps 121 are provided to the principal surface 120a, a first resin layer 111 for covering the principal surface 120a of the semiconductor IC 120, and a second resin layer 112 for covering the back surface 120b of the semiconductor IC 120. The stud bumps 121 of the semiconductor IC 120 protrude from the surface of the first resin layer 111. The method for causing the stud bumps 121 to protrude from the surface of the first resin layer 111 may involve using a wet blasting method to cause an overall reduction of the thickness of the first resin layer 111. The stud bumps 121 can thereby be properly uncovered even when the electrode pitch of the semiconductor IC 120 is narrow.
摘要翻译：适合于嵌入电极间距极窄的半导体IC的半导体IC嵌入式基板。基板包括半导体IC 120，其中将柱状凸块121设置在主表面120a上，第一树脂层111用于覆盖半导体IC 120的主表面120a，第二树脂层112用于覆盖半导体IC 120的背面120b 半导体IC 120的柱状突起121从第一树脂层111的表面突出。使柱状突起121从第一树脂层111的表面突出的方法可以涉及使用湿式喷砂导致第一树脂层111的厚度的总体减小的方法。即使当半导体IC 120的电极间距窄时，也可以适当地覆盖柱形突起121。

3. 发明申请

US20070119541A1 Multilayer circuit board and method for manufacturing the same 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US20070119541A1
公开(公告)日：2007-05-31
申请号：US11603884
申请日：2006-11-22
申请人： Kenichi Kawabata , Takaaki Morita
发明人： Kenichi Kawabata , Takaaki Morita
IPC分类号： B32B3/00
CPC分类号： H05K3/4652 , H01L23/49822 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/2518 , H01L2224/82039 , H01L2224/82047 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H05K1/185 , H05K3/0044 , H05K3/0058 , H05K3/4602 , H05K3/4682 , H05K3/4688 , H05K2201/0358 , H05K2201/09518 , H05K2201/09527 , H05K2201/09563 , H05K2203/0152 , H05K2203/025 , H05K2203/0554 , H05K2203/1105 , H05K2203/1476 , H05K2203/1572 , Y10T29/49128 , Y10T428/24917 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.
摘要翻译：多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140。芯层101和102的厚度为100μm或更小，由此整个板可以显着地变薄。此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

4. 发明授权

US08237059B2 Electronic component-embedded board and method of manufacturing the same 有权
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US08237059B2
公开(公告)日：2012-08-07
申请号：US12219355
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
IPC分类号： H05K1/16 , H05K1/18
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/16227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K3/4602 , H05K2201/068 , H05K2201/2009 , H05K2203/0169 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): α1
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作片100包括在近似矩形基板11的一个表面上的绝缘层21和31，以及嵌入在绝缘层21内的电子部件41和板状框架部件（部件）51，其中板状框架部件51 满足由下式（1）表示的关系：α1<α3和α2<α3。。。（1）安装在基板11上的电子部件41的未安装部分上。在该公式中，α1，α2和α3分别表示电子部件41的线性热膨胀系数（ppm / K），板类框架构件51和基板11，各个布线层或各绝缘层。

5. 发明申请

US20080211086A1 Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate 有权
标题翻译：电子部件的安装方法，电子部件嵌入基板的制造方法以及电子部件嵌入基板
公开(公告)号：US20080211086A1
公开(公告)日：2008-09-04
申请号：US11987262
申请日：2007-11-28
申请人： Takaaki Morita
发明人： Takaaki Morita
IPC分类号： H01L23/14 , H01L21/58
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L24/32 , H01L24/83 , H01L24/92 , H01L2224/04105 , H01L2224/24051 , H01L2224/24226 , H01L2224/2505 , H01L2224/2518 , H01L2224/32225 , H01L2224/48227 , H01L2224/73267 , H01L2224/75313 , H01L2224/82039 , H01L2224/82047 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/83209 , H01L2224/83856 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01037 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/351 , H01L2924/3511 , H05K1/185 , H05K3/303 , H05K3/305 , H05K3/4652 , H05K2201/10674 , H05K2203/0191 , H05K2203/074 , H05K2203/0776 , H05K2203/082 , H05K2203/1484 , Y02P70/613 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： There is disclosed a fixing method of an electronic component or the like in which when the electronic component and a resin layer are fixed, warp and bend of the electronic component can be inhibited. During manufacturing of a semiconductor-embedded substrate 200 in which a semiconductor device 220 is embedded, after the semiconductor device 220 is disposed on an unhardened resin layer 212, this device is stored in a container 31 of a pressurizing and heating unit 3, and the semiconductor device 220 is isotropically pressurized using an internal gas in the container 31 as a pressure medium, whereby the semiconductor device 220 is pressed to the unhardened resin layer 212, and the resin layer 212 is heated to harden. In consequence, the semiconductor device 220 is fixed and mounted on the resin layer 212 without being warped or bent.
摘要翻译：公开了电子部件等的固定方法，其中当电子部件和树脂层固定时，可以抑制电子部件的翘曲和翘曲。在其中嵌入半导体器件220的半导体嵌入式衬底200的制造期间，在将半导体器件220设置在未硬化树脂层212上之后，将该器件存储在加压和加热单元3的容器31中，并且半导体器件220使用容器31内的内部气体作为压力介质进行各向同性加压，由此将半导体器件220压到未硬化树脂层212上，并且加热树脂层212以使其硬化。因此，半导体器件220固定并安装在树脂层212上而不会翘曲或弯曲。

6. 发明申请

US20070297795A1 Bidirectional Optical Communication System 审中-公开
标题翻译：双向光通信系统
公开(公告)号：US20070297795A1
公开(公告)日：2007-12-27
申请号：US11666400
申请日：2004-11-15
申请人： Osamu Kinoshita , Seiichi Kawada , Takaaki Morita
发明人： Osamu Kinoshita , Seiichi Kawada , Takaaki Morita
IPC分类号： H04B10/24
CPC分类号： H04B10/032
摘要： A bidirectional optical communication system employing a living line and a standby line. One of a master unit and a slave unit has a photoswitch for switching between the living line and the standby line and the other has a photocoupler for collecting the living line and the standby line. When deterioration in communication state of the living line is detected on the side having the photoswitch, the photoswitch on that side is switched to use the standby line.
摘要翻译：一种采用生活线和备用线的双向光通信系统。主单元和从单元之一具有用于在生命线和备用线路之间切换的照明开关，另一个具有用于收集生命线和备用线路的光电耦合器。当在具有光开关的一侧检测到生命线的通信状态的恶化时，该侧的照明开关被切换为使用待机线。

7. 发明申请

US20050031849A1 Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring board 失效
标题翻译：复合电介质，复合电介质片，复合电介质膏，金属层复合电介质，布线板和多层布线板
公开(公告)号：US20050031849A1
公开(公告)日：2005-02-10
申请号：US10880568
申请日：2004-07-01
申请人： Kenichi Kawabata , Takaaki Morita
发明人： Kenichi Kawabata , Takaaki Morita
IPC分类号： C08L67/03 , B32B18/00 , C04B35/468 , C04B35/50 , C08G63/60 , C08K3/22 , C09K19/02 , C09K19/38 , G03C1/85 , H05K1/03 , H05K3/20 , H05K3/46
CPC分类号： C04B35/468 , C04B35/50 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3284 , C04B2235/5436 , C08G63/605 , C09K19/02 , C09K19/3809 , H05K1/0373 , H05K3/20 , H05K3/4626 , H05K2201/0141 , H05K2201/0145 , H05K2201/0209 , Y10T428/1095 , Y10T428/24917 , Y10T428/24926 , Y10T428/252
摘要： The composite dielectric of the present invention contains an aromatic liquid crystal polyester and a dielectric ceramic powder arranged in the aromatic liquid crystal polyester, wherein the dielectric ceramic powder exhibits a Q value greater than 650 at a frequency of 1 GHz by perturbation. A wiring board comprising a composite dielectric sheet made of a composite dielectric having such a characteristic exhibits a high dielectric constant and a low dielectric dissipation factor, thereby yielding less transmission loss, and thus can favorably be used in electronic instruments driven in high-frequency regions.
摘要翻译：本发明的复合电介质含有芳族液晶聚酯和布置在芳族液晶聚酯中的电介质陶瓷粉末，其中介电陶瓷粉末通过扰动在1GHz的频率下表现出大于650的Q值。包括由具有这种特性的复合电介质组成的复合电介质片的布线板具有高介电常数和低介电损耗因数，从而产生较少的传输损耗，因此可有利地用于在高频区驱动的电子仪器。

8. 发明授权

US08544167B2 Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate 有权
标题翻译：电子元件的集体安装方法和电子元件嵌入式基板的制造方法
公开(公告)号：US08544167B2
公开(公告)日：2013-10-01
申请号：US11987260
申请日：2007-11-28
申请人： Takaaki Morita
发明人： Takaaki Morita
IPC分类号： H05K3/30 , H05K3/20
CPC分类号： H01L24/83 , H01L21/6835 , H01L23/49822 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/25 , H01L24/75 , H01L24/82 , H01L2221/68345 , H01L2224/24011 , H01L2224/24225 , H01L2224/24226 , H01L2224/2518 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/75313 , H01L2224/82039 , H01L2224/83005 , H01L2224/83209 , H01L2224/83855 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01037 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/351 , H01L2924/3511 , H05K1/185 , H05K3/0044 , H05K3/4644 , H05K2201/10674 , H05K2203/025 , H05K2203/074 , H05K2203/1469 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , H01L2924/00 , H01L2924/01028 , H01L2924/3512
摘要： There is disclosed a collective mounting method of electronic components in which a plurality of electronic components can uniformly be pressed to an insulating layer in a short time in a case where the electronic components and a resin layer are fixed. To manufacture a semiconductor-embedded substrate 200 in which a plurality of semiconductor devices 220 are embedded, after disposing the plurality of semiconductor devices 220 on an unhardened resin layer 212, this is stored in a container 31 of a pressurizing and heating unit 3, the plurality of semiconductor devices 220 are simultaneously, collectively and isotropically pressurized by use of an internal gas in the container 31 as a pressure medium to simultaneously press the plurality of semiconductor devices 220 to the unhardened resin layer 212, and the resin layer 212 is heated and hardened. In consequence, the plurality of semiconductor devices 220 are collectively and uniformly fixed and mounted onto the resin layer 212 without being influenced by a state change of the resin layer 212.
摘要翻译：在电子部件和树脂层固定的情况下，公开了电子部件的集合安装方法，其中多个电子部件能够在短时间内均匀地被按压到绝缘层。为了制造其中嵌入有多个半导体器件220的半导体嵌入式衬底200，在将多个半导体器件220设置在未硬化树脂层212上之后，将其存储在加压和加热单元3的容器31中，多个半导体器件220通过使用容器31中的内部气体作为压力介质同时并且各向同性地加压，以将多个半导体器件220同时按压到未硬化的树脂层212，并且树脂层212被加热，并且硬化因此，多个半导体器件220被集中且均匀地固定并安装到树脂层212上，而不受树脂层212的状态变化的影响。

9. 发明申请

US20120285013A1 Electronic Component-Embedded Board and Method of Manufacturing the Same 审中-公开
标题翻译：电子元件嵌入式电路板及其制造方法
公开(公告)号：US20120285013A1
公开(公告)日：2012-11-15
申请号：US13533176
申请日：2012-06-26
申请人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Takaaki Morita , Kenichi Kawabata
IPC分类号： H05K3/30
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/16227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K3/4602 , H05K2201/068 , H05K2201/2009 , H05K2203/0169 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet includes insulating layers on one surface of an approximately rectangular substrate, and an electronic component and a plate-like frame member (member) embedded inside the insulating layer, wherein the plate-like frame member satisfying the relationship represented by the following formula (1): α1
摘要翻译：提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。工作表包括在近似矩形基板的一个表面上的绝缘层，以及嵌入在绝缘层内部的电子部件和板状框架部件（部件），其中满足由下列公式表示的关系的板状框架部件 1）：将α1<α3和α2<α3（1）安装在基板上的电子部件的未安装部分上。在该式中，α1，α2和α3分别表示电子部件，板状框架部件和基板，各个布线层或各绝缘层的线性热膨胀系数（ppm / K）。

10. 发明授权

US08188375B2 Multilayer circuit board and method for manufacturing the same 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US08188375B2
公开(公告)日：2012-05-29
申请号：US11603884
申请日：2006-11-22
申请人： Kenichi Kawabata , Takaaki Morita
发明人： Kenichi Kawabata , Takaaki Morita
IPC分类号： H05K1/16
CPC分类号： H05K3/4652 , H01L23/49822 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/2518 , H01L2224/82039 , H01L2224/82047 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H05K1/185 , H05K3/0044 , H05K3/0058 , H05K3/4602 , H05K3/4682 , H05K3/4688 , H05K2201/0358 , H05K2201/09518 , H05K2201/09527 , H05K2201/09563 , H05K2203/0152 , H05K2203/025 , H05K2203/0554 , H05K2203/1105 , H05K2203/1476 , H05K2203/1572 , Y10T29/49128 , Y10T428/24917 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.
摘要翻译：多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

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