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1. 发明专利

JPH04253414A BRANCH FILTER USING SURFACE ACOUSTIC WAVE RESONATOR COMPOSITE FILTER 失效
公开(公告)号：JPH04253414A
公开(公告)日：1992-09-09
申请号：JP961591
申请日：1991-01-30
申请人： HITACHI LTD , HITACHI VIDEO & INF SYST
发明人： TABUCHI TOYOJI , HIKITA MITSUTAKA , SHIBAGAKI NOBUHIKO , AKAGI TAKATOSHI , SUZUKI KAZUTOSHI
IPC分类号： H03H9/25 , H03H9/64
摘要： PURPOSE:To reduce energy consumption by deciding the arrangement and connecting method of one-opening surface acoustic wave resonators so that an impedance characteristic on the side or a common terminal can have reactivi ty. CONSTITUTION:With a single antenna 1 as the common terminal, a filter 2 for reception and a filter 3 for transmission are parallelly connected. In this case, the four one-opening surface acoustic wave resonators composed of electrodes 4-1-4-6 or the like and gap capacitors composed of electrode patterns 5-1 and 5-2 are provided and formed on a piezoelectric substrate 7, which can propagate surface acoustic waves, so as to be used as the filter 3 for transmission. Further, acoustic absorbing materials 6-1-6-6 for absorbing the surface acoustic waves and inductances 8-1-8-4 for matching an outside circuit are provided. Moreover, each one-opening surface acoustic wave resonator is composed of an equivalent inductance 11-1, equivalent capacitor 12-1 and electrostatic capacitor 13-1.

2. 发明专利

JPH0738221A HYBRID INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH0738221A
公开(公告)日：1995-02-07
申请号：JP18245893
申请日：1993-07-23
申请人： HITACHI LTD , HITACHI VIDEO & INF SYST
发明人： SUZUKI KAZUTOSHI , WATANABE HIDEAKI
IPC分类号： H01L23/12 , H01L23/50 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H05K3/40
摘要： PURPOSE:To prevent a loose state of solder in connection when a hybrid integrated circuit device is mounted on a mounting board. CONSTITUTION:In a hybrid integrated circuit device, a conductive pattern is formed on a dielectric-based board 1, and active and passive components are mounted with solder. The hybrid integrated circuit device is put in electric connection on a mounting board 7. In the board 1, a terminal electrode 3 is connected with a terminal electrode 2 through a through hole 4. When a terminal electrode 6 on the board 7 and the terminal electrode 3 on the connection side of the board 1 are joined with solder 5, the solder 5 goes upward through the through hole 4 and appears in sight at the terminal electrode 2 to be connected. In this way, a loose state of solder in connection between the hybrid integrated circuit device and a mounting board can be detected easily, and the loose state in an early manufacturing step can be prevented.

3. 发明专利

JPH04301909A SIGNAL DISTRIBUTOR 失效
公开(公告)号：JPH04301909A
公开(公告)日：1992-10-26
申请号：JP6596791
申请日：1991-03-29
申请人： HITACHI LTD , HITACHI FERRITE LTD , HITACHI VIDEO & INF SYST
发明人： SUZUKI KAZUTOSHI , HIKITA MITSUTAKA , ISHIDA YOSHIKATSU , AKAGI TAKATOSHI , TANAKA SATOSHI
IPC分类号： H03H7/48 , H01P5/16 , H03H7/21
摘要： PURPOSE:To constitute and miniaturize the signal distributor without using any microstrip lines. CONSTITUTION:The twisted lines of insulated cover lines 6 and 6A connected to an input terminal 1 are divided, the lines 6 and 6A are wound around a troidal core 5 more than once from mutually reverse directions, insulated cover line end parts 6-1 and 6A-1 are connected to the input terminal 1, an insulated cover line end part 6-2 is connected to an output terminal 4, and an end part 6A-2 is connected to an output terminal 3. Three insulated cover lines 7, 7A and 7B are twisted and wound around the troidal core more than once, insulated cover line end parts 7-1, 7A-1, 7B-1, 7-2, 7A-2 and 7B-2 are twisted once outside the troidal core, the 7-1 is connected to the output terminal 3, the 7B-1 is connected to an input terminal 2, the 7A-1 is connected to the output terminal 4, and the 7A-2, 7-2 and 7B-2 are connected to a ground conductor. On the other hand, when a signal is inputted to one input terminal, the signals of the mutually same phase component are outputted to the output terminals and when a signal is inputted to the other input terminal, the signals of mutually reverse phase components are outputted to the output terminals.

4. 发明专利

JP2009076222A Ion source, ion concentration apparatus using the same, and method for operating ion source 有权
标题翻译：离子源，离子浓度测定装置以及使用离子源的方法
公开(公告)号：JP2009076222A
公开(公告)日：2009-04-09
申请号：JP2007241827
申请日：2007-09-19
申请人： Hitachi Ltd , Natl Inst Of Radiological Sciences , 株式会社日立製作所 , 独立行政法人放射線医学総合研究所
发明人： TSUCHIDA KAZUTERU , IZUMIDA TATSUO , SUZUKI KAZUTOSHI , WAKAI ATSUSHI
IPC分类号： H01J49/16 , G01N27/62 , G01T1/161 , G21K1/00
摘要： PROBLEM TO BE SOLVED: To provide an ion source which efficiently ionizes a sample gas with a laser light source that emits low-pulse laser light, and to provide a concentration apparatus using the ion source.
SOLUTION: The ion source 3A comprises a sample cell S formed of an electrode 11A, an ion extracting electrode 21A, etc., an electrostatic lens 22A, and a laser emitting means including laser light sources 23A and 23B, a mirror 25A, and a lens 27A. The electrode 11A is cooled by a cooling medium, and has a sample gas passage 15 formed to provide a communicating passage leading to a nozzle 15a towards an inner peripheral surface 11b. The lens 27A is composed of a pair of cylindrical lenses arranged with a given gap. The lens 27A works as a convex lens to condense parallel beams of detaching laser light R
A and ionizing laser light R
B to cause the beams to pass through openings 21a and 22a, so that the beams passing through openings 21a and 22a widen to irradiate a wide area of the inner peripheral surface 11b.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种离子源，其利用发射低脉冲激光的激光源有效地将样品气体电离，并提供使用该离子源的浓缩装置。解决方案：离子源3A包括由电极11A，离子提取电极21A等形成的样品池S，静电透镜22A和包括激光源23A和23B的激光发射装置，反射镜25A ，以及透镜27A。电极11A被冷却介质冷却，并具有形成为提供通向喷嘴15a的连通通道朝向内周面11b的样品气体通道15。透镜27A由配置有给定间隙的一对柱面透镜构成。透镜27A作为凸透镜来使分离激光R SB和A B的平行光束和离子化激光R SB B 共振，使光束通过开口21a和22a，使得穿过开口21a和22a的光束变宽以照射内周面11b的宽的区域。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2004207287A Soldering land and printed wiring board 审中-公开
公开(公告)号：JP2004207287A
公开(公告)日：2004-07-22
申请号：JP2002371299
申请日：2002-12-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KAWAMATA TETSUJI , HACHIYA TOSHIHIRO , SUZUKI KAZUTOSHI , ENDO YASUHIKO , YAMAZOE YASUO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering land and a printed wiring board which are capable of restraining solder balls from being produced upon soldering by reflow heating, and realizing high density mounting.
SOLUTION: As to the soldering land, the formed structure of a solder resist on a part of the land covered with a chip to mount is set different from that on the other part of the land not covered with the chip. Concretely, the solder resist is eliminated from only the area of the soldering land that is covered with the chip to mount. By this setup, solder protruding from the soldering land can be easily returned to the soldering land at reflow heating.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2001210984A RADIATING STRUCTURE OF PART 失效
公开(公告)号：JP2001210984A
公开(公告)日：2001-08-03
申请号：JP2000023289
申请日：2000-01-27
申请人： HITACHI LTD
发明人： SUZUKI KAZUTOSHI , KAWAMATA TETSUJI , YAMAOKA MITSUO
IPC分类号： H05K7/20 , H01L23/40 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To miniaturize a flexible board, in the connection of the flexible board with a heat radiation plate. SOLUTION: The miniaturization of a flexible board is so achieved that on one portion present on a base-film side of the flexible board which dos not overlap in facing with the land of a part attached to a cover-film side of the flexible board, a land for connecting the flexible bard with a heat radiation plate is formed, and then, the formed land is connected with the heat radiation plate.

7. 发明专利

JPH11251730A SOLDERING OF COMPONENT 失效
公开(公告)号：JPH11251730A
公开(公告)日：1999-09-17
申请号：JP4916098
申请日：1998-03-02
申请人： HITACHI LTD
发明人： SUZUKI KAZUTOSHI , ENDO YASUHIKO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent the generation of solder balls and thereby make a sure connection, by printing solder paste in such a shape as to have a recessed cutout section nearly at the center on the side a plurality of lands are opposite to each other. SOLUTION: At the positions on a printed wiring board 1 where electrodes 3 of a chip component 2 are to be connected, a plurality of lands 4 are formed. Then, solder paste is printed on the lands 4 using a solder mask. The solder mask has such a shape as to have projecting sections 5a covering parts of the lands 4 nearly at the center on the side the two lands 4 are opposite to each other. By printing the solder paste with the solder mask of such a shape, solder paste is not printed on the projecting sections 5a, and therefore the solder paste 5 is printed in such a shape as to have a recessed cutout 5b on the side the lands 4 are opposite to each other. After printing the solder paste 5 on the printed wiring board 1 in this manner, a chip component 2 is mounted and heated.

8. 发明专利

JPH05191152A FREQUENCY CONVERTING CIRCUIT DEVICE 失效
公开(公告)号：JPH05191152A
公开(公告)日：1993-07-30
申请号：JP449392
申请日：1992-01-14
申请人： HITACHI LTD
发明人： SUZUKI KAZUTOSHI , HIKITA MITSUTAKA
IPC分类号： H03D7/12 , H04B1/26 , H04B15/06
摘要： PURPOSE:To improve the secondary mutual modulating distortion characteristic of a frequency converting circuit device and also to reduce the power consumption of the circuit device. CONSTITUTION:When a reception signal and a local oscillation signal are inputted to an input terminal 1, an intermediate frequency signal is outputted to an output terminal 2 by a non-linear action of an amplifying element FET 14 which has the large conversion gain with a low current. Meanwhile the disturbing waves are generated from the local oscillation signal and a spurious signal (local oscillation signal + or - (intermediate frequency signal)/2) and emerge in an intermediate frequency band. In this respect, a capacitor 11 and a resistor 6 are connected in series at the output side of the FET 14 and then connected to an earth conductor or an earth terminal. So that the conversion gain is suppressed down to a desired level and the higher harmonic component double as much as the local oscillation signal and the spurious signal that cause the disturbing waves is attenuated so as not to deteriorate the secondary mutual modulating distortion characteristic by an extent lower than the gain drop.

9. 发明专利

JPH0490628A LOW NOISE AMPLIFIER 失效
公开(公告)号：JPH0490628A
公开(公告)日：1992-03-24
申请号：JP20675990
申请日：1990-08-06
申请人： HITACHI LTD
发明人： SUZUKI KAZUTOSHI , HIKITA MITSUTAKA
IPC分类号： H04B1/3822 , H04B1/40
摘要： PURPOSE:To realize low power consumption while maintaining required performance by obtaining required gain with the use of a second auxiliary circuit at all times regardless of the switching of the current or voltage of an amplifier element by a first auxiliary circuit. CONSTITUTION:A first auxiliary circuit 15 realizes the low power consumption by sufficiently reducing the current or voltage of an amplifier element 6 when transmission power is small or a radio terminal equipment is in the state of waiting, the gain of the amplifier element 6 is also changed by the switching of this current or voltage. A second auxiliary circuit 12 controls the amount of negative feedback of the amplifier element 6 as soon as the current or voltage of the amplifier element 6 is switched by the first auxiliary circuit 15, and the required gain is maintained by this switching of the first auxiliary circuit 15. Thus, the low power consumption can be realized without deteriorating the reception performance.

10. 发明专利

JP2006179556A Method of repairing electronic part 审中-公开
标题翻译：修复电子部件的方法
公开(公告)号：JP2006179556A
公开(公告)日：2006-07-06
申请号：JP2004368981
申请日：2004-12-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAKAMURA MASATO , HACHIYA TOSHIHIRO , ISHIDA YOSHIKATSU , SUZUKI KAZUTOSHI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To achieve a method of repairing an electronic part which displays excellent connection reliability.
SOLUTION: In an electronic part dismounting process in a repairing work, the electronic part is dismounted after it is subjected to a thermal treatment process containing a thermal treatment condition under which a connection interface between lands located on a mounting board and solders decreases remarkably in strength, then the residual solder is mechanically removed, and a substitute electronic part is remounted and connected.
COPYRIGHT: (C)2006,JPO&NCIPI

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