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    • 2. 发明专利
    • AV DEVICE CONTROLLER AND AV DEVICE CONTROL METHOD
    • JP2002232976A
    • 2002-08-16
    • JP2001022836
    • 2001-01-31
    • HITACHI LTD
    • SANO MAKOTOAIKAWA SHIN
    • G06F13/00H04L12/28H04N5/765H04Q9/00
    • PROBLEM TO BE SOLVED: To provide a configuration method to minimize increase in a manufacturing cost of an AV device controller incorporating an HAVi(Home Audio/ Video Interoperability) controller and to provide a means that correctly distributes a packet for a control request and its processing response exchanged among the HAVi controller, a sub unit incorporating the AV device controller and an AV device configuring an IEEE1394 network. SOLUTION: This invention provides an electronic appliance provided with an IEEE1394 interface and providing a means that controls display control and user entry control under the management of an AV/C controller being a 1st control means from an HAVi middleware of an HAVi controller being a 2nd control means and is provided with a means that distributes an extended packet attaching direction information to all packets handled in a controller that is used to discriminate whether the packets are directed to the AV device interconnected by the controller and the IEEE1394 network or directed to the inside of the controller within the controller.
    • 7. 发明专利
    • SPLIT TYPE SUBSTRATE HOLDER
    • JPH0336266A
    • 1991-02-15
    • JP16708889
    • 1989-06-30
    • HITACHI LTD
    • KAWANA TAKESHIDAIROKU NORIYUKISAWASE FUMIHIKOSANO MAKOTOTAKAHASHI NAOKIABE KATSUOKATAOKA HIROYUKI
    • C23C14/50
    • PURPOSE:To provide the split type substrate holder which does not affect on the function to hold a substrate in spite of the presence of a partial thermal deformation by constituting the holder in such a manner that the aperture for mounting the substrate is splittable and the holder has the shape to confine the substrate after mounting in the holding part around the aperture. CONSTITUTION:The above-mentioned split substrate holder is so formed that the support of a mechanism for holding the substrate 10 constituted heretofore by using one sheet of plate material is splittable on the plane orthogonal with the plane formed by the substrate holder. Further, a part or more parts of the aperture diameter or aperture size on the support surface of the substrate holder are made slightly smaller than the substrate size and a groove 8 is formed in the part of the support where the support comes into contact with the substrate 10. The size of the sectional shape constituting the bottom of the groove part formed at the time when the support is assembled is slightly larger than the substrate diameter or the substrate size. The substrate 10 can, therefore, be confined by the holder divided to a plurality. In the figure, 4, 5 denote the holding plate and 11 denotes a film, respectively.
    • 9. 发明专利
    • CONTROL SYSTEM FOR THIN FILM POLISHING DEVICE
    • JPH01310866A
    • 1989-12-14
    • JP14322988
    • 1988-06-10
    • HITACHI LTDHITACHI ELECTR ENG
    • TANAKA HIDEOKANEKO SHINICHISUGANO MITSUGISANO MAKOTOOTSUKA AKIRA
    • B24B49/04G01B11/06
    • PURPOSE:To surely eliminate the error in the measurement of the film thickness during the polishing work by grasping at least one among the first and second influence quantity to the measured value of the thickness of a thin film applied onto a substrate by the existence of grinding liquid and the residue formed during the polishing work and correcting the measured value of the film thickness during working. CONSTITUTION:A polishing head part 5 which polishes a thin film applied onto a substrate 1 through pouring the grinding liquid, film thickness measuring part 8 for optionally measuring the thickness of the thin film, and a control part 9 for controlling the operation of a polishing head on the basis of the variation of the measured film thickness are provided. The influence quantity to the measured value of the film thickness by the existence of the grinding liquid and the residue formed during the polishing work is grasped by a grinding liquid influence evaluation part 10 and a residue influence evaluation part 12 in the control part 9. The measured value of the film thickness during the polishing work is corrected by the influence quantity, and the error in the measurement of the film thickness is eliminated, and the polishing precision can be improved.
    • 10. 发明专利
    • TESTING DEVICE FOR SURFACE STRENGTH
    • JPS62162942A
    • 1987-07-18
    • JP413886
    • 1986-01-14
    • HITACHI LTD
    • NAKAMURA TAKAOSANO MAKOTO
    • G01N3/52
    • PURPOSE:To easily measure the surface strength of a body to be measured when an impact force operates by detecting the founding speed of a ball which falls on the surface of the object body in a rotation stop state and bounds and the horizontal falling distance when it falls on the object during rotation. CONSTITUTION:The bounding speed of the precise ball 8 which falls on the surface of the object body 7 on a table 15 in the rotation stop state and bounds is detected from the passing time of the separation distance l between two couples of sensors 14. then, the fall distance (x) of the ball 8 on the same horizontal plane when the ball 8 falls on the object body 7 in rotation and bounds is detected by a sensor 9. The test result is accepted when the bounding speed is larger than a set value and the falling distance (x) is smaller than a set value and rejected when not. Thus, the surface strength of the object body when a local impact force and a friction force operate on the surface of the object body is easily evaluated.