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1. 发明专利

DE4217431A1 未知
公开(公告)号：DE4217431A1
公开(公告)日：1992-12-03
申请号：DE4217431
申请日：1992-05-26
申请人： HITACHI LTD
发明人： HATADA TOSHIO , INOUYE HIROSHI , OHBA TAKAO , IWAI SUSUMU
IPC分类号： G06F1/20 , H01L23/36 , H01L23/467 , H05K7/20
摘要： In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40 DEG C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50 DEG to 60 DEG C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.

2. 发明专利

DE4106437C2 未知
公开(公告)号：DE4106437C2
公开(公告)日：1995-05-18
申请号：DE4106437
申请日：1991-02-28
申请人： HITACHI LTD
发明人： HATADA TOSHIO , MATSUSHIMA HITOSHI , KONDOU YOSHIHIRO , INOUE HIROSHI , OHTSUKA KANJI , SHIRAI YUJI , OHBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H01L23/473 , F28F3/02 , H01L23/367 , H01L23/467 , H05K7/10 , H05K7/20 , G06F1/20
摘要： An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.

3. 发明专利

DE69131273T2 未知
公开(公告)号：DE69131273T2
公开(公告)日：1999-09-23
申请号：DE69131273
申请日：1991-11-25
申请人： HITACHI LTD
发明人： OHASHI SHIGEO , NAKAJIMA TADAKATSU , KUWAHARA HEIKICHI , HATADA TOSHIO , MATSUSHIMA HITOSHI , SATO MOTOHIRO , INOUYE HIROSHI , OHBA TAKAO , YAMAGIWA AKIRA
IPC分类号： G06F1/00 , F28D15/02 , G06F1/20 , H05K7/20
摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members (4, 41) for thermally connecting semiconductor devices (1) whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards (2) onto which the semiconductor devices (1) and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing (5). Or, the circuit boards (2) and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members (4, 41) is obtained.

4. 发明专利

DE69131273D1 未知
公开(公告)号：DE69131273D1
公开(公告)日：1999-07-01
申请号：DE69131273
申请日：1991-11-25
申请人： HITACHI LTD
发明人： OHASHI SHIGEO , NAKAJIMA TADAKATSU , KUWAHARA HEIKICHI , HATADA TOSHIO , MATSUSHIMA HITOSHI , SATO MOTOHIRO , INOUYE HIROSHI , OHBA TAKAO , YAMAGIWA AKIRA
IPC分类号： G06F1/00 , F28D15/02 , G06F1/20 , H05K7/20
摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members (4, 41) for thermally connecting semiconductor devices (1) whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards (2) onto which the semiconductor devices (1) and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing (5). Or, the circuit boards (2) and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members (4, 41) is obtained.

5. 发明专利

DE69307753T2 未知
公开(公告)号：DE69307753T2
公开(公告)日：1997-08-28
申请号：DE69307753
申请日：1993-03-23
申请人： HITACHI LTD
发明人： MATSUSHIMA HITOSHI , KOMATU TOSHIHIRO , KONDOU YOSHIHIRO , HATADA TOSHIO , IWAI SUSUMU , HONMA TETSURO , IINO TOSHIKI , OHBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H05K7/20 , H05K7/00

6. 发明专利

DE69307753D1 未知
公开(公告)号：DE69307753D1
公开(公告)日：1997-03-13
申请号：DE69307753
申请日：1993-03-23
申请人： HITACHI LTD
发明人： MATSUSHIMA HITOSHI , KOMATU TOSHIHIRO , KONDOU YOSHIHIRO , HATADA TOSHIO , IWAI SUSUMU , HONMA TETSURO , IINO TOSHIKI , OHBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H05K7/20 , H05K7/00

7. 发明专利

DE4217431C2 未知
公开(公告)号：DE4217431C2
公开(公告)日：1994-08-04
申请号：DE4217431
申请日：1992-05-26
申请人： HITACHI LTD
发明人： HATADA TOSHIO , INOUYE HIROSHI , OHBA TAKAO , IWAI SUSUMU
IPC分类号： G06F1/20 , H01L23/36 , H01L23/467 , H05K7/20
摘要： In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40 DEG C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50 DEG to 60 DEG C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.

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