专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

DE69928036T2 未知
公开(公告)号：DE69928036T2
公开(公告)日：2006-07-13
申请号：DE69928036
申请日：1999-02-17
申请人： HITACHI LTD
发明人： IMANARI MASAO , FUKUSHIMA TOSHIHIKO , HATADA TOSHIO , MATSUBARA KATSUMI , KATSUMATA NAOTO
IPC分类号： F24F5/00 , F28D20/02
摘要： An ice thermal storage type air-conditioner and an ice thermal storage tank, in which unused portions in the ice thermal storage tank is reduced to enhance an ice filling rate in the ice thermal storage tank or to prevent excessive icing from damaging a heat transfer unit. An ice thermal storage type air-conditioner in which heat exchangers are installed in the ice thermal storage tank 1, the heat exchangers having a heightwise size extending from a bottom of the ice thermal storage tank 1 to near a top of a container, and comprising a plurality of flat-shaped plate-type heat transfer units 14 arranged therein in layered manner in a thicknesswise direction

2. 发明专利

DE69429939T2 未知
公开(公告)号：DE69429939T2
公开(公告)日：2002-10-10
申请号：DE69429939
申请日：1994-03-30
申请人： HITACHI LTD
发明人： ATARASHI TAKAYUKI , HATADA TOSHIO , TANAKA TETSUYA , IINO TOSHIKI , KASAI KENICHI , DAIKOKU TAKAHIRO , TSUKAGUCHI TAMOTSU
IPC分类号： H01L23/36 , H01L23/467 , H05K7/20
摘要： An electronic equipment has a cooling structure in which air discharged from heat sinks (3) can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening (23) and a discharge opening (26) for cooling air are independently formed in a heat sink (3). A plurality of supply branched ducts (4) and discharge branched ducts (5) are combined in a comb-like shape along the axis of the ducts. Ejection openings (18) for cooling air are formed on each of the supply branched ducts (4) in the position corresponding to each of the heat sinks (3). Such ejection openings (18) are closely connected to the supply openings (23) for cooling air of the heat sinks (3). On the other hand, recovery openings (19) for cooling air are formed on each of the refrigerant discharge ducts (5) in a position corresponding to each of the heat sinks (3). Such recovery openings (19) are closely connected to the discharge openings (26) for gas refrigerant of the heat sinks (3).

3. 发明专利

DE4235517C2 未知
公开(公告)号：DE4235517C2
公开(公告)日：1999-04-08
申请号：DE4235517
申请日：1992-10-21
申请人： HITACHI LTD
发明人： TANAKA AKIRA , SHINOHARA HIROICHI , YAMADA KAZUJI , OBA TAKAO , YAMAGIWA AKIRA , YOSHIDOME HITOSHI , SHIRAI YUJI , HATADA TOSHIO , KISHIMOTO MUNEHISA , HONDA MICHIHARU
IPC分类号： H01L23/36 , H01L23/367 , H01L25/10 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/36 , H05K7/20 , G06F1/20
摘要： A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

4. 发明专利

DE4333373A1 Electronic appts. using power semiconductors - provides respective cooling medium flow jets for each power semiconductor heat sink element 未知
公开(公告)号：DE4333373A1
公开(公告)日：1994-03-31
申请号：DE4333373
申请日：1993-09-30
申请人： HITACHI LTD
发明人： ATARASHI TAKAYUKI , HATADA TOSHIO , DAIKOKU TAKAHIRO , KAWASAKI NOBUO , IINO TOSHIKI , TSUKAGUCHI TAMOTSU , KASAI KENICHI , KOBAYASHI FUMIYUKI , HAYASHI YOSHITO
IPC分类号： H01L23/467
摘要： The electronic device provides a heat sink element (22) for each power semiconductor (21) having surface cooling ribs, lying in a cooling flow stream provided by associated jets (23), the flow direction (27) being the same for all the heat sink elements. The cooling flow jet lies on the opposite side of each heat sink element to the power semiconductor with a flow space for the cooling medium between the adjacent jets, extending in a direction perpendicular to the cooling medium flow direction and the flow medium ejection direction. ADVANTAGE - Effective cooling of closely packed power semiconductors in single plane or reduces flow resistance along cooling path to improve cooling and reduce noise level at same time.

5. 发明专利

DE69321446T2 未知
公开(公告)号：DE69321446T2
公开(公告)日：1999-04-01
申请号：DE69321446
申请日：1993-12-06
申请人： HITACHI LTD
发明人： SATO KAZUO , SHIKIDA MITSUHIRO , OHASHI SHIGEO , HATADA TOSHIO , ASHIWAKE NORIYUKI , TANAKA SHINJI , HARADA TAKESHI , HONDA YUKIO
IPC分类号： F04B43/04 , F04B45/047 , H01L23/467 , H02N1/00
摘要： A cooling device (1) according to the present invention, in which a space (37) is formed by means of flat electrodes (31, 32) and side plates (5, 6) disposed on the ends of the flat electrodes (31, 32), and a flexible film (4) fastened in that space (37) in a shape of the letter S, is fixed to a semiconductor package (2) so that one of the flat electrodes (31, 32) is fitted on the semiconductor package (2). The respective flat electrodes (31, 32) are alternately powered to move the S shaped section of the flexible film (4).

6. 发明专利

DE4334091A1 Electronic apparatus 未知
公开(公告)号：DE4334091A1
公开(公告)日：1995-04-13
申请号：DE4334091
申请日：1993-10-06
申请人： HITACHI LTD
发明人： ATARASHI TAKAYUKI , HATADA TOSHIO , DAIKOKU TAKAHIRO , KAWASAKI NOBUO , IINO TOSHIKI , TSUKAGUCHI TAMOTSU , KASAI KENICHI , KOBAYASHI FUMIYUKI , HAYASHI YOSHITO
IPC分类号： G06F1/20 , H01L23/467 , H05K7/20
摘要： An electronic apparatus which has a plurality of semi-conductor components (121) which produce heat while they are operating. A cooling element (22) having a plurality of cooling ribs which are, for example, in the form of surfaces, are provided on each semiconductor component. Nozzles (23) are assigned to the cooling elements and feed a cooling fluid such as air to said cooling elements. The direction (27) of the flow and the removal of the cooling fluid are the same in all the cooling elements. The width (W) of the nozzle, measured in the direction of the flow determined by the cooling element, and the removal means of the cooling fluid (x direction) are smaller than the width (L) of the associated cooling element. The width of the nozzle measured in the direction at right angles to the x-direction is not less than the width of the associated cooling element. The space between adjacent nozzles represents a removal channel having a large cross-section, which has a reduced flow cross-section for the heated cooling medium which is to be carried away. In a cooling device according to the invention, the cooling fluid is predominantely passed into the central region of the cooling element where the cooling requirement is at its greatest. Such flow guidance is achieved either by slots constructed in the cooling ribs or by flow guidance devices (202, 202a) which extend into the cooling element.

7. 发明专利

DE4217431A1 未知
公开(公告)号：DE4217431A1
公开(公告)日：1992-12-03
申请号：DE4217431
申请日：1992-05-26
申请人： HITACHI LTD
发明人： HATADA TOSHIO , INOUYE HIROSHI , OHBA TAKAO , IWAI SUSUMU
IPC分类号： G06F1/20 , H01L23/36 , H01L23/467 , H05K7/20
摘要： In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40 DEG C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50 DEG to 60 DEG C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.

8. 发明专利

DE4106437A1 未知
公开(公告)号：DE4106437A1
公开(公告)日：1991-08-29
申请号：DE4106437
申请日：1991-02-28
申请人： HITACHI LTD
发明人： HATADA TOSHIO , MATSUSHIMA HITOSHI , KONDO YOSHIHIRO , INOUE HIROSHI , OHTSUKA KANJI , SHIRAI YUJI , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H01L23/473 , F28F3/02 , H01L23/367 , H01L23/467 , H05K7/10 , H05K7/20
摘要： An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.

9. 发明专利

DE3713813A1 未知
公开(公告)号：DE3713813A1
公开(公告)日：1987-10-29
申请号：DE3713813
申请日：1987-04-24
申请人： HITACHI LTD
发明人： HATADA TOSHIO , OUCHI TOMIHISA , KUNUGI YOSHIFUMI , SUGIMOTO SHIGEO , KANEKO JUNICHI
IPC分类号： F28F1/32 , F28F1/10
摘要： The present invention relates to a louvered heat transfer fin in which the air-passing resistance of the louver is varied so as to increase the overall heat exchange quantity, and thereby to greatly enhance the heat transfer performance of the fin. The arrangement of each louver is such that the projection area in the vicinity of the longitudinal central portion of the louver projected in the direction in which air passes is larger than the projection area of each of the longitudinal end sides of the louver projected in the same direction.

10. 发明专利

DE4333373B4 未知
公开(公告)号：DE4333373B4
公开(公告)日：2006-04-20
申请号：DE4333373
申请日：1993-09-30
申请人： HITACHI LTD
发明人： ATARASHI TAKAYUKI , HATADA TOSHIO , DAIKOKU TAKAHIRO , KAWASAKI NOBUO , IINO TOSHIKI , TSUKAGUCHI TAMOTSU , KASAI KENICHI , KOBAYASHI FUMIYUKI , HAYASHI YOSHITO
IPC分类号： H01L23/467
摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式