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1. 发明申请

WO2008147825A4 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，生产方法及其用途
公开(公告)号：WO2008147825A4
公开(公告)日：2009-05-07
申请号：PCT/US2008064422
申请日：2008-05-21
申请人： HONEYWELL INT INC , WEISER MARTIN , BURNHAM KIKUE , ZHOU DE-LING , LEUNG ROGER , NEDBAL JAN , RASTOGI RAVI
发明人： WEISER MARTIN , BURNHAM KIKUE , ZHOU DE-LING , LEUNG ROGER , NEDBAL JAN , RASTOGI RAVI
IPC分类号： H01L23/373 , C09K5/14
CPC分类号： C09K5/14 , H01L23/3737 , H01L23/42 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/0665 , H01L2924/00
摘要： Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.
摘要翻译：公开了热界面材料，其包括至少一种基质材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂改善所述热界面材料的热性能，相容性，物理质量或其组合。还公开了形成热界面材料的方法，其包括提供至少一种基质材料组分，至少一种高电导率填料，至少一种焊料材料和至少一种材料改性剂中的每一种，混合组分; 并且可选地将热界面材料预施加或后施加到表面，基材或组分上固化。此外，公开了热界面材料，其包括至少一种基体材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂至少一种改性的热填料型材。

2. 发明申请

WO2008147825A3 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，其制造方法和用途
公开(公告)号：WO2008147825A3
公开(公告)日：2009-03-05
申请号：PCT/US2008064422
申请日：2008-05-21
申请人： HONEYWELL INT INC , WEISER MARTIN , BURNHAM KIKUE , ZHOU DE-LING , LEUNG ROGER , NEDBAL JAN , RASTOGI RAVI
发明人： WEISER MARTIN , BURNHAM KIKUE , ZHOU DE-LING , LEUNG ROGER , NEDBAL JAN , RASTOGI RAVI
IPC分类号： H01L23/373 , C09K5/14
CPC分类号： C09K5/14 , H01L23/3737 , H01L23/42 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/0665 , H01L2924/00
摘要： Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.
摘要翻译：公开了热界面材料，其包括至少一种基体材料组分，至少一种高导电性填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂改善热界面材料的热性能，相容性，物理质量或其组合。还公开了形成热界面材料的方法，其包括提供至少一种基体材料组分，至少一种高导电性填料，至少一种焊料材料和至少一种材料改性剂中的每一种，混合所述组分; 并且可选地在将热界面材料施加到表面，基底或部件之前或之后固化部件。而且，公开了包括至少一种基体材料组分，至少一种高导电性填料组分，至少一种焊料材料的热界面材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂具有至少一种改性的热量填充材料。

3. 发明申请

WO03026828A3 IMPROVED COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER 审中-公开
标题翻译：改进的用于高温无铅焊料的组合物，方法和装置
公开(公告)号：WO03026828A3
公开(公告)日：2003-06-19
申请号：PCT/US0230608
申请日：2002-09-25
申请人： HONEYWELL INT INC , DEAN NANCY , LALENA JOHN , WEISER MARTIN
发明人： DEAN NANCY , LALENA JOHN , WEISER MARTIN
IPC分类号： B23K35/00 , B23K35/22 , B23K35/26 , C22C1/02 , C22C12/00 , C22C13/00
CPC分类号： B23K35/264 , B23K35/007 , B23K2201/40 , H01L24/29 , H01L24/32 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A lead-free (130) solder comprises an alloy of silver and bismuth in amounts of about 2 wt% to about 18 wt% and about 98 wt% to about 82 wt%, respectively. Contemplated alloys further comprise at least one of zinc, nickel, germanium or a combination thereof in an amount of up to about 1000 ppmy and have a solidus of no lower than about 262.5 DEG C and a liquidus of no higher than about 400 DEG C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of at least one of the constituents of the alloy, and particularly contemplated elements are phosphorus and germanium.
摘要翻译：无铅（130）焊料包含量分别为约2重量％至约18重量％和约98重量％至约82重量％的银和铋的合金。考虑的合金进一步包含至多约1000ppmy的锌，镍，锗或其组合中的至少一种，并具有不低于约262.5℃的固相线和不高于约400℃的液相线考虑的合金可以进一步包含具有比合金的至少一种成分的氧亲和力更高的氧亲和力的化学元素，并且特别考虑的元素是磷和锗。

4. 发明申请

WO2008033828A8 MODIFIED SOLDER ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：用于电气互连的改性焊接合金，其生产方法及其用途
公开(公告)号：WO2008033828A8
公开(公告)日：2008-06-26
申请号：PCT/US2007078146
申请日：2007-09-11
申请人： HONEYWELL INT INC , WEISER MARTIN , LI JIANXING
发明人： WEISER MARTIN , LI JIANXING
IPC分类号： B23K35/26 , C22C12/00
CPC分类号： C22C12/00 , B23K35/26 , B23K35/264 , H01L24/29 , H01L2224/32225 , H01L2924/01322 , H01L2924/1301 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , Y10T428/31678 , H01L2924/00
摘要： Lead-free solder compositions having a thermal conductivity are disclosed that include at least about 2% of silver, at least about 60% of bismuth, and at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range. Methods of producing these lead-free solder compositions are also disclosed that include providing at least about 2% of silver, providing at least about 60% of bismuth, providing at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, blending the bismuth with the at least one additional metal to form a bismuth-metal blend, and blending the bismuth-metal blend with copper to form the solder composition, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range. Additional methods of producing a lead-free solder composition having a thermal conductivity include providing at least about 2% of silver, providing at least about 60% of bismuth, providing at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, blending the silver with the at least one additional metal to form a silver-metal alloy, and blending the silver-metal alloy with bismuth to form the solder composition, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range.
摘要翻译：公开了具有导热性的无铅焊料组合物，其包含至少约2％的银，至少约60％的铋以及至少一种额外的金属，其量将增加焊料组合物的热导率由银和铋组成的比较焊料组合物，其中所述至少一种附加金属不会显着地改变固相线温度，并且不将液相线温度移动到可接受的液相线温度范围之外。还公开了生产这些无铅焊料组合物的方法，其包括提供至少约2％的银，提供至少约60％的铋，提供至少一种额外的金属，其量将增加焊料的热导率通过比较由银和铋组成的焊料组合物，将铋与至少一种另外的金属共混以形成铋 - 金属共混物，并将铋 - 金属共混物与铜混合以形成焊料组合物，其中至少一种附加金属不会显着地改变固相线温度，并且不将液相线温度移动到可接受的液相线温度范围之外。制备具有导热性的无铅焊料组合物的附加方法包括提供至少约2％的银，提供至少约60％的铋，提供至少一种额外的金属，其量将增加该导电性的导热性焊料组合超过由银和铋组成的比较焊料组合物，将银与至少一种另外的金属共混以形成银 - 金属合金，并将银 - 金属合金与铋共混以形成焊料组合物，其中至少一种额外的金属不会显着改变固相线温度，并且不会将液相线温度移动到可接受的液相线温度范围之外。

5. 发明申请

WO02097145B1 COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER 审中-公开
标题翻译：用于高温无铅焊料的组合物，方法和装置
公开(公告)号：WO02097145B1
公开(公告)日：2004-05-27
申请号：PCT/US0117491
申请日：2001-05-28
申请人： HONEYWELL INT INC , LALENA JOHN , DEAN NANCY , WEISER MARTIN
发明人： LALENA JOHN , DEAN NANCY , WEISER MARTIN
IPC分类号： B23K35/00 , B23K35/26 , C22C5/02 , C22C12/00 , C22C13/00 , C22C13/02 , H01L21/60
CPC分类号： B23K35/264 , B23K35/00 , B23K2035/008 , C22C5/02 , C22C12/00 , C22C13/02 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/04026 , H01L2224/29 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/29298 , H01L2224/8319 , H01L2224/83801 , H01L2224/83805 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01056 , H01L2924/01058 , H01L2924/0106 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/00 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A lead-free solder (130) comprises an alloy of silver and bismuth in amounts of 2wt% to 18wt% and 98wt% to 82wt%, respectively. Contemplated alloys have a solidus of no lower than 262.5 DEG C and a liquidus of no higher than 400 DEG C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of the alloy.
摘要翻译：无铅焊料（130）分别含有2重量％至18重量％和98重量％至82重量％的银和铋合金。沉积的合金具有不低于262.5℃的固相线和不高于400℃的液相线。考虑的合金可以进一步包含具有高于合金的氧亲和力的氧亲和力的化学元素。

6. 发明公开

EP1399600A4 COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER 有权
标题翻译： ZUSAMMENSETZUNGEN; VERFAHREN UND VORRICHTUNGENFÜRBLEIFREIESHOCHTEMPERATURLÖTMITTEL
公开(公告)号：EP1399600A4
公开(公告)日：2005-05-04
申请号：EP01948248
申请日：2001-05-28
申请人： HONEYWELL INT INC
发明人： LALENA JOHN , DEAN NANCY , WEISER MARTIN
IPC分类号： B23K35/00 , B23K35/26 , C22C5/02 , C22C12/00 , C22C13/00 , C22C13/02 , H01L21/60
CPC分类号： B23K35/264 , B23K35/00 , B23K2035/008 , C22C5/02 , C22C12/00 , C22C13/02 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/04026 , H01L2224/29 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/29298 , H01L2224/8319 , H01L2224/83801 , H01L2224/83805 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01056 , H01L2924/01058 , H01L2924/0106 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/00 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A lead-free solder (130) comprises an alloy of silver and bismuth in amounts of 2wt% to 18wt% and 98wt% to 82wt%, respectively. Contemplated alloys have a solidus of no lower than 262.5°C and a liquidus of no higher than 400°C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of the alloy.
摘要翻译：无铅焊料（130）包括合金，其包含量为2重量％至18重量％的Ag，98重量％至82重量％的Bi和0.1重量％的第三元素，至5.0重量％。第三元素选自Au，Cu，Pt，Sb，Zn，In，Sn，Ni和Ge。考虑的合金具有不低于230℃的固相线和不高于400℃的液相线。

7. 发明公开

EP1429884A4 IMPROVED COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER 有权
标题翻译： VERBESSERTE ZUSAMMENSETZUNGEN，VERFAHREN UND VORRICHTUNGENFÜREIN BLEIFREIES HOCHTEMPERATURLOT
公开(公告)号：EP1429884A4
公开(公告)日：2004-10-20
申请号：EP02799642
申请日：2002-09-25
申请人： HONEYWELL INT INC
发明人： DEAN NANCY , LALENA JOHN , WEISER MARTIN
IPC分类号： B23K35/00 , B23K35/22 , B23K35/26 , C22C1/02 , C22C12/00 , B23K1/00
CPC分类号： B23K35/264 , B23K35/007 , B23K2201/40 , H01L24/29 , H01L24/32 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A lead-free solder comprises an alloy of silver and bismuth in amounts of about 2 wt% to about 18 wt% and about 98 wt% to about 82 wt%, respectively. Contemplated alloys further comprise at least one of zinc, nickel, germanium or a combination thereof in an amount of up to about 1000 ppm (preferably about 500ppm) and have a solidus of no lower than about 262.5 DEG C and a liquidus of no higher than about 400 DEG C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of at least one of the constituents of the alloy, and particularly contemplated elements are phosphorus and germanium.
摘要翻译：无铅焊料包含量分别为约2重量％至约18重量％和约98重量％至约82重量％的银和铋的合金。考虑到的合金进一步包含至多约1000ppm（优选约500ppm）量的锌，镍，锗或其组合中的至少一种，并具有不低于约262.5℃的固相线和不高于约400℃。所考虑的合金可以进一步包含具有比合金的至少一种成分的氧亲和力更高的氧亲和力的化学元素，并且特别考虑的元素是磷和锗。

8. 发明专利

DE60126157T2 未知
公开(公告)号：DE60126157T2
公开(公告)日：2007-12-13
申请号：DE60126157
申请日：2001-05-28
申请人： HONEYWELL INT INC
发明人： LALENA JOHN , DEAN NANCY , WEISER MARTIN
IPC分类号： C22C13/00 , B23K35/00 , B23K35/26 , C22C5/02 , C22C12/00 , C22C13/02 , H01L21/60
摘要： A lead-free solder (130) comprises an alloy that includes Ag in an amount of 2 wt % to 18 wt %, Bi in an amount of 98 wt % to 82 wt %, and a third element in an amount of 0.1 wt % to 5.0 wt %. The third element is selected from the group consisting of Au, Cu, Pt, Sb, Zn, In, Sn, Ni and Ge. Contemplated alloys have a solidus of no lower than 230°C and a liquidus of no higher than 400°C.

9. 发明专利

AT351929T 未知
公开(公告)号：AT351929T
公开(公告)日：2007-02-15
申请号：AT01948248
申请日：2001-05-28
申请人： HONEYWELL INT INC
发明人： LALENA JOHN , DEAN NANCY , WEISER MARTIN
IPC分类号： B23K35/00 , B23K35/26 , C22C5/02 , C22C12/00 , C22C13/00 , C22C13/02 , H01L21/60
摘要： A lead-free solder (130) comprises an alloy that includes Ag in an amount of 2 wt % to 18 wt %, Bi in an amount of 98 wt % to 82 wt %, and a third element in an amount of 0.1 wt % to 5.0 wt %. The third element is selected from the group consisting of Au, Cu, Pt, Sb, Zn, In, Sn, Ni and Ge. Contemplated alloys have a solidus of no lower than 230°C and a liquidus of no higher than 400°C.

10. 发明专利

AU2003211032A1 SOLDER PASTE FORMULATIONS, METHODS OF PRODUCTION AND USES THEREOF 未知
公开(公告)号：AU2003211032A1
公开(公告)日：2003-09-04
申请号：AU2003211032
申请日：2003-02-12
申请人： HONEYWELL INT INC
发明人： LE KIM-CHI , LALENA JOHN , WEISER MARTIN
IPC分类号： B23K35/02 , B23K35/26 , B23K35/30 , B23K35/36 , H05K3/34 , B23K35/22 , B23K35/34

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