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    • 7. 发明授权
    • Heat curable adhesive system
    • 热固化胶粘剂系统
    • US4868266A
    • 1989-09-19
    • US253210
    • 1988-10-04
    • Walter MeckelRudolf Hombach
    • Walter MeckelRudolf Hombach
    • C09J175/04C08G18/10C08G18/22C08G18/48C09J175/00C09J175/08
    • C09J175/08C08G18/10C08G18/22
    • The present invention relates to a heat curable adhesive system comprising a prepolymer (P) based on isocyanate groups and polyether segments, and at least one polyhydroxyl compound (C), and a catalyst (D) characterized in that(a) the prepolymer (P) is formed on the basis of one or more polyols (A) containing polyether segments and having an average hydroxyl number of from 50 to 160 and an average functionality of from 2.05 to 2.6 and o at least one diphenylmethane diisocyanate (B) and(b) the polyhydroxyl compound (c) contains at least three hydroxyl groups per molecule and is dispersed in prepolymer (P) in a quantity of from 1 to 10 hydroxyl groups for each isocyanate group still available in the prepolymer (P) and melts at a temperature above 110.degree. C. and(c) the catalyst (D) consists of at least one carboxylic acid salt of bismuth, cadminum, lead or zinc containing more than 12, in particular 14 carbon atoms, used in a solid form melting at a temperature above 100.degree. C.
    • 本发明涉及一种包含基于异氰酸酯基团和聚醚部分的预聚物(P)和至少一种多羟基化合物(C)和催化剂(D)的热固性粘合剂体系,其特征在于(a)预聚物(P )基于一种或多种含有聚醚链段并且平均羟基数为50至160且平均官能度为2.05至2.6的多元醇(A)和至少一种二苯基甲烷二异氰酸酯(B)和(b )多羟基化合物(c)每分子含有至少三个羟基,并且在预聚物(P)中仍然可得到的每个异氰酸酯基团分散在预聚物(P)中的量为1至10个羟基,并在温度 高于110℃,和(c)催化剂(D)由至少一种含有超过12个,特别是14个碳原子的铋,镉,铅或锌的羧酸盐组成,其以在温度下熔融的固体形式使用 高于100℃