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1. 发明专利

DE102007050865A1 Functional component e.g. high frequency sensor, for use in micro electromechanical system, has reaction product layer produced on boundary layer when metal layer and substrate are connected together by anodic connection 未知
公开(公告)号：DE102007050865A1
公开(公告)日：2008-05-08
申请号：DE102007050865
申请日：2007-10-24
申请人： HITACHI LTD
发明人： HATA SHOHEI , SAKAMOTO EIJI , MATSUSHIMA NAOKI
IPC分类号： B81B7/02 , G01P15/08 , H03H3/02
摘要： The component (2) has a functional component layer and a sealed metal layer (3) formed on a substrate (1). The functional component layer lies opposite to another substrate (4), where the substrates are connected together by anodic connection over the metal layer. A reaction product layer is produced on a boundary layer between the metal layer and the substrate (4) after the formation of anodic connection when the metal layer and the substrate (4) are connected together by the anodic connection. The metal layer contains a primary component e.g. aluminum.

2. 发明专利

JP2014190875A Dynamic quantity measurement instrument and manufacturing method thereof 审中-公开
标题翻译：动态数量测量仪器及其制造方法
公开(公告)号：JP2014190875A
公开(公告)日：2014-10-06
申请号：JP2013067416
申请日：2013-03-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SHIMOKAWA HIDEYOSHI , YAMAGUCHI TAKUTO , HATA SHOHEI , OTA HIROYUKI
IPC分类号： G01L1/18 , G01B7/16 , G01L9/00
CPC分类号： G01B7/20 , G01B7/16 , H01L24/29 , H01L24/83 , H01L2224/29083 , H01L2224/73265 , H01L2224/83101 , H01L2224/83801
摘要： PROBLEM TO BE SOLVED: To provide a junction structure which detects strain occurring in a measurement object, with high sensitivity even under a high temperature and allows accurate sensor output even when applied with long-tern strain, by optimizing a junction between a sensor chip having a strain detection part on a semiconductor substrate and abase substrate.SOLUTION: A dynamic quantity measurement instrument includes: a sensor chip having, on a semiconductor substrate, a strain detection part for detecting expansion/contraction in an in-plane direction; a base substrate; and a wiring part for drawing a wire from an electrode of the sensor chip to the outside. A sensor chip rear surface opposite to a surface on which the strain detection part is provided and a front surface of the base substrate are joined via a layer of an intermetallic compound and a metal layer having a high melting point.
摘要翻译：要解决的问题：为了提供检测测量对象中的应变的接合结构，即使在高温下也具有高灵敏度，并且即使在施加长期应变时也能够精确地传感器输出，通过优化具有一种半导体衬底上的应变检测部件和缓冲衬底。解决方案：一种动态量测量仪器包括：传感器芯片，其在半导体衬底上具有用于检测面内方向的伸缩的应变检测部件; 基底; 以及用于将导线从传感器芯片的电极拉到外部的布线部分。与设置有应变检测部的表面相对的传感器芯片后表面和基底基板的前表面通过金属间化合物层和具有高熔点的金属层接合。

3. 发明专利

JP2010186090A Optical transceiver module 审中-公开
标题翻译：光收发模块
公开(公告)号：JP2010186090A
公开(公告)日：2010-08-26
申请号：JP2009030638
申请日：2009-02-13
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SAKIKAWA YUKIO , TAKAI TOSHIAKI , HATA SHOHEI
IPC分类号： G02B6/42
CPC分类号： G02B6/4215 , G02B6/4201 , G02B6/4214 , G02B6/423 , G02B6/424 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4253 , G02B6/4257 , G02B6/4259 , H04B10/40
摘要： PROBLEM TO BE SOLVED: To provide a compact and low-cost optical module that is used as a terminal for wavelength multiplexed optical transmission and single-core bidirectional optical transmission in which light with a plurality of wavelengths is transmitted by a single-optical fiber, and also to provide a manufacturing method of the module.
SOLUTION: A base 23 with a plurality of optical elements placed is prepared, as is an optical multiplexer/demultiplexer 3 with a wavelength selection filter and a mirror formed on the front and back faces of a substrate. These two components are mounted on a package 50 so that the optical element mounted face and the filter surface are substantially parallel to each other in the angle, with the optical elements being arranged so as to obliquely emit/receive a light with respect to the base 23. Consequently, the optical multiplexer/demultiplexer 3 can be mounted in parallel to the X-Y plane which facilitates machining of the package by using a lathe, and thus the cost can be reduced.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种紧凑且低成本的光学模块，其用作波长复用光传输和单芯双向光传输的终端，其中具有多个波长的光通过单个光传输来传输，光纤，并且还提供该模块的制造方法。解决方案：准备放置多个光学元件的基座23，以及形成在基板的正面和背面上的具有波长选择滤光器和反射镜的光复用器/解复用器3。这两个部件安装在封装件50上，使得光学元件安装面和滤光片表面在角度上基本上彼此平行，其中光学元件布置成相对于基座倾斜地发射/接收光因此，光学多路复用器/解复用器3可以平行于XY平面安装，这有利于通过使用车床来加工封装，因此可以降低成本。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010109204A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2010109204A
公开(公告)日：2010-05-13
申请号：JP2008280697
申请日：2008-10-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKAI TOSHIAKI , SAKIKAWA YUKIO , HATA SHOHEI
IPC分类号： H01S5/022 , G02B6/42
CPC分类号： G02B6/4246 , G02B6/29367 , H01S5/005 , H01S5/02212 , H01S5/02228 , H01S5/02284 , H01S5/02296 , H01S2301/176
摘要： PROBLEM TO BE SOLVED: To provide an optical module for obtaining good light-receiving sensitivity by suppressing an optical crosstalk caused by leak light without causing deterioration in characteristics and deterioration in reliability of a light-emitting element with a simple structure.
SOLUTION: An optical module includes a plurality of light-emitting elements 11 and light-receiving elements 12 mounted on a substrate 1 mounting optical elements. In the optical module, a light absorbing resin 6 for absorbing the light with a luminescence wavelength of the light-emitting element 11 is arranged in such a manner as to cover the side of the light-emitting element 11. Between the light absorbing resin 6 and the optical element mounting substrate 1, a non-adhesive layer 7 comprising a material that is non-adhesive to the light absorbing resin 6 is arranged.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种用于通过抑制由漏光引起的光学串扰而获得良好的光接收灵敏度的光学模块，而不会导致特性劣化和发光元件的简单结构的可靠性的劣化。解决方案：光学模块包括安装在安装光学元件的基板1上的多个发光元件11和光接收元件12。在光学模块中，以覆盖发光元件11的侧面的方式配置吸收具有发光元件11的发光波长的光的吸光树脂6.在光吸收树脂6 并且配置光学元件安装基板1，包括与光吸收树脂6不粘合的材料的非粘合层7。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2008105162A Functional element 有权
标题翻译：功能元素
公开(公告)号：JP2008105162A
公开(公告)日：2008-05-08
申请号：JP2006292598
申请日：2006-10-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HATA SHOHEI , SAKAMOTO EIJI , MATSUSHIMA NAOKI
IPC分类号： B81B3/00 , H01L23/10
CPC分类号： G01P15/0802 , B81B2201/0271 , B81C1/00269 , G01P1/023 , G01P15/0897 , H03H9/105 , H03H9/1057 , H03H9/173 , Y10T428/24273 , Y10T428/24322 , Y10T428/2462 , Y10T428/24826 , Y10T428/265
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive MEMS functional element, by improving airtightness of a joining part by anodic joining, in wafer level packaging of the functional element by MEMS. SOLUTION: The present invention has the functional element of forming a substrate mainly composed of Si by using a processing method, a sealed metallization film formed on the outer periphery of this functional element, and a glass substrate joined to this sealed metallization film by the anodic joining. A metallization film mainly composed of at least one of Sn and Ti or a metallization film of combining these, is formed on a metallization film mainly composed of Al in a surface part of this sealed metallization film. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过MEMS在功能元件的晶片级封装中通过阳极接合提高接合部分的气密性来提供廉价的MEMS功能元件。解决方案：本发明具有通过使用加工方法形成主要由Si构成的基板的功能元件，形成在该功能元件的外周上的密封金属化膜和与该密封金属化膜接合的玻璃基板通过阳极接合。在该密封金属化膜的表面部分的主要由Al组成的金属化膜上形成主要由Sn和Ti中的至少一种构成的金属化膜或组合这些的金属化膜。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007281062A Electronic-component joined body, and electronic circuit module using the same and its manufacturing method 审中-公开
标题翻译：电子元件接合体和使用其的电子电路模块及其制造方法
公开(公告)号：JP2007281062A
公开(公告)日：2007-10-25
申请号：JP2006102986
申请日：2006-04-04
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HATA SHOHEI , SAKAMOTO EIJI , MATSUSHIMA NAOKI
IPC分类号： H01L23/10 , C03C27/02 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L23/15 , C04B37/045 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/365 , C04B2237/592 , C04B2237/62 , C04B2237/704 , C04B2237/72 , H01L21/481 , H01L24/16 , H01L24/32 , H01L24/48 , H01L25/0657 , H01L25/50 , H01L2224/04042 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16225 , H01L2224/29111 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/8389 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/09701 , H01L2924/10253 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/00 , H01L2924/01014 , H01L2924/3512 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a technique for joining a glass plate to an insulator or a non-oxidized semiconductor substrate like SiC without using a bonding agent. SOLUTION: A metallization is formed on the upper face of the insulator or the non-oxidized semiconductor substrate like SiC as a first substrate. A glass substrate including ions dispersible by a voltage is formed as a second substrate. The metallization of the first substrate and the second glass substrate are joined by anode bonding. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将玻璃板连接到诸如SiC之类的绝缘体或非氧化半导体衬底的技术，而不使用粘合剂。解决方案：在诸如SiC的绝缘体或非氧化半导体衬底的上表面上形成金属化作为第一衬底。形成包括可被电压分散的离子的玻璃基板作为第二基板。第一基板和第二玻璃基板的金属化通过阳极接合而接合。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2002151541A ELECTRONIC COMPONENT 失效
公开(公告)号：JP2002151541A
公开(公告)日：2002-05-24
申请号：JP2000348243
申请日：2000-11-15
申请人： HITACHI LTD
发明人： HATA SHOHEI , KAWAMOTO KAZUTAMI , TOKUDA MASAHIDE , MATSUYOSHI MARI , MOGI TOSHIYUKI , KITO SHIGEFUMI , NISHIKAWA TORU , TAKANE ETSUKO
IPC分类号： H05K3/34 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To prevent stripping of a solder film during storage. SOLUTION: A multilayer solder film 12 has a three layer structure where an Sn film 12b is sandwiched between Au films 12a and 12c. Film thickness t1, t3 of the Au films 12a and 12c is designed such that the thickness t1 of the outermost Au film 12c is less than twice of the thickness t3 of an Au film 11a touching an aluminum electrode and the substrate region 10a on the periphery thereof.

8. 发明专利

JP2010212387A Junction structure of semiconductor device, manufacturing method therefor and alloy foil for junction 审中-公开
标题翻译：半导体器件的结构结构及其制造方法及合金箔
公开(公告)号：JP2010212387A
公开(公告)日：2010-09-24
申请号：JP2009055885
申请日：2009-03-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HATA SHOHEI , TAKAI TOSHIAKI , SAKIKAWA YUKIO
IPC分类号： H01L23/10 , G01P15/08 , G01P15/12 , H01L21/52 , H01L23/02
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/19107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a junction method that achieves joining by reducing a pressurizing force because, when joining a semiconductor such as Si or the like by utilizing eutectic reaction of Au with Si, an Si oxide film is broken and Si and Au are brought into contact with each other, so that a large pressurizing force is necessary and a manufacturing apparatus is made larger in size at high cost. SOLUTION: When joining by using alloy a substrate 12 wherein Si or the like tends to form an oxide on its surface, Au, an element Au-Ge layer 10 for lowering the melting point of Au, an element Al layer 6 for reducing an Si oxide SiO2 layer 11 and an alloy layer containing a Ti layer 9 as an adhesion layer are used to melt an alloy of Au at comparatively low temperature, and an oxide such as Si or the like on the surface is reduced and broken by elements having a reducing force in the melted alloy. Thus, the substrate 12 is joined by the reaction of Au with a semiconductor substrate containing Si or the like. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过降低加压力来实现接合的接合方法，因为当通过利用Au与Si的共晶反应来接合诸如Si等的半导体时，Si氧化物膜被破坏，Si 并且Au彼此接触，因此需要大的加压力，并且使制造装置的尺寸更大，成本更高。解决方案：通过使用其中Si等倾向于在其表面上形成氧化物的基底12接合Au，用于降低Au的熔点的元素Au-Ge层10，用于降低Au的熔点的元素Al层6 减少Si氧化物SiO 2层11和含有作为粘合层的Ti层9的合金层用于在相对低的温度下熔化Au的合金，并且表面上的诸如Si等氧化物被减少并破坏在熔融合金中具有还原力的元件。因此，基板12通过Au与含有Si等的半导体基板的反应而接合。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010147040A Semiconductor light emitting device and method of manufacturing same 审中-公开
标题翻译：半导体发光器件及其制造方法
公开(公告)号：JP2010147040A
公开(公告)日：2010-07-01
申请号：JP2008319085
申请日：2008-12-16
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ISHIDA SUSUMU , HATA SHOHEI
IPC分类号： H01L33/48 , H01L23/28 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a highly reliable structure by reducing the reflection factor of an interface between a semiconductor light emitting element and a sealing resin, and widening the critical angle of total reflection in order to improve external extraction efficiency of light rays.
SOLUTION: A sealing structure using a light-transmissive material is a double structure and has a relation of N1>N2>N3>1, where N1 is the refractive index of a semiconductor light emitting element, N2 is the refractive index of a first light-transmissive sealing material coming into contact with an element side surface of the semiconductor light emitting element, and N3 is the refractive index of a second light-transmissive sealing material for sealing the light emitting element further outside it, a light diffusing material having a high refractive index being mixed with a first resin.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了通过降低半导体发光元件和密封树脂之间的界面的反射系数来获得高度可靠的结构，并且扩大全反射的临界角以便提高光的外部提取效率射线。解决方案：使用透光材料的密封结构是双重结构，并且具有N1> N2> N3> 1的关系，其中N1是半导体发光元件的折射率，N 2是折射率与半导体发光元件的元件侧表面接触的第一透光密封材料，N3是用于将发光元件密封在其外部的第二透光密封材料的折射率，光漫射材料具有与第一树脂混合的高折射率。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2010060950A Optical module mounted with wdm filter and manufacturing method 审中-公开
标题翻译：光学模块安装WDM过滤器和制造方法
公开(公告)号：JP2010060950A
公开(公告)日：2010-03-18
申请号：JP2008227747
申请日：2008-09-05
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HATA SHOHEI , MATSUSHIMA NAOKI , TAKAI TOSHIAKI , SAKIKAWA YUKIO , ARAI SATOSHI
IPC分类号： G02B6/293 , G02B5/28 , G02B6/42 , H01L31/0232
摘要： PROBLEM TO BE SOLVED: To give a novel structure mass-producible without a complicated mounting step to a filter element suitable for an optical communication module for performing transmission and receiving of three or more of optical signals differed in wavelength. SOLUTION: A filter element includes: a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces; a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression; and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element is mass produced with a high accuracy and a low cost by the wafer-level process. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了给适合于用于执行波长不同的三个或更多个光信号的发送和接收的光通信模块的滤波器元件，提供大量生产而不需要复杂安装步骤的新颖结构。滤波器元件包括：具有一对平行表面的第一玻璃基板和布置在其中一个平行表面上的带通滤波器; 一对单晶基板（Si晶片），每个单晶基板包括形成有具有相对于主表面的倾斜表面的凹陷的主表面占据凹陷的开口的至少一半的一个; 以及具有光学元件的第二玻璃基板。单晶衬底对的主表面被接合到玻璃衬底的一对表面上。凹陷面向玻璃基板并围绕带通滤光片。通过这种构造，通过晶片级处理，以高精度和低成本大量生产过滤元件。版权所有（C）2010，JPO＆INPIT

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