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    • 3. 发明授权
    • Optical module and method of fabricating optical module
    • 光模块及其制造方法
    • US5909523A
    • 1999-06-01
    • US816934
    • 1997-03-14
    • Go SakainoKatsuhiko GotoToshitaka Aoyagi
    • Go SakainoKatsuhiko GotoToshitaka Aoyagi
    • G02B6/42G02B6/30
    • G02B6/4207G02B6/42G02B6/4204G02B6/4224H01L2224/48091
    • An optical module includes a substrate having an upper surface and a groove on the upper surface; an optical fiber having a core and an end facet, disposed in the groove of the substrate; an optical semiconductor device having an upper surface and a light interactive area on the upper surface optically coupled to the optical fiber; and a block having a side surface on which the optical semiconductor device is fixed and a lower surface perpendicular to the side surface. The optical semiconductor device is fixed onto the side surface of the block so that the distance from the light interactive area to the lower surface of the block is equal to the distance from the core of the optical fiber to the upper surface of the substrate; and the block is disposed on the substrate, with the lower surface contacting the upper surface of the substrate, so that the light interactive area is opposed to the end facet of the optical fiber. The core of the optical fiber and the light interactive area are accurately aligned with the surface of the substrate as a reference regardless of the thickness of the substrate, resulting in a high coupling efficiency between the optical fiber and the optical semiconductor device.
    • 光学模块包括在上表面上具有上表面和凹槽的基板; 具有芯和端面的光纤,设置在基板的槽中; 光学半导体器件,具有光学耦合到光纤的上表面上的上表面和光交互区域; 以及具有固定光半导体器件的侧表面和垂直于侧表面的下表面的块。 光学半导体器件被固定在块的侧表面上,使得从光交互区域到块的下表面的距离等于从光纤的芯到衬底的上表面的距离; 并且所述块设置在所述基板上,所述下表面接触所述基板的上表面,使得所述光交互区域与所述光纤的端面相对。 无论基板的厚度如何,光纤和光交互区域的核心与基板的表面精确对准,作为基准,导致光纤和光学半导体器件之间的高耦合效率。
    • 4. 发明授权
    • Integrated semiconductor laser producing light of different wavelengths
at respective active regions
    • 集成半导体激光器在相关活动区域生成不同波长的光
    • US5124279A
    • 1992-06-23
    • US607738
    • 1990-11-01
    • Katsuhiko Goto
    • Katsuhiko Goto
    • H01S5/00H01S5/40
    • H01S5/4031H01S5/4087Y10S148/095Y10S438/902
    • A method of making an integrated semiconductor laser on a common substrate including at least two active regions, each active region oscillating at a respective, different wavelength, including producing a precursor laser structure by successively growing on a semiconductor substrate a first conductivity type semiconductor first cladding layer, an active layer including at least one compound semiconductor quantum well layer sandwiched between compound semiconductor quantum barrier layers, and a second conductivity type semiconductor second cladding layer, the quantum barrier layers having a larger energy band gap than and including at least one more element than the quantum well layer, annealing the precursor structure including controlling at first and second spaced apart regions the diffusion of the at least one more element from the quantum barrier layers into the quantum well layer to produce first and second spaced apart active regions in the active layer having different effective lasing energy band gaps, and forming respective electrical contacts to the first and second cladding layers on opposite sides of each of the first and second active regions.
    • 一种在共同的衬底上制造集成半导体激光器的方法,该公共衬底包括至少两个有源区域,每个有源区域以相应的不同波长振荡,包括通过在半导体衬底上依次生长第一导电型半导体第一覆层 层,包括夹在化合物半导体量子势垒层和第二导电类型半导体第二包层之间的至少一个化合物半导体量子阱层的有源层,所述量子势垒层具有比包括至少一个以上元素的能带更大的能带隙 所述前体结构退火包括在第一和第二间隔开的区域处控制所述至少一个以上元件从所述量子势垒层扩散到所述量子阱层中以在所述活性物质中产生第一和第二间隔开的有源区域 层具有不同的效果 e激光能带隙,并且在第一和第二有源区域中的每一个的相对侧上的第一和第二覆层形成相应的电触点。
    • 5. 发明申请
    • Carrying system and processing equipment
    • 搬运系统及加工设备
    • US20070243075A1
    • 2007-10-18
    • US11783562
    • 2007-04-10
    • Akio HiroseKatsuhiko Goto
    • Akio HiroseKatsuhiko Goto
    • F04B49/00
    • F04B49/08B05B13/0221B05B13/0242B05B13/0431B25J9/0096
    • A carrying system includes first and second carrying machines each of which includes a holding unit, a base and a linkage having pivotally joined first and second links. The holding unit can be moved, by turning the second link relative to the first link which is turned relative to the base, along a substantially arc carrying route extending round the pedestal between a loading position and a processing position. The arc carrying route is closer to the pedestal with respect to an imaginary circle having its center on the pedestal and a radius corresponding to the distance between the pedestal and either of the loading position and the processing position.
    • 承载系统包括第一和第二搬运机器,每个承载机器包括保持单元,基座和具有枢转连接的第一和第二连杆的连杆。 可以通过相对于相对于基座转动的第一连杆转动第二连杆,沿着在装载位置和处理位置之间的基座延伸的基本上圆弧的运送路线来移动保持单元。 电弧携带路径相对于其在基座上的中心的假想圆更靠近基座,并且与基座与装载位置和处理位置中的任一个之间的距离相对应。