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1. 发明专利

JPS62268152A SEMICONDUCTOR DEVICE FOR IGNITER 失效
公开(公告)号：JPS62268152A
公开(公告)日：1987-11-20
申请号：JP11077786
申请日：1986-05-16
申请人： HITACHI LTD , HITACHI HARAMACHI SEMI CONDUCT
发明人： KAMIYA SHIGERU , KOMINE MITSURU , YOSHINO KATSUNOBU
IPC分类号： H01L25/07 , F02P3/04 , F02P15/00
摘要： PURPOSE:To improve the degree of freedom in the case of packaging to an engine by connecting diodes fitted between two pairs of ignition plugs in antiparallel, using secondary side terminal sides as common terminals, and molding the diodes with an insulating resin. CONSTITUTION:A primary side midpoint E is connected to a power supply, and the series circuits of diodes 31-34 and ignition plugs 41-44 are each connected in antiparallel between a pair of terminals on the secondary side of a coil 1 and ground potential at every two. High voltage where polarity is inverted in succession is induced on the secondary side of the coil 1 by alternately switching switches 21 and 22 in a distributor-less-ignition-system. When high voltage having polarity shown in the figure is generated on the secondary side of the coil 1, discharge currents flow through the diode 31, the plug 41, the plug 44 and the diode 34, spark discharge is generated in the plugs 41 and 44, and the diodes 32 and 33 are reverse-biassed, and prevent high voltage. Accordingly, a semiconductor device has general-purpose properties because it may be used in response to the necessity of the ignition system regardless of the kinds of internal combustion engines.

2. 发明专利

JPS63164350A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63164350A
公开(公告)日：1988-07-07
申请号：JP30854786
申请日：1986-12-26
申请人： HITACHI LTD , HITACHI HARAMACHI SEMI CONDUCT
发明人： KAMIYA SHIGERU , KOMINE MITSURU , KAMATA MASAO
IPC分类号： H01L25/07
摘要： PURPOSE:To prevent the containing of bubbles in a bonding section, and to eliminate the defective breaking, etc., of a semiconductor device by laminating and arranging silicon wafers in a solder melt and forming an silicon-wafer laminate. CONSTITUTION:An silicon-wafer fixture 11 with a cylindrical section having the same circular section as the shapes of silicon wafers 1 is disposed into a solder melt 10 filled into a vessel. The wafers 1 are dipped into the solder melt 10 alternately with spacers 12 while the directions of P-N junctions are arranged, and are disposed into the fixture 11 in succession. When the spacers 12 have the same external shape as the wafers 1, solder thickness required is set among the wafers and the spacers 12 are dipped into the solder melt 10, and the spacers 12 are plated with Ni in order to improve wettability with solder so as not to take in gases on the outside of the solder melt. A group of stacked silicon wafers is pulled up from the inside of the melt 10 together with the fixture 11, and formed to the laminate of the wafers 1.

3. 发明专利

JPH01166548A HIGH VOLTAGE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01166548A
公开(公告)日：1989-06-30
申请号：JP32405387
申请日：1987-12-23
申请人： HITACHI LTD
发明人： KOMINE MITSURU , SUZUKI KENSUKE
IPC分类号： H01L25/07
摘要： PURPOSE:To reduce air bubbles generated at the time of soldering and to uniformize the thickness of a solder by depositing a low temperature solder on both side faces of a silicon wafer, alternately laminating the wafer attached with the low temperature solder and a high temperature solder, and soldering them. CONSTITUTION:Low temperature solders 3 are deposited on both side faces of a silicon wafer 1 having an Ni-plated (at 2) P-N junction 2, the wafer 1 attached with the solders 3 and high temperature solder 4 are alternately laminated by equalizing the polarities of the P-N junction, sufficient load is applied, and soldered at a temperature for melting the solders 3. Then, the junctioned wafer 6 is cut in a suitable size for use as a semiconductor device, thereby forming silicon laminated pellets 7. Thus, air bubbles generated at the time of soldering are discharged, reduced, the solder 4 performs as the role of a spacer, thereby maintaining the uniformity of the thickness of the solder.

4. 发明专利

JPS57148550A GUIDE BEARING DEVICE FOR VERTICAL SHAFT ROTARY ELECTRIC MACHINE 失效
公开(公告)号：JPS57148550A
公开(公告)日：1982-09-13
申请号：JP3135181
申请日：1981-03-06
申请人： HITACHI LTD
发明人： MASUKO MITSUO , KOMINE MITSURU
IPC分类号： H02K5/167
摘要： PURPOSE:To eliminate the leakage of oil with a simple sealng structure at the guide bearing device for a vertical shaft rotary electic machine by providing special relationships among the outer diameters of an inner plate in an oil tank, of the shaft end flange of a rotational shaft and the inner diameter of a bottom plate of the tank. CONSTITUTION:There are provided an oil tank formed to surround a rotational shaft 1 and a guide bearing shoe 3 sliding with the journal 2 of the shaft 1, and lubricating oil is contained in the oil tank. The oil tank for the guide bearing device is formed of a bracket 4 mouned with the shoe 3, an inner plate 5 of the tank provided along the shaft 1, and a bottom plate 6 of the tank for connecting the bracket 4 to the plate 5. The outer diameter D4 of the plate 5 is formed smaller than the inner diameter D2 of the bracket 4 and larger than the outer diameter D1 of the shaft end flange 11 of the shaft 1, and the inner diameter D3 of the plate 6 is formed at a value larger than the outer diameter D1 of the flange 11.

5. 发明专利

JPH0734459B2 失效
公开(公告)号：JPH0734459B2
公开(公告)日：1995-04-12
申请号：JP16667989
申请日：1989-06-30
申请人： HITACHI LTD
发明人： KAMIJO HITOSHI , NAKAJIMA YOICHI , SUZUKI KENSUKE , KOMINE MITSURU
IPC分类号： H01L25/07 , H01L21/52

6. 发明专利

JPS6022438A COUPLING COVER UNIT OF VERTICAL SHAFT WATER WHEEL GENERATOR 失效
公开(公告)号：JPS6022438A
公开(公告)日：1985-02-04
申请号：JP12795083
申请日：1983-07-15
申请人： HITACHI LTD
发明人： KAMIKUBO HIROSHI , KOMINE MITSURU
IPC分类号： H02K5/04 , H02K5/10 , H02K5/124
摘要： PURPOSE:To sufficiently prove the safety and to reduce the number of assembling steps by forming carbon dioxide seal of disc shape mounted on a bracket in a cylindrical shape and integrating with a coupling cover. CONSTITUTION:A carbon dioxide seal and coupling cover 9 is clamped with bolts to the lower disc of a bracket 6 which is not effected by the centrifugal forces of rotational shafts 2, 3. The cover 9 is constructed to cover the shaft 2, 3 to protect the coupling bolts and nuts to prove sufficient safety. Carbon dioxide seal 9a prevents the carbon dioxide from leaking from a generation chamber 8.

7. 发明专利

JPH0334451A PLASTIC MOLDED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0334451A
公开(公告)日：1991-02-14
申请号：JP16667989
申请日：1989-06-30
申请人： HITACHI LTD
发明人： KAMIJO HITOSHI , NAKAJIMA YOICHI , SUZUKI KENSUKE , KOMINE MITSURU
IPC分类号： H01L25/07 , H01L21/52
摘要： PURPOSE:To relax stress in a semiconductor device to obtain a highly reliable semiconductor device resistant against mechanical and thermal stress by a method wherein thickness of second brazing filler metal for adhering both ends of a laminated chip and lead members is made thicker than that of first brazing filler metal for adhering semiconductor chips in the laminated chip. CONSTITUTION:Numerous semiconductor chips 1 are brazed by first brazing filler metal 2 to form a laminated chip 6 wherein the thickness of the first brazing filler metal 2 is 55mum. Lead members 4 are adhered to both ends of the laminated chip 6 via second brazing filler metal 3. The second brazing filler metal 3 is used to braze the laminated chip 6 and the lead members 4 at such temperature that the second brazing filler metal 3 is melted but the first brazing filler metal 3 is not melted. The thickness of the second brazing filler metal is 100mum. In addition end faces of the semiconductor chips 1 are coated by a surface protecting material 7 for stabilizing PN junction face ex posed on them and the external face is further enclosure-molded by a plastic coat 5.

8. 发明专利

JPS61134052A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS61134052A
公开(公告)日：1986-06-21
申请号：JP25563884
申请日：1984-12-05
申请人： Hitachi Haramachi Semiconductor Ltd , Hitachi Ltd
发明人： TANAKA MINORU , KAMIYA SHIGERU , KOMINE MITSURU , HIDAKA TOSHIYUKI , YOSHINO KATSUNOBU
IPC分类号： H01L23/31 , H01L25/07
CPC分类号： H01L25/074 , H01L23/3107 , H01L24/33 , H01L2924/10253 , H01L2924/00
摘要： PURPOSE:To obtain the TV high-voltage diode which avoids field concentration and increases breakdown strength by a method wherein a high-voltage diode is composed of block pellets increased in curvature at the corners. CONSTITUTION:Semiconductor block pellets 1 with Si pellets 1a, 1b,...1n etched at corners so as to have suitable curvatures and joined by adhesion with solders 4 and Si pellets 5a, 5b of low resistivity at both ends are arranged. Further, electrodes 2a, 2b to which outer leads 3a, 3b are welded in percussion are adhered to both ends of the block pellet. The diagram shows a structure calcined by being covered with glass from one electrode 2a to the other electrode 2b. Comparison of the cross-sectional shapes of the Si pellets 1a, 1b...1n with the conventional ones proves that the curvature of Si pellet corners is larger than conventional.
摘要翻译：目的：获得避免场浓度的电视高压二极管，通过高压二极管由拐角处的曲率增加的块状丸粒组成的方法获得提高击穿强度。构成：在角部蚀刻具有Si粒子1a，1b，... 1n的半导体块状粒料1，以具有合适的曲率并通过与焊料4的粘合和两端的低电阻率的Si粒子5a，5b接合。此外，将外部引线3a，3b以冲击方式焊接的电极2a，2b粘附到块状块的两端。该图示出了通过被玻璃从一个电极2a覆盖到另一个电极2b而煅烧的结构。 Si颗粒1a，1b ... 1n的横截面形状与常规的横截面形状的比较证明了Si颗粒角的曲率大于常规。

9. 发明专利

JPS5942542B2 JPS5942542B2 - 失效
公开(公告)号：JPS5942542B2
公开(公告)日：1984-10-16
申请号：JP2379777
申请日：1977-03-07
申请人： Hitachi Ltd
发明人： TAKAO KAZUO , ISHIDA ISAO , NINOMYA IWAO , SAGAWA HIROSHI , KAWAI RYOICHI , KOMINE MITSURU
IPC分类号： H02K1/22 , H02K1/00 , H02K7/10 , H02K7/102

10. 发明专利

JPS53109105A ROTOR OF REVOLVING MACHINE 失效
公开(公告)号：JPS53109105A
公开(公告)日：1978-09-22
申请号：JP2379777
申请日：1977-03-07
申请人： HITACHI LTD
发明人： TAKAO KAZUO , ISHIDA ISAO , NINOMIYA IWAO , SAGAWA HIROSHI , KAWAI RIYOUICHI , KOMINE MITSURU
IPC分类号： H02K1/22 , H02K1/00 , H02K7/10 , H02K7/102
摘要： PURPOSE:To equalize the thermal expansion of the divided pieces in the right and the left sides, and to prevent breakage of a bolt, by making the fastening force of a bolt at the central part of each divided piece in which a brake ring is divided into a plurality number to be greater than the fastening force of a bolt at another part.

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