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1. 发明申请

US20120122314A1 MEMS ELEMENT 有权
标题翻译： MEMS元件
公开(公告)号：US20120122314A1
公开(公告)日：2012-05-17
申请号：US13321116
申请日：2010-05-26
申请人： Hauke Pohlmann , Ronald Dekker , Joerg Mueller , Martin Duemling
发明人： Hauke Pohlmann , Ronald Dekker , Joerg Mueller , Martin Duemling
IPC分类号： H01L21/304
CPC分类号： H03H3/0073 , B81B2201/0271 , B81C1/0019 , Y10T29/49005 , Y10T29/49128 , Y10T29/49156
摘要： A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in the material later (34); etching material from the trench (40) such as to also etch the substrate (32) from the first side of the substrate (32); grinding the substrate (32) from a second side of the substrate to expose the trench (40); and using the exposed trench (40) as an etch hole. The exposed trench (40) is used as an etch hole for releasing a portion of the material layer (34), for example a beam resonator (12), from the substrate (32). An input electrode (6), an output electrode (8), and a top electrode (10) are provided.
摘要翻译：一种制造包括微机电元件的电子器件的方法，所述方法包括以下步骤：在衬底（32）的第一侧上提供材料层（34）; 在后面的材料（34）中提供沟槽（40）; 从沟槽（40）蚀刻材料，以便也从衬底（32）的第一侧蚀刻衬底（32）; 从衬底的第二侧研磨衬底（32）以露出沟槽（40）; 并使用暴露的沟槽（40）作为蚀刻孔。暴露的沟槽（40）用作用于从衬底（32）释放材料层（34）的一部分（例如光束谐振器（12））的蚀刻孔。设置有输入电极（6），输出电极（8）和顶部电极（10）。

2. 发明授权

US08679355B2 MEMS element 有权
标题翻译： MEMS元件
公开(公告)号：US08679355B2
公开(公告)日：2014-03-25
申请号：US13321116
申请日：2010-05-26
申请人： Hauke Pohlmann , Ronald Dekker , Joerg Mueller , Martin Duemling
发明人： Hauke Pohlmann , Ronald Dekker , Joerg Mueller , Martin Duemling
IPC分类号： C23F1/00
CPC分类号： H03H3/0073 , B81B2201/0271 , B81C1/0019 , Y10T29/49005 , Y10T29/49128 , Y10T29/49156
摘要： A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in the material later (34); etching material from the trench (40) such as to also etch the substrate (32) from the first side of the substrate (32); grinding the substrate (32) from a second side of the substrate to expose the trench (40); and using the exposed trench (40) as an etch hole. The exposed trench (40) is used as an etch hole for releasing a portion of the material layer (34), for example a beam resonator (12), from the substrate (32). An input electrode (6), an output electrode (8), and a top electrode (10) are provided.
摘要翻译：一种制造包括微机电元件的电子器件的方法，所述方法包括以下步骤：在衬底（32）的第一侧上提供材料层（34）; 在后面的材料（34）中提供沟槽（40）; 从沟槽（40）蚀刻材料，以便也从衬底（32）的第一侧蚀刻衬底（32）; 从衬底的第二侧研磨衬底（32）以露出沟槽（40）; 并使用暴露的沟槽（40）作为蚀刻孔。暴露的沟槽（40）用作用于从衬底（32）释放材料层（34）的一部分（例如光束谐振器（12））的蚀刻孔。设置有输入电极（6），输出电极（8）和顶部电极（10）。

3. 发明申请

US20100044808A1 METHOD OF MANUFACTURING A MEMS ELEMENT 审中-公开
标题翻译：制造MEMS元件的方法
公开(公告)号：US20100044808A1
公开(公告)日：2010-02-25
申请号：US11993474
申请日：2006-06-27
申请人： Ronald Dekker , Geert Langereis , Hauke Pohlmann , Martin Duemling
发明人： Ronald Dekker , Geert Langereis , Hauke Pohlmann , Martin Duemling
IPC分类号： H01L29/84 , H01L21/30
CPC分类号： B81C1/00182 , B81B2203/0118 , B81B2203/0315 , B81C1/00047 , B81C2201/0109
摘要： The device (100) comprises a substrate (10) of a semiconductor material with a first and an opposite second surface (1,2) and a microelectromechanical (MEMS) element (50) which is provided with a fixed and a movable electrode (52, 51) that is present in a cavity (30). One of the electrodes (51,52) is defined in the substrate (10). The movable electrode (51) is movable towards and from the fixed electrode (52) between a first gapped position and a second position. The cavity (30) is opened through holes (18) in the substrate (10) that are exposed on the second surface (2) of the substrate (10). The cavity (30) has a height that is defined by at least one post (15) in the substrate (10), which laterally substantially surrounds the cavity (15).
摘要翻译：装置（100）包括具有第一和相对的第二表面（1,2）和微机电（MEMS）元件（50）的半导体材料的衬底（10），该微机电（MEMS）元件设置有固定和可移动电极，51），其存在于空腔（30）中。电极（51,52）中的一个限定在基板（10）中。可移动电极（51）可以在第一间隙位置和第二位置之间朝向固定电极（52）移动。空腔（30）通过暴露在基板（10）的第二表面（2）上的基板（10）中的通孔（18）。腔（30）具有由衬底（10）中的至少一个柱（15）限定的高度，其横向基本上围绕空腔（15）。

4. 发明授权

US06762510B2 Flexible integrated monolithic circuit 有权
标题翻译：柔性集成单片电路
公开(公告)号：US06762510B2
公开(公告)日：2004-07-13
申请号：US10140663
申请日：2002-05-08
申请人： Johann-Heinrich Fock , Wolfgang Schnitt , Hauke Pohlmann , Andreas Gakis , Michael Burnus , Martin Schaefer , Henricus Godefridus Rafael Maas , Theodorus Martinus Michielsen , Ronald Dekker
发明人： Johann-Heinrich Fock , Wolfgang Schnitt , Hauke Pohlmann , Andreas Gakis , Michael Burnus , Martin Schaefer , Henricus Godefridus Rafael Maas , Theodorus Martinus Michielsen , Ronald Dekker
IPC分类号： H01L2348
CPC分类号： H01L23/49855 , H01L23/5388 , H01L2221/6835 , H01L2221/68359 , H01L2221/68368 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A flexible monolithic integrated circuit which is essentially formed from flexible circuit elements, connecting elements between the flexible circuit elements, and a flexible coating which comprises at least one layer of a coating material comprising a polymer, is suitable as a small and convenient integrated circuit for electronic devices on flexible data carriers for the logistic tracking of objects and persons. The invention also relates to a method of manufacturing a flexible integrated monolithic circuit whereby integrated monolithic circuit elements and connecting elements are formed in and on a semiconductor substrate, the main surface of the integrated circuit elements facing away from the semiconductor substrate are coated with a polymer resin, and the semiconductor substrate is removed. The method is based on conventional process steps in semiconductor technology and leads to a flexible integrated monolithic circuit in a small number of process steps.
摘要翻译：基本上由柔性电路元件形成的柔性单片集成电路，柔性电路元件之间的连接元件以及包括至少一层包含聚合物的涂层材料的柔性涂层，适合作为小型便利的集成电路柔性数据载体上的电子设备用于对物体和人的物流跟踪。本发明还涉及一种制造柔性集成单体电路的方法，由此在半导体衬底内和半导体衬底上形成集成的单体电路元件和连接元件，面向半导体衬底的集成电路元件被涂覆有聚合物树脂，并且去除半导体衬底。该方法基于半导体技术中的常规工艺步骤，并且在少量工艺步骤中导致灵活的集成单片电路。

5. 发明申请

US20080283943A1 Electronic Device Comprising a Mems Element 审中-公开
标题翻译：包含Mems元素的电子设备
公开(公告)号：US20080283943A1
公开(公告)日：2008-11-20
申请号：US12093996
申请日：2006-11-07
申请人： Ronald Dekker , Hauke Polhmann , Martin Duemling
发明人： Ronald Dekker , Hauke Polhmann , Martin Duemling
IPC分类号： H01L21/50 , H01L29/84
CPC分类号： B81C1/00293 , B81C2203/0145 , H01L2224/13
摘要： The device (100) comprises a MEMS element (60) in a cavity (30) that is closed by a packaging portion (17) on a second side (2) of the substrate (10). Contact pads (25) are defined on a flexible resin layer (13) on an opposite first side (1) of the substrate. Electrical connections (32) extend through the resin layer (13) to at least one element of the device (100). The device (100) is suitably made with the use of a temporary carrier (42), and opening of etching holes (18) from the second side (2) of the substrate (10).
摘要翻译：装置（100）包括在由基板（10）的第二侧（2）上的封装部分（17）封闭的空腔（30）中的MEMS元件（60）。接触垫（25）限定在基板的相对的第一侧（1）上的柔性树脂层（13）上。电连接（32）延伸穿过树脂层（13）到装置（100）的至少一个元件。所述装置（100）适合于使用临时载体（42），并从所述基板（10）的第二侧（2）打开蚀刻孔（18）。

6. 发明申请

US20130149215A1 SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES 有权
标题翻译：用于电子微流体装置的系统级封装平台
公开(公告)号：US20130149215A1
公开(公告)日：2013-06-13
申请号：US13755293
申请日：2013-01-31
申请人： Ronald Dekker , Remco Henricus Wilhelmus Pijnenburg , Nicolaas Johannes Anthonius Van Veen
发明人： Ronald Dekker , Remco Henricus Wilhelmus Pijnenburg , Nicolaas Johannes Anthonius Van Veen
IPC分类号： H01L37/00 , B01L3/00
CPC分类号： H01L37/00 , B01J2219/00783 , B01J2219/0095 , B01L3/502707 , B01L3/502715 , B01L2200/12 , B01L2200/14 , B01L2300/0645 , B01L2300/1827 , B01L2300/1883 , B01L2400/0415 , B81B2201/058 , B81C1/0023 , H01L2224/11 , Y10T436/11
摘要： The present invention relates to an integrated electronic-microfluidic device an integrated electronic-microfluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A microfluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-microfluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.
摘要翻译：本发明涉及一种集成电子微流体装置，集成的电子微流体装置，其包括在第一（122）支撑件上的半导体衬底（106），电子电路（102,104）的第一半导体衬底半导体衬底和与外部设备的信号接口结构。信号接口结构布置在第一半导体衬底侧并被配置为从电子电路接收电信号。微流体结构（126）形成在半导体衬底中，并且被配置为限制流体并允许仅在与第一半导体衬底相反的第二半导体衬底侧上流体流过微流体结构，衬底侧面和背面形成第一支撑件。电子微流体装置形成用于形成各种系统级封装应用的灵活平台。它实现了电气和湿化学界面之间的清晰分离。所要求的制造本发明装置的方法还允许简单地形成热分离的微流体结构。

7. 发明申请

US20120116209A1 HIGH MAGNETIC FIELD COMPATIBLE INTERVENTIONAL NEEDLE AND INTEGRATED NEEDLE TRACKING SYSTEM 有权
标题翻译：高磁场兼容传统针和集成针脚追踪系统
公开(公告)号：US20120116209A1
公开(公告)日：2012-05-10
申请号：US13265387
申请日：2010-04-13
申请人： Mareike Klee , Axel Winkel , John Brean Mills , Ronald Dekker , Bernardus Hendrikus Wilhelmus Hendriks
发明人： Mareike Klee , Axel Winkel , John Brean Mills , Ronald Dekker , Bernardus Hendrikus Wilhelmus Hendriks
IPC分类号： A61B5/055 , H01L21/822 , H01F41/00
CPC分类号： G01R33/287 , G01R33/34007 , G01R33/34084 , Y10T29/4902
摘要： An elongate device (e.g. a catheter) for interventional MRI has one or more passive LC-circuits (wireless markers) attached to its distal tip portion for position tracking. The LC-circuits comprise an inductor winding (480) and a three-dimensional “trench” capacitor (420-440) and are integrated in a piece of silicon (410). Optical fibres may be included in the device for optical probing of tissue surrounding the distal tip portion.
摘要翻译：用于介入MRI的细长装置（例如，导管）具有附接到其远侧末端部分的位置跟踪的一个或多个无源LC电路（无线标记）。 LC电路包括电感器绕组（480）和三维“沟槽”电容器（420-440）并且集成在一块硅片（410）中。光纤可以包括在用于光学探测围绕远端尖端部分的组织的装置中。

8. 发明申请

US20120094323A1 CARDIOMYOCYTES-CONTAINING DEVICE AND METHOD FOR MANUFACTURING AND USING THE SAME 失效
标题翻译：含有血小板活性的装置及其制造和使用方法
公开(公告)号：US20120094323A1
公开(公告)日：2012-04-19
申请号：US13147607
申请日：2010-02-02
申请人： Ronald Dekker , Anja Van De Stolpe
发明人： Ronald Dekker , Anja Van De Stolpe
IPC分类号： C12Q1/18 , H01B13/00 , B05D5/00 , C12M1/34 , B05D1/36
CPC分类号： G01N1/30 , C12N5/0657 , C12N2503/02 , C12N2535/10 , G01N33/5061
摘要： Disclosed is a device for determining the cardiotoxicity of a chemical compound, comprising a substrate (10) carrying a deformable stack (34), said stack being partially detached from the substrate by a cavity (32) allowing an out-of-plane deformation of the stack, said stack comprising a first deformable layer (16), a second deformable layer (20) and a multi-electrode structure (18) sandwiched between the first and second deformable layers, the second deformable layer carrying a pattern of cardiomyocytes (28) adhered thereto; and a liquid container (26) mounted on the substrate for exposing the cardiomyocytes to the chemical compound. A method of manufacturing such a device is also disclosed. The present invention further relates to the use of the device for drug target discovery and/or drug development and a method for developing a disease model for a disease that is caused by or modified by stretching of cells, in particular a cardiac disease model.
摘要翻译：公开了一种用于确定化合物的心脏毒性的装置，包括承载可变形叠层（34）的基底（10），所述叠层通过空腔（32）部分地与基底分离，允许外部变形所述堆叠包括夹在所述第一和第二可变形层之间的第一可变形层（16），第二可变形层（20）和多电极结构（18），所述第二可变形层承载心肌细胞图案（28 ）和安装在基板上的用于将心肌细胞暴露于化合物的液体容器（26）。还公开了制造这种装置的方法。本发明还涉及该装置用于药物靶发现和/或药物开发的用途，以及用于开发由细胞拉伸，特别是心脏疾病模型引起或改变的疾病的疾病模型的方法。

9. 发明授权

US07915707B2 Deformable integrated circuit device 有权
标题翻译：可变形集成电路器件
公开(公告)号：US07915707B2
公开(公告)日：2011-03-29
申请号：US12377673
申请日：2007-08-07
申请人： Ronald Dekker , Antoon Marie Henrie Tombeur , Theodoros Zoumpoulidis
发明人： Ronald Dekker , Antoon Marie Henrie Tombeur , Theodoros Zoumpoulidis
IPC分类号： H01L29/00
CPC分类号： H01L23/49833 , H01L23/5387 , H01L2924/0002 , H01L2924/00
摘要： An integrated-circuit device includes a rigid substrate island having a main substrate surface with a circuit region circuit elements and at least one fold structure. The fold structure is attached to the substrate island and is unfoldable from a relaxed, folded state to a strained unfolded state. The fold structure contains at least one passive electrical component. The fold structure further has in its folded state at least one surface with an area vector that includes a non-vanishing area-vector component in a direction parallel to the main substrate surface, which area-vector component is diminished or vanishes when deforming the fold structure from the folded into the unfolded state.
摘要翻译：集成电路器件包括具有主衬底表面的刚性衬底岛，其具有电路区域电路元件和至少一个折叠结构。折叠结构附接到基底岛，并且可以从松弛的折叠状态展开到应变展开状态。折叠结构包含至少一个无源电组件。折叠结构在其折叠状态下进一步具有面向向的至少一个表面，该区域向量在平行于主衬底表面的方向上包括非消失的面积 - 矢量分量，该区域 - 矢量分量在折叠变形时减少或消失结构从折叠到展开状态。

10. 发明授权

US07893632B2 LED luminaire with optical feedback by image mapping on segmented light sensors 有权
标题翻译：具有光分路光传感器图像映射的光学反馈的LED灯具
公开(公告)号：US07893632B2
公开(公告)日：2011-02-22
申请号：US11719298
申请日：2005-11-15
申请人： Eduard Johannes Meijer , Ronald Dekker , Eugene Timmering , Christoph Gerard August Hoelen , Johannes Petrus Maria Ansems
发明人： Eduard Johannes Meijer , Ronald Dekker , Eugene Timmering , Christoph Gerard August Hoelen , Johannes Petrus Maria Ansems
IPC分类号： H05B37/00 , F21V5/00 , F21V5/04
CPC分类号： F21V23/0442 , F21S10/02 , F21V23/0457 , F21Y2115/10 , G01J1/04 , G01J1/0411 , G01J1/0414 , G01J1/32 , G02B19/0028 , G02B19/0066 , G02B19/0085 , H01L25/167 , H01L2924/0002 , H05B33/0869 , H05B37/029 , H01L2924/00
摘要： The present invention relates to a luminaire comprising an array of LEDs emitting light of at least one color, and a control system for controlling the light output of the luminaire. The control system comprises photosensor array for detecting light output of the luminaire. An imaging unit is arranged in front of the photosensor array such that it maps an image of said array of LEDs on said photosensor array. The photosensor array is divided into subareas each detecting light output from a single one of the LEDs. The control system uses the output of the subareas for controlling the luminaire light output. Thus, it is possible to act on different LED light colors or the light output of individual LEDs without having to separate them in time by means of a time pulsing method.
摘要翻译：本发明涉及一种包括发射至少一种颜色的光的LED阵列的照明器和用于控制照明器的光输出的控制系统。控制系统包括用于检测照明器的光输出的光电传感器阵列。成像单元布置在光电传感器阵列的前面，使得它将所述LED阵列的图像映射在所述光传感器阵列上。光传感器阵列被分成每个检测来自单个LED的光输出的子区域。控制系统使用子区域的输出来控制照明器光输出。因此，可以通过时间脉冲方式对不同的LED光颜色或各个LED的光输出作用，而不必在时间上分离它们。

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