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    • 2. 发明授权
    • Method of manufacturing thin organic film
    • 薄有机薄膜的制造方法
    • US06473564B1
    • 2002-10-29
    • US09478802
    • 2000-01-07
    • Naoki NagashimaNatsuki TakahashiToshio Negishi
    • Naoki NagashimaNatsuki TakahashiToshio Negishi
    • C23C1400
    • C23C14/22C23C14/12C23C14/243
    • An inactive gas is introduced into an organic material evaporation source to place a thin organic film material in the organic material evaporation source in an atmosphere having a relatively high pressure, and the temperature of the thin organic film material is increased up to a certain temperature. Then, the organic material evaporation source is evacuated to lower the pressure around the thin organic film material for thereby causing the thin organic film material to emit a vapor. Since no wasteful vapor is emitted from the thin organic film material, the thin organic film material is effectively utilized. Because the inactive gas acts as a heating medium, the temperature of the thin organic film material is increased at a high rate, and the thin organic film material is uniformly heated. When the temperature of the thin organic film material is lowered in an inactive gas atmosphere, it can be lowered at a high rate. The inactive gas is introduced directly into the organic material evaporation source by an on-off valve, the time required to evacuate the organic material evaporation source is reduced. A liquid thin organic film material may be heated by a heating medium in the organic material evaporation source, so that the liquid thin organic film material will not be heated to a temperature higher than the temperature of the heating medium, and hence will not suffer bumping due to a temperature overshooting.
    • 将惰性气体引入有机材料蒸发源中,以将有机材料薄膜材料置于具有较高压力的气氛中的有机材料蒸发源中,并将有机薄膜材料的温度升高到一定温度。 然后,将有机材料蒸发源抽真空以降低薄有机膜材料周围的压力,由此使有机薄膜材料发生蒸气。 由于从薄的有机薄膜材料不会产生浪费的蒸汽,因此有效地利用薄的有机薄膜材料。 由于惰性气体作为加热介质,所以薄的有机薄膜材料的温度以高的速率增加,并且薄的有机薄膜材料被均匀地加热。 当有机薄膜材料的温度在惰性气体气氛中降低时,可以高速降低。 惰性气体通过开关阀直接引入有机材料蒸发源,减少了抽空有机材料蒸发源所需的时间。 可以通过有机材料蒸发源中的加热介质来加热液体薄的有机膜材料,使得液体薄的有机膜材料不会被加热到比加热介质的温度高的温度,因此不会发生碰撞 由于温度过高。
    • 5. 发明授权
    • Process for fabricating a semiconductor device
    • 制造半导体器件的工艺
    • US06756299B2
    • 2004-06-29
    • US10285959
    • 2002-11-01
    • Naoki Nagashima
    • Naoki Nagashima
    • H01L214763
    • H01L21/76835H01L21/76811H01L21/76813H01L21/76826H01L21/76829
    • A process for fabricating a semiconductor device, which reduces the number of steps required for forming a via hole and a wiring trench in the insulating film comprised of a low dielectric-constant insulating material, resulting in a lower cost for fabrication and a shorter turn around time, is provided. A photosensitive silazane film is exposed and developed to form a hard mask on an interlayer dielectric. The hard mask defines a wiring pattern for a wiring layer and a position of a via hole. Then, a resist film is formed on the interlayer dielectric to form a resist mask having a via hole pattern, and part of a via hole is formed using the resist mask. The interlayer dielectric is subjected to anisotropic etching using the hard mask to form a wiring trench and to allow the via hole to reach the wiring layer, and the wiring layer is exposed.
    • 一种用于制造半导体器件的方法,其减少了在由低介电常数绝缘材料构成的绝缘膜中形成通孔和布线沟槽所需的步骤数量,导致制造成本更低,转弯更短 时间。 将感光性硅氮烷膜曝光并显影以在层间电介质上形成硬掩模。 硬掩模限定布线层的布线图案和通孔的位置。 然后,在层间电介质上形成抗蚀剂膜,形成具有通孔图案的抗蚀剂掩模,并且使用抗蚀剂掩模形成通孔的一部分。 使用硬掩模对层间电介质进行各向异性蚀刻,形成布线沟槽,并使通孔到达布线层,并且布线层露出。
    • 8. 发明授权
    • Modulator and ΔΣ-type D/A converter
    • 调制器和&Dgr& S型D / A转换器
    • US08766837B2
    • 2014-07-01
    • US13522836
    • 2010-09-30
    • Tetsuya KajitaSeita NashimotoNaoki NagashimaKouji Okuda
    • Tetsuya KajitaSeita NashimotoNaoki NagashimaKouji Okuda
    • H03M1/66
    • H03M3/51
    • The disclosed device easily and precisely satisfies a requested output range, and is provided with: a ΔΣ-modulator (12) which converts a digital input signal to a pulse signal; an input comparison device (11) which compares an input value that corresponds to the digital input signal, and a pre-set threshold value; and a thinned output control unit (14) which, when the result of the comparison by the input comparison device (11) shows that the input value is less than the threshold value, reduces the output value corresponding to the input value in accordance with the size of the difference between the input value and the threshold value, and sets the output value to 0 when the input value is 0.
    • 所公开的装置容易且精确地满足请求的输出范围,并且具有:将数字输入信号转换为脉冲信号的调制器(12); 比较与数字输入信号对应的输入值和预设阈值的输入比较装置(11); 以及减量输出控制单元(14),当输入比较装置(11)的比较结果表明输入值小于阈值时,根据该输入值减小对应于输入值的输出值 输入值与阈值之差的大小,输入值为0时将输出值设定为0。
    • 10. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US06716743B2
    • 2004-04-06
    • US10157402
    • 2002-05-29
    • Naoki Nagashima
    • Naoki Nagashima
    • H01L214763
    • H01L21/7684
    • A method of forming wiring of a uniform film thickness using a damascene process is proposed. Tantalum nitride, copper, another copper, and another tantalum nitride, for example, all constituting conductive films of different polishing rates, are overlayed on the top layer of an insulating film in which one wiring groove and another wiring groove are formed. The film thickness of the tantalum nitride, the copper, the other copper, and the other tantalum nitride is set and formed so that the height of the surface of the tantalum nitride formed on a silicon oxide film excluding the one wiring groove matches the height of the surface of the other tantalum nitride formed on the top layer of the one wiring groove. Subsequently, polishing takes over to complete the forming process.
    • 提出了一种使用镶嵌工艺形成均匀膜厚的布线的方法。 例如,所有构成不同抛光速度的导电膜的氮化钽,铜,另一种铜和另一种氮化钽覆盖在形成一个布线槽和另一布线槽的绝缘膜的顶层上。 氮化钽,铜,其他铜和其他氮化钽的膜厚被设定和形成,使得在除了一个布线槽以外的氧化硅膜上形成的氮化钽的表面的高度与 形成在一个布线槽的顶层上的另一个氮化钽的表面。 随后,抛光接管完成成型工艺。