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    • 10. 发明授权
    • Semiconductor memory production system and semiconductor memory production method
    • 半导体存储器生产系统和半导体存储器生产方法
    • US06532182B2
    • 2003-03-11
    • US09811529
    • 2001-03-20
    • Sumio OgawaShinichi Hara
    • Sumio OgawaShinichi Hara
    • G11C700
    • H01L22/22H01L22/20H01L2924/0002Y02P90/10Y02P90/14H01L2924/00
    • A semiconductor memory production system is provided, capable of holding the data necessary for process analysis for each lot in chronological order using a small amount of information, and which enables production management based on data that has been stored previously without performing new measurements. The semiconductor memory production system comprises: an LSI tester 1 that tests semiconductor memory and outputs the addresses of memory cells for each chip and a pass/fail bitmap corresponding to these addresses, and a process defect estimating device 34 that extracts the bit addresses of fail bits from the bitmap, and determines replacement addresses of word lines and bit lines to be replaced by redundant word lines and redundant bit lines in the redundant memory section, and estimates process defects from statistical analysis of the distribution condition of each chip on each wafer. Through this estimated result, feedback to the manufacturing line/process step prevents from producing defects frequently.
    • 提供一种半导体存储器制造系统,其能够使用少量的信息按照时间顺序保存每个批次的处理分析所必需的数据,并且其能够基于先前已经存储的数据进行生产管理而不执行新的测量。 半导体存储器制造系统包括:LSI测试器1,其测试半导体存储器并输出每个芯片的存储单元的地址以及对应于这些地址的通过/失败位图;以及处理缺陷估计器34,其提取失败的位地址 并且确定要由冗余存储器部分中的冗余字线和冗余位线替换的字线和位线的替换地址,并且从每个晶片上每个芯片的分布条件的统计分析来估计处理缺陷。 通过这个估计结果,反馈到生产线/加工步骤防止频繁地产生缺陷。