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1. 发明专利

JPH08152314A INSPECTION EQUIPMENT FOR ELECTRONIC DEVICE 失效
公开(公告)号：JPH08152314A
公开(公告)日：1996-06-11
申请号：JP29424894
申请日：1994-11-29
申请人： HITACHI LTD , HITACHI VIDEO IND INF SYST INC
发明人： DOI HIDEAKI , KENBO YUKIO , NOGUCHI MINORU , MORIOKA HIROSHI , NISHIYAMA HIDETOSHI , MINAMITANI NORIHIRO , TAKEI SATOSHI , OSHIMA YOSHIMASA , WATANABE KENJI , MATSUOKA KAZUHIKO , SHIGYO YOSHIHARU
IPC分类号： G01B11/24 , G01B11/245 , G01B11/30 , G01N21/88 , G01N21/94 , G01N21/956 , H01L21/66 , H05K3/00
摘要： PURPOSE: To alter the inspection rate depending on the object to be inspected by providing a circuit for outputting a control signal corresponding to the speed of a stage and altering the signal processing rate depending on the control signal. CONSTITUTION: An object 22 mounted on a stage 10 is illuminated by means of an illumination optical system 12 and the optical image of the object 22 is detected by a linear sensor 14 in a detection optical system 13 which then delivers an image signal 100 to a sensor signal processing circuit 17. Based on control information 103 received from a control board 21, a control circuit 20 delivers a signal 104 to a stage control circuit 15, a timing data 105 to a sensor drive circuit 16, a signal 106 to the circuit 17, and a synchronism control data 107 to a synchronism signal generation circuit 19. The circuit 15 drives a motor 11 with the signal 104 to control the stage. The circuit 19 generates a signal 108 based on the data 107 and delivers the signal 108 to the circuit 16. The circuit 16 drives the sensor 14 and the circuit 17 with a timing pulse 109 based on the data 105. Consequently, the object can be inspected at an optimal rate without requiring any modification of hardware.

2. 发明专利

DE2753593A1 未知
公开(公告)号：DE2753593A1
公开(公告)日：1978-08-17
申请号：DE2753593
申请日：1977-12-01
申请人： HITACHI LTD
发明人： KUNI ASAHIRO , AKIYAMA NOBUYUKI , OSHIMA YOSHIMASA
IPC分类号： G01B11/02 , G01B11/24 , G06K9/00 , G01N21/32 , G01M11/00
摘要： An apparatus for examining an object such as a contact welded on a leaf spring in respect of geometrical and qualitative factors comprises an image pick-up device such as TV camera for detecting an optical image of the contact and the leaf spring having a dark portion along the contour of the contact and converting the optical image into corresponding video signals which are then compared with a predetermined threshold level to be converted into a binary encoded signal having two logic levels corresponding, respectively, to bright and dark portions of the optical image. Frequency distributions of the binary signal representing the dark portion are determined along two orthogonal directions thereby to define a coordinate of a region in which the contact is located. A first checking device is provided to determine if the above coordinate is located in a preset allowable tolerance range. A second checking device is additionally provided which serves to define a frame of a size differed from that of the contact in dependence on the coordinate thereby dividing the area within the frame into a predetermined number of picture elements in a matrix array, whereby faults of the contact such as injury, welding dust or deformation are detected in dependence upon a predetermined combination of the picture element signals representing the dark portions of the optical image.

3. 发明专利

DE3274015D1 PATTERN DETECTION SYSTEM 未知
公开(公告)号：DE3274015D1
公开(公告)日：1986-12-04
申请号：DE3274015
申请日：1982-07-12
申请人： HITACHI LTD
发明人： HARA YASUHIKO , AKIYAMA NOBUYUKI , FUSHIMI SATORU , OSHIMA YOSHIMASA , AOKI NOBUHIKO
IPC分类号： G01N21/956 , G01R31/308 , G03F7/20 , G01M11/00 , G01B11/02 , G01N21/88 , G01R31/28
摘要： A pattern detection system for inspecting defects in fine or minute patterns such as photomask patterns at a fast speed is disclosed. The system comprises an illuminator, a device for moving objects with the patterns to be inspected with being illuminated by the illuminator, an optical system for imaging the objects, a scanner for scanning the objects in a direction intersected at a given angle with respect to direction of the objects moved by the moving device and arrays of photosensors arranged linearly in a direction perpendicular to that of images on the objects scanned by the scanner, on the surface of which the images are formed by the optical system and for producing respective outputs parallelly on the time basis.

4. 发明专利

JP2005300553A Defect inspection device and method 有权
标题翻译：缺陷检查装置和方法
公开(公告)号：JP2005300553A
公开(公告)日：2005-10-27
申请号：JP2005172304
申请日：2005-06-13
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , MATSUMOTO SHUNICHI , KENBO YUKIO , MATSUNAGA RYOJI , SAKAI SHIGETOSHI , NINOMIYA TAKANORI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , MORISHIGE YOSHIO , CHIKAMATSU SHUICHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a defect inspection device and method, capable of improving detection sensitivity and throughput by realizing, at the detecting of defects, such as a foreign matter generated in a manufacturing process for forming a pattern on a substrate to produce an object, a linear high-efficiency lighting from a direction on which no diffracted light from the pattern is incident in order to reduce the diffracted light, and setting a threshold according to the dispersion of signals by patterns. SOLUTION: Scattered light, from the pattern that causes dispersion of signals, is reduced by a high-efficiency lighting optical system, lighting from a direction reducing the scattered light from the pattern, and the detection threshold is reduced by a means which sets the threshold, based on the dispersion of signals calculated each area within a chip, whereby improvement in the detection sensitivity and improvement in throughput are realized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种缺陷检查装置和方法，其能够通过在检测诸如在用于在基板上形成图案的制造工艺中产生的异物等缺陷的检测来提高检测灵敏度和生产率为了产生物体，从不存在来自图案的衍射光入射的方向的线性高效照明，以便减少衍射光，并根据图案的信号色散设置阈值。解决方案：通过高效率照明光学系统减少来自引起信号色散的图案的散射光，从减少来自图案的散射光的方向进行照明，并且通过以下方式减少检测阈值：基于芯片内每个区域计算的信号的色散设置阈值，从而实现检测灵敏度的提高和吞吐量的提高。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2004177284A Defect inspecting apparatus and defect inspection method 有权
公开(公告)号：JP2004177284A
公开(公告)日：2004-06-24
申请号：JP2002344327
申请日：2002-11-27
申请人： Hitachi Electronics Eng Co Ltd , Hitachi Ltd , 日立電子エンジニアリング株式会社 , 株式会社日立製作所
发明人： UTO YUKIO , NOGUCHI MINORU , NISHIYAMA HIDETOSHI , OSHIMA YOSHIMASA , HAMAMATSU REI , JINGU TAKAHIRO , NAKADA TOSHIHIKO , WATANABE MASAHIRO
IPC分类号： G01N21/956 , G01N21/95 , G06T7/00
CPC分类号： G01N21/00 , G01N21/9501 , G06T7/0004 , G06T2207/30148
摘要： PROBLEM TO BE SOLVED: To provide a defect inspecting apparatus and its method for sensitively and quickly inspecting defects, such as minute foreign particles, flaws, etc. of the order of 0.1μm on an inspection substrate, such as a wafer having a transparent thin film on a surface, a wafer having a circuit pattern, etc. SOLUTION: The defect inspecting apparatus is provided with an illumination optical system 10 for irradiating an illumination light flux on a surface of the inspection substrate 1 at a determined tilt angle and a detection optical system 200, having an upward detection optical system 20 for detecting upwardly reflected and scattered light which is emitted upwardly from the inspection substrate 1 and a lateral detection optical system 600 for detecting the lateral reflected scattered light emitted from the inspection substrate 1, in a direction inclined with respect to the direction for two-dimensionally intersecting the illumination light flux. COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2003098111A METHOD FOR INSPECTING DEFECT AND APPARATUS THEREFOR 审中-公开
公开(公告)号：JP2003098111A
公开(公告)日：2003-04-03
申请号：JP2001288013
申请日：2001-09-21
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： NISHIYAMA HIDETOSHI , NOGUCHI MINORU , OSHIMA YOSHIMASA , HAMAMATSU REI , WATANABE KENJI , WATANABE TETSUYA , JINGU TAKAHIRO
IPC分类号： G01B11/30 , G01B11/24 , G01N21/956 , G06T1/00 , G06T7/60 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To solve the problem that it takes an enormous amount of time to analyze detected foreign objects when the number of detected objects by an inspecting apparatus is large, leading to a delay in taking countermeasures against failures of a manufacturing process while a total number of detected objects is outputted as the detected result of the foreign object defect-inspecting apparatus and the countermeasure against failures of the manufacturing process is taken by analyzing foreign objects/defects detected by the inspecting apparatus conventionally. SOLUTION: In the defect inspecting apparatus which inspects by an optical system, failure causes are related to sizes of foreign objects or defects in the result, and a data processing means points out the failure cause from statistics of the inspection result and displays information on the inspection result. A threshold where a semiconductor wafer or the like becomes defective is set for each region of the semiconductor wafer or the like, and a defect analysis is carried out by statistically evaluating foreign objects.

7. 发明专利

JP2003035680A Inspection method for semiconductor device 有权
标题翻译：半导体器件检测方法
公开(公告)号：JP2003035680A
公开(公告)日：2003-02-07
申请号：JP2001222405
申请日：2001-07-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HAMAMATSU REI , NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI
IPC分类号： G01N23/225 , G01N21/95 , G01N21/956 , G06T1/00 , H01L21/00 , H01L21/66
CPC分类号： H01L21/67271 , G01N21/9501 , G01N21/95607 , G01N2021/95615
摘要： PROBLEM TO BE SOLVED: To apply a technique for enhancing the operating efficiency of an inspection when various conditions required for the inspection are set in the technique for inspecting a fine circuit pattern by using an image formed by irradiating white light, laser beam or electron beam. SOLUTION: An inspection apparatus for a semiconductor device is provided with a function by which a plurality of parameters of the inspection apparatus can be automatically set by using design data on the semiconductor device.
摘要翻译：要解决的问题：在通过使用通过照射白光，激光束或电子束形成的图像来设置用于检查精细电路图案的技术中，在检查所需的各种条件下，应用用于提高检查的操作效率的技术。解决方案：一种用于半导体器件的检查装置具有通过使用半导体器件上的设计数据能够自动设置检查装置的多个参数的功能。

8. 发明专利

JP2002310932A METHOD AND SYSTEM OF MONITORING SEMICONDUCTOR DEVICE TREATMENT DEVICE 审中-公开
公开(公告)号：JP2002310932A
公开(公告)日：2002-10-23
申请号：JP2002026239
申请日：2002-02-04
申请人： HITACHI LTD
发明人： MORIOKA HIROSHI , NOGUCHI MINORU , OSHIMA YOSHIMASA , KENBO YUKIO
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a foreign-body inspection apparatus by which defects in large quantities can be prevented and by which a yield is maintained in the mass-production line of a semiconductor production process. SOLUTION: The method and the system are achieved in such a way that, in the mass production line of the semiconductor production process, the foreign-body inspection apparatus is miniaturized and that the foreign-body inspection apparatus is placed on a conveyance system between the input port and the output port of a treatment device in a semiconductor production line or between treatment devices. The apparatus which detects a foreign body on a repetitive pattern part on a wafer by a refractive index change-type lens array, a spatial filter and a pattern-information removal circuit is provided, and the foreign body on the wafer being conveyed can be inspected. In the mass production line of the semiconductor production process, the foreign body is monitored by a simple monitoring device, the weight of the production line is reduced, and the production cost of the production line can be reduced. Since the monitoring device can perform a real-time sampling operation, it is possible to prevent the defects in large quantities which are fatal to the yield, and an effect to ensure the yield stably is obtained.

9. 发明专利

JP2000105203A DEFECT INSPECTING DEVICE AND METHOD 失效
公开(公告)号：JP2000105203A
公开(公告)日：2000-04-11
申请号：JP20607899
申请日：1999-07-21
申请人： HITACHI LTD , HITACHI ELECTR ENG
发明人： NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , MATSUMOTO SHUNICHI , KENBO YUKIO , MATSUNAGA RYOJI , SAKAI SHIGETOSHI , NINOMIYA TAKANORI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , MORISHIGE YOSHIO , CHIKAMATSU SHUICHI
IPC分类号： G01B11/30 , G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To quickly and precisely inspect a defect such as a very small contaminant by calculating dispersion based on signals in a portion with the same circuit patterns formed or in its vicinity, and by extracting a signal indicating the defect such as the very small contaminant out of detected signals based on a threshold set on the basis of a result calculated hereinbefore. SOLUTION: An illumination optical system 100 having a laser beam 101, lenses 102-104, a beam splitter and the like has a precdribed inclination with respect to a main straight line group of a circuit pattern, and an inspected objective substrate 1 is irradiated subtantially orthogonally to a traveling direction of a substrate mounting table 304 for mounting the objective substrate 1. An inspecting optical system 200 detects reflected scattered light provided by a defect such as a contaminant existing on the substrate 1, using image sensors 205, 206 through lenses 201, 203 and a beam aplitter 204, to feed signals to a processing circuit 400. A threshold as a determination reference is set in a defect determining process in the circuit 400 based on a dispersion of the resulting signals, and the signal indicating the defect such as the contaminant is extracted, based on the set threshold.

10. 发明专利

JPH04152545A INSPECTION METHOD OF FOREIGN BODY 失效
公开(公告)号：JPH04152545A
公开(公告)日：1992-05-26
申请号：JP27625390
申请日：1990-10-17
申请人： HITACHI LTD
发明人： MORIOKA HIROSHI , NOGUCHI MINORU , OSHIMA YOSHIMASA , KENBO YUKIO , TANIGUCHI YUZO
IPC分类号： G01N21/88 , G01N21/00 , G01N21/94 , G01N21/956 , H01L21/66
摘要： PURPOSE:To prevent defects in large quantities and to maintain a yield by installing a foreign-body monitor which measures, in real time, foreign bodies on a specimen while the specimen is being conveyed in a manufacturing apparatus. CONSTITUTION:At a method to inspect foreign bodies on the face of a specimen when a semiconductor or the like is manufactured, a foreign-body monitor which measures, in real time, the foreign bodies on the specimen 11 during the conveyance of the specimen 11 in a manufacturing apparatus is installed. For example, a product wafer 11 is irradiated with beams of light which is modulated by a pulse light-emitting operation from a high-angle illumination optical system 41 and a low-angle illumination optical system 42; their scattered lights are detected by using a detector 45 using a linear sensor through a polarization plate 44. In addition, their signals are demodulated respectively by using demodulators; a detection output H by means of the high-angle illumination optical system 41 and a detection output L by means of the low-angle illumination optical system 42 are obtained simultaneously. Individual data by repeating the detection output L on the axis of abscissas and by representing the detection output H on the axis of ordinates are classified by using a foreign-body and pattern discrimination curve 47. Thereby, foreign bodies 48 are discriminated from patterns 49.

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