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    • 5. 发明授权
    • Semiconductor device comprising gate electrode
    • 包括栅电极的半导体器件
    • US07564106B2
    • 2009-07-21
    • US11711726
    • 2007-02-28
    • Hideaki Fujiwara
    • Hideaki Fujiwara
    • H01L29/78
    • H01L21/28079H01L21/28035H01L21/823842H01L21/823857H01L21/823864
    • A semiconductor device capable of reducing a threshold voltage is obtained. The semiconductor device includes a pair of source/drain regions formed on the main surface of a semiconductor region to hold a channel region therebetween, and a gate electrode formed on the channel region through a gate insulating film and including a metal-containing layer arranged in the vicinity of an interface between the gate insulating film and the gate electrode, wherein the metal-containing layer is so formed in the form of dots as to partially cover the surface of the gate insulating film, and the average distance between dots forming the metal-containing layer is set to not more than a diameter of the dot of the metal-containing layer.
    • 获得能够降低阈值电压的半导体器件。 半导体器件包括形成在半导体区域的主表面上以保持其间的沟道区的一对源极/漏极区,以及通过栅极绝缘膜形成在沟道区上的栅极,并且包括含有金属的层 栅极绝缘膜和栅电极之间的界面附近,其中含金属层以点的形式形成为部分地覆盖栅极绝缘膜的表面,并且形成金属的点之间的平均距离 含有层被设定为不大于含金属层的点的直径。
    • 6. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20060267095A1
    • 2006-11-30
    • US11443152
    • 2006-05-31
    • Hideaki Fujiwara
    • Hideaki Fujiwara
    • H01L27/12
    • H01L21/823842
    • A semiconductor device capable of reducing deterioration of electron mobility while suppressing depletion of gate electrodes is provided. This semiconductor device includes a metal-containing layer so formed that at least either a first gate electrode or a second gate electrode partially covers a corresponding first or second gate insulating film and a semiconductor layer formed on the metal-containing layer to come into contact with a portion of the corresponding first or second gate insulating film not covered with the metal-containing layer. The first and second gate electrodes contain metals different from each other.
    • 提供能够减少电子迁移率劣化并抑制栅电极耗尽的半导体器件。 该半导体装置包括如此形成的含金属层,使得第一栅极电极或第二栅电极中的至少一个部分地覆盖相应的第一或第二栅极绝缘膜和形成在含金属层上的半导体层以与 相应的第一或第二栅绝缘膜的一部分未被含金属层覆盖。 第一和第二栅电极包含彼此不同的金属。
    • 7. 发明申请
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US20050260818A1
    • 2005-11-24
    • US11132197
    • 2005-05-19
    • Hideaki Fujiwara
    • Hideaki Fujiwara
    • H01L29/41H01L21/336H01L29/417H01L29/423H01L29/49H01L29/786
    • H01L29/66621H01L29/4908H01L29/66553H01L29/66772H01L29/78621H01L29/78636
    • A method for fabricating a semiconductor device includes:isolating a SOI layer on a buried oxide film with a pair of element isolation regions having a perpendicular sidewall; depositing a poly-crystal silicon layer on the isolated SOI layer; implanting a dopant into the poly-crystal silicon layer; depositing a silicon oxide film on the poly-crystal silicon layer; forming a recessed portion by selectively removing the silicon oxide film and the poly-crystal silicon layer in a gate bearing region and then selectively removing the SOI layer in the gate bearing region to a predetermined depth; forming a sidewall spacer on the side wall of the recessed portion; forming source and drain regions by allowing a dopant to diffuse from the poly-crystal silicon layer into the SOI layer; and forming a gate electrode by depositing a gate metal layer after a gate insulating film is formed on the bottom of the recessed portion.
    • 一种用于制造半导体器件的方法,包括:利用具有垂直侧壁的一对元件隔离区域在掩埋氧化膜上隔离SOI层; 在隔离的SOI层上沉积多晶硅层; 将掺杂剂注入到所述多晶硅层中; 在所述多晶硅层上沉积氧化硅膜; 通过选择性地去除栅极承载区域中的氧化硅膜和多晶硅层,然后选择性地将栅极承载区域中的SOI层去除到预定深度来形成凹陷部分; 在所述凹部的侧壁上形成侧壁间隔物; 通过使掺杂剂从多晶硅层扩散到SOI层中形成源区和漏区; 以及在凹陷部分的底部上形成栅极绝缘膜之后,通过沉积栅极金属层来形成栅电极。
    • 8. 发明授权
    • Transistor, transistor array and non-volatile semiconductor memory
    • 晶体管,晶体管阵列和非易失性半导体存储器
    • US06424002B1
    • 2002-07-23
    • US09063396
    • 1998-04-21
    • Sadao KondoKouichi YamadaHideaki Fujiwara
    • Sadao KondoKouichi YamadaHideaki Fujiwara
    • H01L29788
    • H01L27/11521G11C16/0458G11C16/0491G11C16/10G11C16/16G11C16/26H01L27/115
    • A memory cell in a simple structure having a long life, less variations in the structure and writing characteristic, and a higher operation speed, free from the problem of over-erasure, and permitting down-sizing is disclosed. Floating gate electrodes are arranged on a channel region with a gate insulating film therebetween. A control gate is formed on the floating gate electrodes with a tunnel insulating film therebetween. A central part of the control gate electrode is provided on the channel region to form a select gate. Source/drain regions having the select gate therebetween and the select gate form a select transistor. The coupling capacitance between each of the floating gate electrodes and the control gate electrode is set much larger than the coupling capacitance between each of the floating gate electrodes and the substrate.
    • 公开了一种具有寿命长,结构变化小,书写特性小的简单结构的存储单元,并且没有过度擦除的问题和允许缩小尺寸的更高的操作速度。 浮栅电极布置在其间具有栅绝缘膜的沟道区上。 控制栅极形成在浮栅上,其间具有隧道绝缘膜。 控制栅电极的中心部分设置在沟道区上以形成选择栅极。 具有选择栅极的源极/漏极区域和选择栅极形成选择晶体管。 每个浮置栅电极和控制栅电极之间的耦合电容被设置得远大于每个浮栅电极和衬底之间的耦合电容。
    • 10. 发明申请
    • ELECTRODE FOR CAPACITOR AND CAPACITOR
    • 电容器和电容器电极
    • US20110222210A1
    • 2011-09-15
    • US13129983
    • 2009-11-17
    • Hideaki Fujiwara
    • Hideaki Fujiwara
    • H01G9/012
    • H01G9/052H01G9/0032H01G9/042H01G9/07
    • A capacitor includes a positive electrode base material, a dielectric layer, a positive electrode body, a dielectric layer, a negative electrode body, and a negative electrode base material. The positive electrode body is formed on the positive electrode base material and in part is in contact with the positive electrode base material. The positive electrode body is formed by association of a large number of metal particles, and the associated metal particles form a reticular network. The positive electrode base material and the positive electrode body (core part) are formed of a NiTi alloy containing Ni having a large work function. The dielectric layers (high-permittivity insulating film) are formed of titanium oxide. It is preferable that at least one Ni atomic layer is formed at an interface between the high-permittivity insulating film and the core part. Although the Ni atomic layer is preferably formed over the entire interface, the Ni atomic layer may be partially formed at the interface.
    • 电容器包括正极基材,电介质层,正极体,电介质层,负极体和负极基材。 正极体形成在正极基材上,部分与正极基材接触。 正极体通过大量金属颗粒的缔合形成,并且相关联的金属颗粒形成网状网络。 正极基材和正极体(芯部)由具有大功函数的Ni的NiTi合金形成。 电介质层(高电容率绝缘膜)由氧化钛形成。 优选在高电容率绝缘膜和芯部之间的界面处形成至少一个Ni原子层。 尽管Ni原子层优选在整个界面上形成,但Ni原子层可以部分地形成在界面处。