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    • 9. 发明专利
    • MANUFACTURE OF MIS SEMICONDUCTOR DEVICE
    • JPS6016469A
    • 1985-01-28
    • JP7283584
    • 1984-04-13
    • HITACHI LTD
    • SHIRASU TATSUMIYASUI NORIMASAFUKUDA MINORU
    • H01L29/78
    • PURPOSE:To obtain the titled device of high withstand voltage with the reduction of element dimensions, areas, dispersion of characteristics by a method wherein a drain layer of double diffusion type is formed by self-alignment. CONSTITUTION:A field oxide film 2, gate oxide film 3, and poly Si gate electrode 4 are formed on an N type Si substrate 1, and then B ions 6 are implanted at a low concentration with a photo resist 5 as a mask. A P-layer 6a is formed by heat treatment, and a P layer 7 and a P source layer 7a shallower then the P-layer 6a are formed by heat treatment after OB ion implantation excluding to the SiO2 film 3 with the electrode 4 as a mask. At this time, the poly Si 4 is sufficiently reduced in resistance. Thereafter, Al source and drain electrodes S and D are formed by a cover of a PSG8 as normal. In this construction, high withstand voltage can be obtained because of the relaxation of the field concentration of the surface of a drain junction, resulting in the formation of drains 6a and 7 by self-alignment; therefore element dimensions can be processed with good reproducibility without dispersion. Accordingly, it becomes possible to make characteristics uniform and to reduce the element area.
    • 10. 发明专利
    • Complementary mis semiconductor integrated circuit device
    • 补偿型半导体集成电路器件
    • JPS59112643A
    • 1984-06-29
    • JP18498683
    • 1983-10-05
    • Hitachi Ltd
    • NISHIMURA KOUTAROUYASUI NORIMASAMEGURO SATOSHI
    • H01L21/822H01L21/8238H01L27/04H01L27/092H01L27/10H01L29/78
    • H01L21/8238
    • PURPOSE:To provide a high resistance element in a CM1SIC without adding any new step by merely altering part of a mask pattern. CONSTITUTION:A p type well is formed in an n type layer on an n type Si substrate, and an Si3N4 film 7 on an oxidized film 6 is selectively removed by a resist mask 8. With CVD oxidized films 9, 10 as masks B and P ions are sequentially implanted, the film 7 is selectively oxidized at 11 to form a p type layer 11 and an n type layer 13, and the films 7, 6 are removed. Then, a polysilicon layer 16 is selectively formed on a gate oxidized film 15 and conducted. Subsequently. CVD oxidized film masks 17, 18 are sequentially covered, and B and P ions are implanted to form an n type layer 18 and a p type layer 20. At this time the part 21 of the polysilicon layer 16 is not ion implanted, a high resistance layer is formed, and both terminals are connected to the n type layer. According to this configuration, the diffusing masks are positively used to form the polysilicon region in which impurities of both types are not doped and to utilize it for a high resistance element.
    • 目的:在CM1SIC中提供高电阻元件,而不需要通过改变掩模图案的一部分来添加任何新的步骤。 构成:在n型Si衬底上的n +型层中形成p型阱,通过抗蚀剂掩模8选择性地除去氧化膜6上的Si 3 N 4膜7。 依次注入作为掩模B和P离子的CVD氧化膜9,10,在11处选择性地氧化膜7以形成p型层11和n型层13,并除去膜7,6。 然后,在栅极氧化膜15上选择性地形成多晶硅层16并进行导电。 后来。 顺序地覆盖CVD氧化膜掩模17,18,并注入B和P离子以形成n +型层18和ap +型层20.此时多晶硅层16的部分21不是 离子注入,形成高电阻层,两端连接到n +型层。 根据该结构,扩散掩模被积极地用于形成其中不掺杂两种杂质的多晶硅区域,并将其用于高电阻元件。