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1. 发明公开

EP1102482A4 RECORDED PROGRAM VIEWING SUPPORT METHOD 失效
标题翻译：不伦瑞克·曼德尔·祖尔
公开(公告)号：EP1102482A4
公开(公告)日：2005-12-28
申请号：EP98929784
申请日：1998-07-01
申请人： HITACHI LTD
发明人： YAGAWA YUICHI , UKAI HIROMI , TANAKA AKIRA , NISHIJIMA HIDEO , OWASHI HITOAKI
IPC分类号： G11B15/02 , G11B17/22 , G11B27/02 , G11B27/032 , G11B27/10 , G11B27/34 , H04N5/761 , H04N5/765 , H04N5/775 , H04N5/78 , G11B27/034 , H04N5/445
CPC分类号： G11B17/228 , G11B17/223 , G11B27/105 , G11B27/34 , G11B2220/216 , G11B2220/2562 , G11B2220/2575 , H04N5/775 , H04N21/47
摘要： A support method for helping the user find a desired program from a collection of recorded television programs easily and quickly, and a recording/reproducing apparatus using this method. The recorded program viewing support system, when recording a television program, records electronic program information on the program, classifies the electronic program information according to predefined program category criteria, and successively assigns predefined category numbers (recording channels) to the program to be recorded. Before the user views a recorded program, the user specifies the number of the recorded channel. A recorded channel number is allocated with a category item and hence the user can easily know the contents of the recorded program. The user can change the channel number successively or directly specify it by using a remote controller to find a desired program easily and quickly. When disk media such as HDD and DVD-RAM are used as a storage in particular, the recorded programs can be randomly accessed allowing the user to zap through recorded programs.
摘要翻译：一种用于帮助用户容易且快速地从记录的电视节目的集合中找到所需节目的支持方法，以及使用该方法的记录/再现装置。记录节目观看支持系统在记录电视节目时，记录节目上的电子节目信息，根据预定义的节目类别标准对电子节目信息进行分类，并将预定类别号码（记录频道）分配给要记录的节目。在用户查看录制节目之前，用户指定录制的频道的号码。记录的频道号码被分配有一个类别项目，因此用户可以容易地知道所记录节目的内容。用户可以通过使用遥控器轻松，快速地找到所需的程序来连续地或直接地指定通道号。当诸如HDD和DVD-RAM之类的盘介质被特别地用作存储时，所记录的程序可以被随机访问，允许用户通过记录的程序进行切换。

2. 发明专利

DE69841510D1 未知
公开(公告)号：DE69841510D1
公开(公告)日：2010-04-01
申请号：DE69841510
申请日：1998-07-01
申请人： HITACHI LTD
发明人： YAGAWA YUICHI , UKAI HIROMI , TANAKA AKIRA , NISHIJIMA HIDEO , OWASHI HITOAKI
IPC分类号： H04N5/78 , G11B15/02 , G11B17/22 , G11B27/02 , G11B27/032 , G11B27/034 , G11B27/10 , G11B27/34 , H04N5/761 , H04N5/765 , H04N5/775

3. 发明专利

DE69726518D1 未知
公开(公告)号：DE69726518D1
公开(公告)日：2004-01-15
申请号：DE69726518
申请日：1997-09-02
申请人： HITACHI LTD , HITACHI KYOWA ENGINEERING CO
发明人： TANAKA AKIRA , INOUE HIROKAZU , KUSHIMA TADAO , KOIKE YOSHIHIKO , SHIMIZU HIDEO , SAITO RYUICHI , SUZUKI KAZUHIRO , KURIHARA YASUTOSHI , OKADA SENSUKE , KOIZUMI MASAHIRO , KAJIWARA RYOICHI , SONOBE YUKIO , NAKATSU KINYA , KURIBAYASHI SHIGEHISA
IPC分类号： H01L23/498 , H01L23/538 , H01L25/07 , H02M7/00
摘要： An IGBT unit of a power semiconductor module which comprises a plurality of insulation substrates each of which mounting a plurality of semiconductor devices thereon which are to be operated in parallel within the module is provided. External terminals corresponding to each unit are disposed outside the module for parallel operation thereof, thereby minimizing inductance between respective semiconductor devices and their wirings.

4. 发明专利

DE3852727D1 未知
公开(公告)号：DE3852727D1
公开(公告)日：1995-02-23
申请号：DE3852727
申请日：1988-07-22
申请人： HITACHI LTD , HITACHI MEDICAL CORP
发明人： TANAKA AKIRA , SHIMADA SATOSHI , NAKAGAWA YUSAKU , YAMADA KAZUJI , NISHIHARA MOTOHISA , MIYOSHI TADAHIKO , KAGOHARA HIROMI , BABA NOBORU , INAMURA ICHIRO
IPC分类号： H01J35/10
摘要： A method for generating X-rays in an X-ray tube (10), comprises the steps of rotating an X-ray target (17) of a rotating anode (16), the X-ray target having a metal coated layer (23) thereon, of applying electron beams (18) emitted from a cathode (15) onto the metal coated layer (23) of the X-ray target, and of offsetting thermal deformation of the X-ray target (17) due to the application of said electron beams by deformation of the X-ray target (17) due to centrifugal force, thereby maintaining a position of the X-ray target (17) in a direction of the application of the electron beams, at a room temperature of the X-ray target, thus generating the X-rays.

5. 发明专利

DE69535775D1 未知
公开(公告)号：DE69535775D1
公开(公告)日：2008-08-07
申请号：DE69535775
申请日：1995-10-04
申请人： HITACHI LTD , HITACHI HARAMACHI ELECTRONICS
发明人： YAMADA KAZUJI , TANAKA AKIRA , SAITO RYUICHI , KURIHARA YASUTOSHI , KUSHIMA TADAO , HARAMAKI TAKASHI , KOIKE YOSHIHIKO , HOSOKAWA TAKASHI , SAWAHATA MAMORU , KOIZUMI MASAHIRO , ONUKI JIN , SUZUKI KAZUHIRO , KOBAYASHI ISAO , SHIMIZU HIDEO , HIGASHIMURA YUTAKA , SEKINE SHIGEKI , KOIKE NOBUYA , KOKUBUN HIDEYA
IPC分类号： H01L25/07 , H01L23/049 , H01L23/373 , H01L23/495 , H01L25/065 , H02M7/00
摘要： A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes (15a,15b,17,18,19) of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base (13), the upper surface of the heat dissipating base being covered with a member (12) for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

6. 发明专利

DE69923374D1 未知
公开(公告)号：DE69923374D1
公开(公告)日：2005-03-03
申请号：DE69923374
申请日：1999-05-24
申请人： HITACHI LTD
发明人： KUSHIMA TADAO , TANAKA AKIRA , SAITO RUYUICHI , SUZUKI KAZUHIRO , KOIKE YOSHIHIKO , SHIMIZU HIDEO
IPC分类号： H01L23/28 , H01L23/24 , H01L23/498 , H01L25/07 , H05H6/00

7. 发明专利

DE4235517C2 未知
公开(公告)号：DE4235517C2
公开(公告)日：1999-04-08
申请号：DE4235517
申请日：1992-10-21
申请人： HITACHI LTD
发明人： TANAKA AKIRA , SHINOHARA HIROICHI , YAMADA KAZUJI , OBA TAKAO , YAMAGIWA AKIRA , YOSHIDOME HITOSHI , SHIRAI YUJI , HATADA TOSHIO , KISHIMOTO MUNEHISA , HONDA MICHIHARU
IPC分类号： H01L23/36 , H01L23/367 , H01L25/10 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/36 , H05K7/20 , G06F1/20
摘要： A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

8. 发明专利

DE68920767T2 未知
公开(公告)号：DE68920767T2
公开(公告)日：1995-06-01
申请号：DE68920767
申请日：1989-04-04
申请人： HITACHI LTD
发明人： TANAKA AKIRA , YAMADA KAZUJI , INOUE HIROKAZU , ARAKAWA HIDEO , OKAMOTO MASAHIDE
IPC分类号： H01L23/538 , H01L23/04 , H01L23/057 , H01L23/12 , H01L23/467 , H01L23/498 , H01L23/50
摘要： A cavity-down type package for a semiconductor device comprises an insulating base substrate (6) on which the semiconductor device (1) is mounted, and another insulating cap substrate (8) with plural outer connection terminals (5) on its outer surface and with electrodes (11) provided on conductive layers (4) for electric conduction on its inner surface. The electrodes on the insulating base substrate and those (11) on the insulating cap substrate (8) are connected with each other by means of conductive material such as bumps.

9. 发明专利

DE69923374T2 未知
公开(公告)号：DE69923374T2
公开(公告)日：2006-01-19
申请号：DE69923374
申请日：1999-05-24
申请人： HITACHI LTD
发明人： KUSHIMA TADAO , TANAKA AKIRA , SAITO RUYUICHI , SUZUKI KAZUHIRO , KOIKE YOSHIHIKO , SHIMIZU HIDEO
IPC分类号： H01L23/28 , H01L23/24 , H01L23/498 , H01L25/07 , H05H6/00

10. 发明专利

DE69728919D1 未知
公开(公告)号：DE69728919D1
公开(公告)日：2004-06-09
申请号：DE69728919
申请日：1997-01-30
申请人： HITACHI LTD
发明人： TANAKA AKIRA , KUSHIMA TADAO , SHIMIZU HIDEO , OKADA SENSUKE , KOIKE YOSHIHIKO , YAMADA KAZUJI , SAITO RYUICHI
IPC分类号： H01L23/13 , H01L23/373 , H01L23/498 , H05K1/02 , H05K1/03 , H05K3/00 , H05K3/38 , H01L23/15
摘要： A semiconductor device comprises a metal base plate, an insulating substrate (1) placed on the metal base plate, a conductive foil (3) bonded to the insulating substrate with a bonding layer (2), and a semiconductor element mounted on the conductive foil. A marginal portion of the bonding layer spreads outside beyond the edges of the conductive foil.

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