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1. 发明专利

JP2003153554A INVERTER DEVICE AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2003153554A
公开(公告)日：2003-05-23
申请号：JP2001347876
申请日：2001-11-13
申请人： HONDA MOTOR CO LTD , TOSHIBA CORP
发明人： NAKAMURA MASAMI , AMANO ATSUSHI , SHIMANE IWAO , DANJO YASUYUKI , SAITO JUICHI , OBE TOSHIHARU , TADA NOBUMITSU , SEKIYA HIRONORI
IPC分类号： H01L23/36 , H02M7/00 , H02M7/48 , H02M7/5387
摘要： PROBLEM TO BE SOLVED: To provide an inverter device which can enhance the capacity of current application by raising the cooling efficiency in an inverter main circuit, and can contribute to the downsizing and also can exhibit high reliability. SOLUTION: In an inverter device where the main circuit of a three-phase inverter having a plurality of arms is composed of a plurality of semiconductor chips for power, one arm of the three-phase inverter main circuit is constituted by connecting IGBTs 191A-191D as semiconductor chips 10 mm or under in size and diodes 201A-201C in parallel. Also, the IGBTs 191A-191D and the diodes 201A-201C in question are joined with a conductor 22 not less than 1.5 mm and not more than 5 mm in thickness, and this conductor is bonded to a cooler 24 via an insulating resin sheet 25 containing ceramics.

2. 发明专利

JP2019004016A パワー半導体モジュール审中-公开
公开(公告)号：JP2019004016A
公开(公告)日：2019-01-10
申请号：JP2017116791
申请日：2017-06-14
申请人： TOSHIBA CORP , TOSHIBA ENERGY SYSTEM & SOLUTION CORP
发明人： TADA NOBUMITSU , ICHIKURA YUTA , ITO HIROAKI , WATANABE NAOTAKE , OBE TOSHIHARU , TAKIMOTO KAZUYASU , HIRATSUKA DAISUKE , KURI YUUJI , SEKIYA HIRONORI , IIO HISATAKA , MATSUMURA HITOTSUGU
IPC分类号： H01L25/07 , H01L23/29 , H01L25/18
摘要：【課題】組み立てしやすく、かつ半導体装置の歩留まりを低下させることなく、大電流容量化を実現できるパワー半導体モジュールを提供すること。【解決手段】第1金属部材は、複数の第1凸部と、複数の第1凸部が配置された領域の周囲を連続して囲む環状部とを有する。第2金属部材は、第1凸部に対向して配置された複数の第2凸部を有する。サブモジュールは、第1凸部と第2凸部との間に配置され、半導体素子と、半導体素子の一方の面と第1凸部に接合された第3金属部材と、半導体素子の他方の面と第2凸部に接合された第4金属部材とを有する。樹脂は、環状部に囲まれた領域に設けられ、第1凸部と第3金属部材との接合部、および第2凸部と第4金属部材との接合部を覆う。【選択図】図1

3. 发明专利

JP2007049810A Semiconductor device for power converter and power converter with temperature protection function having the semiconductor device 审中-公开
标题翻译：用于电力转换器和功率转换器的半导体器件具有具有半导体器件的温度保护功能
公开(公告)号：JP2007049810A
公开(公告)日：2007-02-22
申请号：JP2005231036
申请日：2005-08-09
申请人： Toshiba Corp , 株式会社東芝
发明人： MORIKAWA RYUICHI , OBE TOSHIHARU , TADA NOBUMITSU , SEKIYA HIRONORI , NINOMIYA TAKESHI
IPC分类号： H02M7/48
CPC分类号： H01L2224/40
摘要： PROBLEM TO BE SOLVED: To precisely detect the temperature of a semiconductor device while preventing the reduction of an execution area of a power semiconductor element. SOLUTION: An IGBT (power semiconductor element) 17A is arranged on the cooling surface of a cooler 22 via an electric insulation body 23. A wide-width conductor 33A has first and second surfaces. A part of the first surface (lower surface) of the wide-width conductor 33A is electrically connected to the main-current output side of the IGBT 17A. The wide-width conductor 33A forms a current path of the IGBT 17A and a heat radiation path of a thermal loss of the IGBT 17A. A temperature sensor 16A is arranged on the second surface (upper surface) that corresponds to the part of the first surface of the wide-width conductor 33A. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了精确地检测半导体器件的温度，同时防止功率半导体元件的执行区域的减少。解决方案：IGBT（功率半导体元件）17A经由电绝缘体23布置在冷却器22的冷却表面上。宽宽度导体33A具有第一表面和第二表面。宽幅导体33A的第一面（下表面）的一部分与IGBT 17A的主电流输出侧电连接。宽幅导体33A形成IGBT 17A的电流路径和IGBT 17A的热损失的散热路径。温度传感器16A布置在对应于宽宽度导体33A的第一表面的一部分的第二表面（上表面）上。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004266139A Insulating substrate and semiconductor device using it 审中-公开
公开(公告)号：JP2004266139A
公开(公告)日：2004-09-24
申请号：JP2003055725
申请日：2003-03-03
申请人： Toshiba Corp , 株式会社東芝
发明人： SEKIYA HIRONORI , SHIMIZU TOSHIO , HIRAMOTO HIROYUKI
IPC分类号： H01L23/13
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/19107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an insulating substrate having high durability, high insulation and high heat radiation and having high reliability even when high voltage is applied, and to provide a semiconductor device using the insulating substrate. SOLUTION: In the insulating substrate arranging a conductive foil on the surface of a ceramic substrate 2A, the ceramic substrate 2A is constituted of laminating a plurality of ceramic plates 3, and respective laminated ceramic plates 3 are joined with each other through an insulating resin layer 4. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2001052577A VACUUM VALVE 失效
公开(公告)号：JP2001052577A
公开(公告)日：2001-02-23
申请号：JP22005299
申请日：1999-08-03
申请人： TOSHIBA CORP
发明人： KINOSHITA SUSUMU , SEKIYA HIRONORI , ITO YOSHIHIRO , MAKISHIMA SATOSHI , SATO JUNICHI , YOSHIDA TETSUO
IPC分类号： H01H33/66
摘要： PROBLEM TO BE SOLVED: To provide a vacuum valve securing a creeping distance between electrodes on the air side to allow miniaturization. SOLUTION: This vacuum valve has a structure support material 2 made of an epoxy resin; a vacuum valve body 15 and an insulation material 3 made of the same epoxy resin as the structure support material 2 (or various kinds of insulative thermosetting resins, a highly electrically insulative thermoplastic resin, an insulative elastomer or the like) filled in a gap between the structure support material 2 and the vacuum valve body 1 over the whole side face of the vacuum valve body 1 (or only a portion of the side face). Thereby, a creeping distance between electrodes on the air side can be secured.

6. 发明专利

JP2000323597A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000323597A
公开(公告)日：2000-11-24
申请号：JP13458899
申请日：1999-05-14
申请人： TOSHIBA CORP
发明人： HIRAMOTO HIROYUKI , SEKIYA HIRONORI , SHIMIZU TOSHIO , KIJIMA KENJI
IPC分类号： H01L23/02 , G01N21/81 , G01N27/02
摘要： PROBLEM TO BE SOLVED: To prevent destruction of a semiconductor element due to electrical discharge, when the insulating characteristic of a synthetic resin within a case is impaired due to moisture absorption. SOLUTION: Electrodes 11, formed of opposed plates are arranged within a case 6 such that a silicone gel 9, which is a synthetic resin comes in contact with the electrodes 11 and such that the electrodes 11 are free of the influence of a voltage at external terminal leads 7, etc., extending from the electrodes of a semiconductor element 3. A measuring instrument connected to the electrodes 11 through leads 12 measures humidity from the dielectric constant or insulation resistance of the gel 9. The user of a semiconductor device avoids starting the semiconductor device when determined from the measured humidity that the gel 9 has absorbed moisture.

7. 发明专利

JP2000150724A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000150724A
公开(公告)日：2000-05-30
申请号：JP32406798
申请日：1998-11-13
申请人： TOSHIBA CORP
发明人： HIRAMOTO HIROYUKI , SEKIYA HIRONORI , SHIMIZU TOSHIO , KIJIMA KENJI , SATO KAZUHIRO
IPC分类号： H01L25/07 , H01L23/28 , H01L23/29 , H01L23/31 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To improve reliability to dielectric breakdown, by preventing generation of creeping discharge on an interface between an insulating board and filler in an end portion of a power source board, and preventing generation of creeping breakdown. SOLUTION: A creeping breakdown preventing member 11 is arranged between the end portion of a power source board 3 on which a semiconductor element 1 is mounted and an insulating board 4 on which the power source board 3 is mounted. The creeping breakdown preventing member 11 has high breakdown voltage as compared with filler 10 and has high bonding force to the insulating board 4. The creeping breakdown preventing member 11 has high dielectric constant as compared with the filler 10. For example, a copper plate is used for the power source board 3, aluminum nitride is used for the insulating board 4, and silicone gel is used for the filler 10. Epoxy resin or polyester resin or epoxy resin into which powder increasing dielectric constant is mixed or silicone gel into which powder increasing dielectric constant is mixed can be used for the creeping breakdown preventing member 11.

8. 发明专利

JPH10308129A RESIN MOLDED PART 失效
公开(公告)号：JPH10308129A
公开(公告)日：1998-11-17
申请号：JP11765897
申请日：1997-05-08
申请人： TOSHIBA CORP
发明人： SHIMIZU TOSHIO , KINOSHITA SUSUMU , MAKISHIMA SATOSHI , SEKIYA HIRONORI , MIYAGAWA MASARU
IPC分类号： H01B17/58
摘要： PROBLEM TO BE SOLVED: To easily separate an enclosed part and a thermosetting rein from each other, and reuse respective ones as resources by arranging a separating part separable by external stimulation on an interface between the enclosed part and the thermosetting resin to mold it. SOLUTION: A coating layer 4 composed of low melting point metal or a thermoplastic resin or the like is stuck to a periphery of a conductor 2, and is incorporated into a metal mold, and a bushing is constituted by hardening a periphery by an injection mold resin. The conductor 2 is composed of metal such as copper and steel, and the coating layer 4 having a thickness of 0.5 mm is formed by being pulled up after being soaked in a melting basin of 350 deg.C of low metaling point metal, for example, solder after a sand blast is performed on a surface. In a standard of a switch gear, the highest working temperature is regulated to 115 deg.C. On the other hand, in disassembling, a temperature is held at 300 deg.C, and when an end part of the conductor 2 is struck by a hammer, the conductor 2 can be easily pulled out.

9. 发明专利

JPH08316023A SUPERCONDUCTING COIL AND ITS MANUFACTURE 失效
公开(公告)号：JPH08316023A
公开(公告)日：1996-11-29
申请号：JP11961195
申请日：1995-05-18
申请人： TOSHIBA CORP
发明人： SEKIYA HIRONORI , MORIYAMA HIDESHIGE
IPC分类号： H01F27/32 , H01F6/06
摘要： PURPOSE: To effectively suppress quenching by improving the sticking force between adjacent fusion bonded superconducting leads, and reducing its crack, release and the movement of the leads. CONSTITUTION: A superconducting coil is formed by forming fusion bonded superconducting lead 1 by covering an insulated superconducting lead 2 with a fusion bonding material 3, winding the leads 1 in a plurality of rows and a plurality of layers on a spool, heat-treating the material 3 to be melted, then solidifying the material 3 to stick between the leads 1, and disposing a fusion bonded insulator made of the material 3 and textile insulator 5 in the gap between the adjacent leads 1.

10. 发明专利

JPH0794318A SUPERCONDUCTING COIL AND FIBER REINFORCED RESIN INSULATOR 失效
公开(公告)号：JPH0794318A
公开(公告)日：1995-04-07
申请号：JP23812093
申请日：1993-09-24
申请人： TOSHIBA CORP
发明人： SEKIYA HIRONORI , HIRAI HISASHI
IPC分类号： H01F6/06 , H01B3/30
摘要： PURPOSE:To suppress the mechanical and electrical damage caused by the exfoliation inside a superconducting coil due to the deterioration in adhesive force of a fiber reinforced resin insulator by increasing the adhesive force between superconducting bodies. CONSTITUTION:A fiber-reinforced resin insulator 12 is composed of a fiber- reinforced resin layer 13 formed by insulative resin and fiber and a thermoplastic adhesive resin layer 14 which is provided on one surface of the fiber- reinforced resin layer 13. A superconducting conductor 11 is multiply-wound through the intermediary of the fiber-reinforced resin insulator 12, the wound superconducting conductor 11 is heat-treated, and the adjacent superconducting conductors 11 and 11 are adhered.

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