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    • 4. 发明专利
    • Manufacture of metal oxide semiconductor device
    • 金属氧化物半导体器件的制造
    • JPS59210659A
    • 1984-11-29
    • JP18498783
    • 1983-10-05
    • Hitachi Ltd
    • NISHIMURA KOUTAROUYASUI NORIMASAMEGURO SATOSHI
    • H01L27/092H01L21/8238H01L29/78
    • H01L21/8238
    • PURPOSE:To obtain a C-MOS.IC having excellent electric characteristics by forming a second conduction type first region and a first conduction type second region in impurity concentration higher than a first conduction type semiconductor substrate to the surface layer of the substrate through ion implantation and each forming MISFETs to these two regions. CONSTITUTION:n Type ions are implanted to the surface layer section of an n type Si substrate 1 to form an n layer 4, the whole surface is coated with an SiO2 film 2, and a window for shaping a well is bored to the film 2 while using a photo-resist film 3 as a mask. p Type impurity ions are implanted into the layer 4 in the window to form a p type well region 5, the film 2 is removed, and the whole surface is coated with a thin SiO2 film 6 again. The central sections of the surfaces of the region 5 and the layer 4 adjacent to the region 5 are coated with laminates of Si3N4 films 7 and resist films 8, and p type and n type impurity ions are implanted alternately to shape a p type region 12 and an n type region 13 positioned under a selective oxide film 11 to a boundary section between the region 5 and the layer 4. Accordingly, the substrate is prepared, and FETs are each formed demarcated by the boundary section.
    • 目的:通过离子注入形成第二导电型第一区和杂质浓度高于第一导电型半导体衬底的第一导电型第二区,获得具有优异电特性的C-MOS.IC 并且每个形成MISFET到这两个区域。 构成:将n型离子注入到n型Si衬底1的表层部分以形成n +层4,整个表面涂覆有SiO 2膜2和用于成形 在使用光致抗蚀剂膜3作为掩模的同时,对薄膜2无孔。 p型杂质离子注入到窗口中的层4中以形成p型阱区5,除去膜2,并再次用薄的SiO 2膜6涂覆整个表面。 区域5的表面和与区域5相邻的层4的中心部分涂覆有Si 3 N 4膜7和抗蚀剂膜8的层压体,并且交替注入p型和n型杂质离子以形成ap型区域12和 位于选择性氧化膜11下方的n型区域13到区域5和层4之间的边界部分。因此,准备衬底,并且每个由边界部分划定的FET。
    • 10. 发明专利
    • Cmos integrated circuit device
    • CMOS集成电路设备
    • JPS59139727A
    • 1984-08-10
    • JP1272483
    • 1983-01-31
    • Hitachi Ltd
    • YASUI NORIMASAOGIUE KATSUMINISHIMURA KOUTAROUODAKA MASANORIMIYAOKA SHIYUUICHITAKAHASHI OSAMUYAMAMOTO AKIRASASAKI KATSUROUYOU KANJI
    • G11C11/407G11C11/409H03K19/0185
    • H03K19/018514
    • PURPOSE:To give direct access to a CMOS static RAM through an ECL circuit and to facilitate production of a CMOS IC device by using an input level converting circuit which receives a signal of a level of emitter coupled logic ECL and converts it into a CMOS signal. CONSTITUTION:An input level converting circuit is provided to a CMOS IC device to receive a signal of ECL level and converts it into a signal of MOS level. Then an external address or a control signal is supplied to the base of an nMOS FETQ10 from a terminal ECLIN. A differential nMOSFETQ9 is connected to the FETQ10, and the reference voltage Vref for level dicision is applied to the base of the FETQ9. Then a constant current source containing an nMOSFETQ13 is connected to a common source. While pMOSFETs Q11 and Q12 which work as current mirror type active loads are connected to the drains of FETs Q9 and Q10 respectively. The voltage Vref is produced by a circuit consisting of partial pressure resistances R3 and R4, MOSFETs Q1-Q8, etc. Then direct access is given to a CMOS RAM through an ECL circuit.
    • 目的:通过ECL电路直接访问CMOS静态RAM,并通过使用输入电平转换电路来促进CMOS IC器件的生产,输入电平转换电路接收发射极耦合逻辑ECL的电平信号并将其转换为CMOS信号 。 构成:将输入电平转换电路提供给CMOS IC器件以接收ECL电平的信号并将其转换为MOS电平的信号。 然后外部地址或控制信号从端子ECLIN提供给nMOS FETQ10的基极。 差分nMOSFETQ9连接到FETQ10,并且用于电平切割的参考电压Vref被施加到FETQ9的基极。 然后将包含nMOSFETQ13的恒流源连接到公共源。 作为电流镜式有源负载工作的pMOSFET Q11和Q12分别连接到FET Q9和Q10的漏极。 电压Vref由由部分压力电阻R3和R4,MOSFET Q1-Q8等组成的电路产生。然后通过ECL电路直接接入CMOS RAM。