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1. 发明申请

WO2008147825A4 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，生产方法及其用途
公开(公告)号：WO2008147825A4
公开(公告)日：2009-05-07
申请号：PCT/US2008064422
申请日：2008-05-21
申请人： HONEYWELL INT INC , WEISER MARTIN , BURNHAM KIKUE , ZHOU DE-LING , LEUNG ROGER , NEDBAL JAN , RASTOGI RAVI
发明人： WEISER MARTIN , BURNHAM KIKUE , ZHOU DE-LING , LEUNG ROGER , NEDBAL JAN , RASTOGI RAVI
IPC分类号： H01L23/373 , C09K5/14
CPC分类号： C09K5/14 , H01L23/3737 , H01L23/42 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/0665 , H01L2924/00
摘要： Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.
摘要翻译：公开了热界面材料，其包括至少一种基质材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂改善所述热界面材料的热性能，相容性，物理质量或其组合。还公开了形成热界面材料的方法，其包括提供至少一种基质材料组分，至少一种高电导率填料，至少一种焊料材料和至少一种材料改性剂中的每一种，混合组分; 并且可选地将热界面材料预施加或后施加到表面，基材或组分上固化。此外，公开了热界面材料，其包括至少一种基体材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂至少一种改性的热填料型材。

2. 发明申请

WO2008147825A3 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，其制造方法和用途
公开(公告)号：WO2008147825A3
公开(公告)日：2009-03-05
申请号：PCT/US2008064422
申请日：2008-05-21
申请人： HONEYWELL INT INC , WEISER MARTIN , BURNHAM KIKUE , ZHOU DE-LING , LEUNG ROGER , NEDBAL JAN , RASTOGI RAVI
发明人： WEISER MARTIN , BURNHAM KIKUE , ZHOU DE-LING , LEUNG ROGER , NEDBAL JAN , RASTOGI RAVI
IPC分类号： H01L23/373 , C09K5/14
CPC分类号： C09K5/14 , H01L23/3737 , H01L23/42 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/0665 , H01L2924/00
摘要： Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.
摘要翻译：公开了热界面材料，其包括至少一种基体材料组分，至少一种高导电性填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂改善热界面材料的热性能，相容性，物理质量或其组合。还公开了形成热界面材料的方法，其包括提供至少一种基体材料组分，至少一种高导电性填料，至少一种焊料材料和至少一种材料改性剂中的每一种，混合所述组分; 并且可选地在将热界面材料施加到表面，基底或部件之前或之后固化部件。而且，公开了包括至少一种基体材料组分，至少一种高导电性填料组分，至少一种焊料材料的热界面材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂具有至少一种改性的热量填充材料。

3. 发明申请

WO2004037877A3 ORGANOSILOXANES 审中-公开
标题翻译：有机硅氧烷
公开(公告)号：WO2004037877A3
公开(公告)日：2005-01-13
申请号：PCT/US0317658
申请日：2003-06-03
申请人： HONEYWELL INT INC , BEDWELL WILLIAM , HACKER NIGEL , LEUNG ROGER , IWAMOTO NANCY , NEDBAL JAN , XIE SONGYUAN , MORO LORENZA , MUKHERJEE SHYAMA
发明人： BEDWELL WILLIAM , HACKER NIGEL , LEUNG ROGER , IWAMOTO NANCY , NEDBAL JAN , XIE SONGYUAN , MORO LORENZA , MUKHERJEE SHYAMA
IPC分类号： C08G77/12 , C09D183/04 , G03F7/075 , H01L21/312 , H01L21/768 , B05D3/02 , B05D3/06 , C08G77/20 , C23C16/00 , H01L21/31
CPC分类号： C08G77/12 , C09D183/04 , G03F7/0751 , H01L21/02126 , H01L21/02211 , H01L21/02282 , H01L21/3122 , H01L21/76807 , H01L21/76829 , H01L2924/12044
摘要： The present invention provides an organosiloxane comprising at least 80 weight percent of Formula I: [Y0.01-1.0SiO1.5-2]a[Z 0.01-1.0SiO1.5-2 ]b[H0.01-1.0SiO1.5-2]c where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula (I); b is from 2 percent to 50 percent of Formula (I); and c is from 20 percent to 80 percent of Formula (I).The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.
摘要翻译：本发明提供了包含至少80重量％的式I的有机硅氧烷：[Y0.01-1.0SiO1.5-2] a [Z 0.01-1.0SiO1.5-2] b [H0.01-1.0SiO1.5 -2] c其中Y是芳基; Z是烯基; a为式（I）的15％至70％; b为式（I）的2％至50％; 和c为式（I）的20％至80％。本发明的有机硅氧烷可用作陶瓷粘合剂，高温密封剂和纤维基质粘合剂。本发明的组合物也可用作粘合促进剂，因为当与非微电子或微电子应用中的其它材料结合时，其具有良好的粘合性能。优选地，本发明的组合物用作微电子应用中的蚀刻停止，硬掩模和电介质。

4. 发明申请

WO2004037877A9 ORGANOSILOXANES 审中-公开
标题翻译：有机硅氧烷
公开(公告)号：WO2004037877A9
公开(公告)日：2004-11-11
申请号：PCT/US0317658
申请日：2003-06-03
申请人： HONEYWELL INT INC , BEDWELL WILLIAM , HACKER NIGEL , LEUNG ROGER , IWAMOTO NANCY , NEDBAL JAN , XIE SONGYUAN , MORO LORENZA , MUKHERJEE SHYAMA
发明人： BEDWELL WILLIAM , HACKER NIGEL , LEUNG ROGER , IWAMOTO NANCY , NEDBAL JAN , XIE SONGYUAN , MORO LORENZA , MUKHERJEE SHYAMA
IPC分类号： C08G77/12 , C09D183/04 , G03F7/075 , H01L21/312 , H01L21/768 , C08G
CPC分类号： C08G77/12 , C09D183/04 , G03F7/0751 , H01L21/02126 , H01L21/02211 , H01L21/02282 , H01L21/3122 , H01L21/76807 , H01L21/76829 , H01L2924/12044
摘要： The present invention provides an organosiloxane comprising at least 80 weight percent of Formula I: [Y0.01-1.0SiO1.5-2]a[Z 0.01-1.0SiO1.5-2 ]b[H0.01-1.0SiO1.5-2]c where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula I; b is from 2 percent to 50 percent of Formula I; and c is from 20 percent to 80 percent of Formula I.The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.
摘要翻译：本发明提供了包含至少80重量％的式I的有机硅氧烷：[Y 0.01-1.0 SiO 1.5-2] a [Z 0.01-1.0SiO 1.5-2] b [H 0.01-1.0 SiO 1.5 -2] c其中Y是芳基; Z是链烯基; a为式I的15％至70％; b为式I的2％至50％; 并且c为式I的20％至80％。本发明的有机硅氧烷可以用作陶瓷粘合剂，高温包封剂和纤维基质粘合剂。本发明组合物还可用作粘合促进剂，因为它在非微电子或微电子应用中与其它材料结合时表现出良好的粘合性能。优选地，本发明组合物用作微电子应用中的蚀刻停止层，硬掩模和电介质。

5. 发明申请

WO2005049681A3 ANTIREFLECTIVE COATINGS FOR VIA FILL AND PHOTOLITHOGRAPHY APPLICATIONS AND METHODS OF PREPARATION THEREOF 审中-公开
标题翻译：用于通过薄膜和光刻机应用的抗反射涂层及其制备方法
公开(公告)号：WO2005049681A3
公开(公告)日：2006-04-20
申请号：PCT/US2004038517
申请日：2004-11-17
申请人： HONEYWELL INT INC , LI BO , KENNEDY JOSEPH , IWAMOTO NANCY , LU VICTOR , LEUNG ROGER , FRADKIN MARK A , HUSSEIN MAKAREM A , GOODNER MICHAEL D
发明人： LI BO , KENNEDY JOSEPH , IWAMOTO NANCY , LU VICTOR , LEUNG ROGER , FRADKIN MARK A , HUSSEIN MAKAREM A , GOODNER MICHAEL D
IPC分类号： G03C1/825 , C08G20060101 , C08L83/04 , C09D183/04 , C09D183/08 , G03C1/83 , G03F7/09
CPC分类号： C09D183/04 , C09D183/08 , G03F7/0751 , G03F7/0752 , G03F7/091
摘要： An absorbing composition is described herein that includes at least one inorganicbased compound, at least one absorbing compound, and at least one material modification agent. In addition, methods of making an absorbing composition are also described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) allowing the reaction mixture to form the absorbing composition at room temperature. Another method of making an absorbing composition includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) heating the reaction mixture to form the absorbing composition. Yet another method of making an absorbing composition is described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) heating the reaction mixture to form an absorbing material, a coating or a film. In other methods of making an absorbing composition described herein, those methods include: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) allowing the reaction mixture to form an absorbing material, a coating or a film.
摘要翻译：本文描述的吸收组合物包括至少一种无机基化合物，至少一种吸收化合物和至少一种材料改性剂。此外，还描述了制备吸收组合物的方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂形成反应混合物; 和b）使反应混合物在室温下形成吸收组合物。制备吸收组合物的另一种方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂组合以形成反应混合物; 和b）加热反应混合物以形成吸收组合物。描述了制备吸收组合物的另一种方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物，其中至少一种材料改性剂包含至少一种酸和水; 和b）加热反应混合物以形成吸收材料，涂层或膜。在制备本文所述的吸收组合物的其它方法中，这些方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物，其中所述至少一种材料改性剂包含至少一种酸和水; 和b）使反应混合物形成吸收材料，涂层或膜。

6. 发明申请

WO2004006297A2 LOW DIELECTRIC MATERIALS AND METHODS OF PRODUCING SAME 审中-公开
标题翻译：低介电材料及其生产方法
公开(公告)号：WO2004006297A2
公开(公告)日：2004-01-15
申请号：PCT/US0318543
申请日：2003-06-11
申请人： HONEYWELL INT INC , MUKHERJEE SHYAMA , LEUNG ROGER , LAU KREISLER
发明人： MUKHERJEE SHYAMA , LEUNG ROGER , LAU KREISLER
IPC分类号： B32B5/16 , C08J9/28 , H01L20060101 , H01L21/316 , H05K1/16 , H01L
CPC分类号： H01L21/31695 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/02343 , H05K1/162 , H05K2201/0116 , H05K2201/0209 , Y10T428/249978 , Y10T428/259
摘要： In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount, and to ultimately form a low dielectric material that can be utilized in various applications.
摘要翻译：根据本发明，提供了组合物和方法，其中具有多个孔的前体材料的机械强度和耐久性通过以下方式增加：a）提供前体材料; b）优选通过使用超临界干燥工艺处理前体材料以形成纳米多孔气凝胶; c）提供具有增强组分和挥发性组分的混合材料; d）将所述纳米多孔气凝胶和所述混合材料组合以形成混合层; 和e）处理汞齐化层以增加该层的机械强度大量，并最终形成可用于各种应用的低介电材料。

7. 发明申请

WO03007337A3 LOW DIELECTRIC CONSTANT ORGANIC DIELECTRICS BASED ON CAGE-LIKE STRUCTURES 审中-公开
标题翻译：基于笼形结构的低介电常数有机介质
公开(公告)号：WO03007337A3
公开(公告)日：2003-05-08
申请号：PCT/US0221692
申请日：2002-07-08
申请人： HONEYWELL INT INC , LAU KREISLER , LIU FENG QUAN , KOROLEV BORIS , BROUK EMMA , ZHEREBIN RUSLAN , LEUNG ROGER
发明人： LAU KREISLER , LIU FENG QUAN , KOROLEV BORIS , BROUK EMMA , ZHEREBIN RUSLAN , LEUNG ROGER
IPC分类号： C08G65/40 , C08F8/00 , C08F257/02 , C08F277/00 , C08F281/00 , C08G61/02 , C08G61/12 , C08G81/00 , C08J3/24 , C08J5/18 , C08L1/00 , C08L51/00 , C08L67/00 , C08L67/06 , C08L71/12 , H01B3/42 , H01L20060101 , H01L21/312
CPC分类号： C08F257/02 , C08F8/00 , C08G61/02 , C08G61/12 , C08G81/00 , C08L51/003 , H01B3/307 , H01B3/427 , C08L2666/02
摘要： A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.
摘要翻译：低介电常数材料具有带芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一和第二主链通过第一和第二反应性基团在交联反应而没有另外的交联剂，并且其中具有至少10个原子的笼结构共价结合到第一和第二主链中的至少一个。

8. 发明申请

WO0178110A2 LOW DIELECTRIC CONSTANT ORGANIC DIELECTRICS BASED ON CAGE-LIKE STRUCTURES 审中-公开
标题翻译：基于笼式结构的低介电常数有机电介质
公开(公告)号：WO0178110A2
公开(公告)日：2001-10-18
申请号：PCT/US0111273
申请日：2001-04-06
申请人： HONEYWELL INT INC , LAU KREISLER , LIU FENG QUAN , KOROLEV BORIS , BROUK EMMA , ZHEREBIN RUSLAN , LEUNG ROGER
发明人： LAU KREISLER , LIU FENG QUAN , KOROLEV BORIS , BROUK EMMA , ZHEREBIN RUSLAN , LEUNG ROGER
IPC分类号： C08G65/40 , C08F8/00 , C08F257/02 , C08F277/00 , C08F281/00 , C08G61/12 , C08G81/00 , C08J3/24 , C08L1/00 , C08L51/00 , C08L67/00 , C08L67/06 , C08L71/12 , H01L20060101 , H01L21/312 , H01L
CPC分类号： C08J3/246 , C08F257/02 , C08G61/12 , C08L51/003 , Y10S977/902 , Y10S977/963 , C08L2666/02
摘要： A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.
摘要翻译：低介电常数材料具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一和第二主链经由第一和第二反应性基团在交联反应而没有另外的交联剂，并且其中具有至少10个原子的笼结构共价结合到第一和第二主链中的至少一个。

9. 发明申请

WO2005052989A3 DIELECTRIC FILMS FOR NARROW GAP-FILL APPLICATIONS 审中-公开
标题翻译：用于NARROW GAP-FILL应用的电介质膜
公开(公告)号：WO2005052989A3
公开(公告)日：2005-10-06
申请号：PCT/US2004033035
申请日：2004-10-06
申请人： HONEYWELL INT INC , ENDISCH DENIS , LEUNG ROGER , XIE SONGYUAN , HACKER NIGEL , DENG YANPEI
发明人： ENDISCH DENIS , LEUNG ROGER , XIE SONGYUAN , HACKER NIGEL , DENG YANPEI
IPC分类号： H01L21/316 , C08L27/14 , C23F4/04 , H01L21/31
CPC分类号： H01L21/76837 , H01L21/316
摘要： A colloidal suspension of nanoparticles composed of a dense material dispersed in a solvent is used in forming a gap-filling dielectric material with low thermal shrinkage. The dielectric material is particularly useful for pre-metal dielectric and shallow trench isolation applications. According to the methods of forming a dielectric material, the colloidal suspension is deposited on a substrate and dried to form a porous intermediate layer. The intermediate layer is modified by infiltration with a liquid phase matrix material, such as a spin-on polymer, followed by curing, by infiltration with a gas phase matrix material, followed by curing, or by curing alone, to provide a gap-filling, thermally stable, etch resistant dielectric material.
摘要翻译：使用由分散在溶剂中的致密材料构成的纳米颗粒的胶体悬浮液来形成具有低热收缩率的间隙填充介电材料。电介质材料特别适用于预金属电介质和浅沟槽隔离应用。根据形成电介质材料的方法，将胶体悬浮液沉积在基底上并干燥以形成多孔中间层。通过用液相基质材料（例如旋涂聚合物）渗透，然后通过用气相基质材料渗透，随后固化，或通过单独固化来改性中间层，从而提供间隙填充，耐热稳定的，耐蚀刻的介电材料。

10. 发明申请

WO2004084269A3 LOW DIELECTRIC MATERIALS AND METHODS OF PRODUCING SAME 审中-公开
标题翻译：低介电材料及其生产方法
公开(公告)号：WO2004084269A3
公开(公告)日：2005-03-24
申请号：PCT/US2004007584
申请日：2004-03-11
申请人： HONEYWELL INT INC , MUKHERJEE SHYAMA , LEUNG ROGER , LAU KREISLER
发明人： MUKHERJEE SHYAMA , LEUNG ROGER , LAU KREISLER
IPC分类号： C08G77/00 , C08J9/26 , H01L21/316 , H01L23/532 , C08J9/28
CPC分类号： H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/02343 , H01L21/31695 , H01L23/5329 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount, and to ultimately form a low dielectric material that can be utilized in various applications.
摘要翻译：根据本发明，提供了组合物和方法，其中通过以下方式提高具有多个孔的前体材料的机械强度和耐久性：a）提供前体材料; b）优选通过使用超临界干燥方法处理前体材料以形成纳米多孔气凝胶; c）提供具有增强组分和挥发性组分的共混材料; d）结合纳米多孔气凝胶和共混材料以形成合并层; 和e）处理合并层以增加层的机械强度大量，并最终形成可用于各种应用的低介电材料。

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