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    • 3. 发明专利
    • FORMATION OF COMPOSITE PIEZOELECTRIC MATERIAL
    • JPS62122499A
    • 1987-06-03
    • JP26122085
    • 1985-11-22
    • HITACHI LTDHITACHI METALS LTDHITACHI MEDICAL CORP
    • NAKATANI CHITOSETAKEUCHI HIROYUKIKATAKURA KAGEYOSHINAGASAWA MASAYUKI
    • A61B8/00H04R17/00H04R31/00
    • PURPOSE:To accurately and easily manufacture a composite piezoelectric material that formerly is hard to work by forming a cut groove form the front surface of a resonator while remaining a part of its thickness, packing a resin in the said groove, and cutting off the unnecessary part of the resonator from its rear surface. CONSTITUTION:The resonator 201 is temporarily adhered on a block 203 having excellent parallelism and flatness with a resin 202 softened when wax or the like is heated. Then a cut groove 204 is formed to the depth of t1 longer than the thickness of the composite piezoelectric material to be formed in matrix state in the resonator 201 while leaving a part of the thickness by means of a diesing saw. A resin such as polyurethane or epoxy resin 206 is packed and cured in the groove 204. Then the resin 202 is melted. The resonator 201 is turned over, and temporarily adhered on the block having the excellent parallelism and flatness 207 with wax, etc. 208. Thereafter, the unnecessary part of the resonator 201 is sequentially cut off from the edge by using a thicker blade 209 so that the depth of the cut-off part is made equal to the thickness t2 of the composite piezoelectric material to be formed. Finally, the material is stripped off from the block 207 to obtain the composite piezoelectric material.