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1. 发明专利

DE69635097T2 未知
公开(公告)号：DE69635097T2
公开(公告)日：2006-06-14
申请号：DE69635097
申请日：1996-06-20
申请人： HITACHI LTD
发明人： FUKUDA KAZUYUKI , SHIMAOKA MAKOTO , KANEKO SATOSHI , ITO KAZUHIRO , NISHIYAMA SHINZO , KITO SHIGEFUMI , TAKAI ATSUSHI , MIURA ATSUSHI , TONEHIRA KOICHIRO
IPC分类号： G02B6/32 , G02B6/42 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/024 , H01S5/40
摘要： An optical semiconductor array module 100 comprising an optical semiconductor array device 1 constituted by a plurality of semiconductor laser diodes, light-emitting diode elements or semiconductor photo diode elements, an electronic device 5 for driving and controlling the optical semiconductor array device 1, a cube-shaped package case 10 for housing the optical semiconductor array device 1 and the electronic device 5, an optical fiber array 3 optically coupled to the optical semiconductor array device 1, a supporting member 7 for holding and fixing the optical fiber array 3 to one surface of the cube-shaped package case 10, and a terminal portion having a plurality of pins 11 for electrically connecting an external circuit board to the electronic device 5. The terminal portion is formed by extending the terminal portion from at least one of the surfaces forming the package case 10, excluding a surface on which the optical semiconductor array device 1 and the electronic device 5 are mounted and a surface opposite to that surface, and the plurality of pins 11 are mounted in a surface of the terminal portion which crosses at right angles with a surface from which the optical fiber array 3 is taken out.

2. 发明专利

DE69635097D1 未知
公开(公告)号：DE69635097D1
公开(公告)日：2005-09-29
申请号：DE69635097
申请日：1996-06-20
申请人： HITACHI LTD
发明人： FUKUDA KAZUYUKI , SHIMAOKA MAKOTO , KANEKO SATOSHI , ITO KAZUHIRO , NISHIYAMA SHINZO , KITO SHIGEFUMI , TAKAI ATSUSHI , MIURA ATSUSHI , TONEHIRA KOICHIRO
IPC分类号： G02B6/32 , G02B6/42 , H01S5/00 , H01S5/022 , H01S5/024 , H01S5/40 , H01S5/02
摘要： An optical semiconductor array module 100 comprising an optical semiconductor array device 1 constituted by a plurality of semiconductor laser diodes, light-emitting diode elements or semiconductor photo diode elements, an electronic device 5 for driving and controlling the optical semiconductor array device 1, a cube-shaped package case 10 for housing the optical semiconductor array device 1 and the electronic device 5, an optical fiber array 3 optically coupled to the optical semiconductor array device 1, a supporting member 7 for holding and fixing the optical fiber array 3 to one surface of the cube-shaped package case 10, and a terminal portion having a plurality of pins 11 for electrically connecting an external circuit board to the electronic device 5. The terminal portion is formed by extending the terminal portion from at least one of the surfaces forming the package case 10, excluding a surface on which the optical semiconductor array device 1 and the electronic device 5 are mounted and a surface opposite to that surface, and the plurality of pins 11 are mounted in a surface of the terminal portion which crosses at right angles with a surface from which the optical fiber array 3 is taken out.

3. 发明专利

JPH07113927A OPTICAL PARALLEL MODULE 失效
公开(公告)号：JPH07113927A
公开(公告)日：1995-05-02
申请号：JP25799893
申请日：1993-10-15
申请人： HITACHI LTD
发明人： TAKAYAMA KAZUTOSHI , MOGI SACHIHIRO , KANEKO SATOSHI , KONO TSUTOMU , KITO SHIGEFUMI
IPC分类号： G02B6/42
摘要： PURPOSE:To uniformly obtain the light outputs of the optical parallel module over a wide temp. range. CONSTITUTION:Constituting members including plural pieces of optical elements formed to an array form having an optical transmission relation, an optical lens array 2 and a ferrule 3 for protecting an optical fiber array 4 are so selected that the coeffts. of thermal expansion increase in order of arrangement. Then, the coeffts. of thermal expansion of materials increase in order of the arrangement, i.e. the optical element array 1, the optical lens array 2 and the ferrule 3 protecting the optical fiber array 4 and, therefore, a laser beam successively spreading in an outer channel direction by thermal expansion as temp. rises is easily taken into the optical lenses and fibers and alignment is executed with high accuracy if a semiconductor laser array (LD array) is used for, for example, the optical element array 1 and, therefore, the sufficient light outputs of the optical parallel module are uniformly obtd. over the wide temp. range.

4. 发明专利

JPH06331858A MODULE 失效
公开(公告)号：JPH06331858A
公开(公告)日：1994-12-02
申请号：JP12111193
申请日：1993-05-24
申请人： HITACHI LTD
发明人： KITO SHIGEFUMI , MOGI SACHIHIRO , KANEKO SATOSHI , KONO TSUTOMU , TAKAYAMA KAZUTOSHI
IPC分类号： G02B6/42
摘要： PURPOSE:To reduce the occupancy area of radiation fins on a substrate and to provide a compact optical module equipped with radiation fins by holing the substrate to be packaged with a module, inserting the module to this hole and attaching radiation fins on and under the module. CONSTITUTION:An optical module 1 having an IC and a light emitting or receiving element which generate heat is provided with tapped holes for attaching of radiation fins for the purpose of providing radiation fins 2, which sufficiently radiate the heat from the heating bodies, on and under the optical module. The optical module 1 is provided with an attaching part 4 to the substrate, and the attaching part 4 is provided with tapped holes. Radiation fins 2 are provided with tapped holes for attaching to the optical module 1, and radiation fins 2 having the optical module size are fixed to the optical module. Consequently, it is possible to have the radiation face on both faces of a module attaching substrate 3. Thus, the height of mounting is increased twice, and radiation fins can have sufficient height.

5. 发明专利

JP2000208855A METHOD AND DEVICE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JP2000208855A
公开(公告)日：2000-07-28
申请号：JP606699
申请日：1999-01-13
申请人： HITACHI LTD
发明人： MOGI TOSHIYUKI , SASAKI HIROYASU , KAWAMOTO KAZUTAMI , OTA HIROYUKI , KITO SHIGEFUMI
IPC分类号： H01S5/00 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide a method for mounting on a base substrate with high precision without being influenced by a melting condition of solder by melting solder under a condition where an optical semiconductor element is held with a chuck. SOLUTION: An optical semiconductor element 1 is positioned over a base substrate 3 and solder 2, and the optical semiconductor element 1 is applied as load, to an optical semiconductor element chuck 14 holding the optical semiconductor element 1, pressed against the base substrate 3 with uniform load with the solder 2 in between. Light is projected as heating light from a heating emission lens 31 provided below the base substrate 3, and transmitted through a base heating aperture 23 formed of quartz glass and a base absorption part 21, and supplied to the base substrate 3, to melt solder 2. As a result, a method for mounting onto the base substrate 3 with high precision without being influenced by a melting condition of the solder 2 is provided.

6. 发明专利

JPH0933764A OPTICAL TRANSMISSION MODULE 失效
公开(公告)号：JPH0933764A
公开(公告)日：1997-02-07
申请号：JP18381995
申请日：1995-07-20
申请人： HITACHI LTD
发明人： KITO SHIGEFUMI , KANEKO SATOSHI , SUEJIMA TETSUJI
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide a parallel optical transmission module which has low inter-channel variance, good operability, and high reliability. SOLUTION: This optical transmission module consists of a housing 31 which is precisely mounted with an electric circuit having some of functions of a circuit driving a light emitting or receiving element and a light emitting or receiving element array having electric connections with the electric circuit and has a cylindrical window in its flank and an optical fiber array 34 which has plural single-mode optical fibers fixed to a member such as a zirconia ferrule 32 having fiber guide grooves and also has their periphery covered with a metallic cylindrical sleeve 33; and the light emitting or receiving element array in the housing and the fiber array 34 are optically coupled with each other through the cylindrical window in the flank of the housing and the metallic cylindrical sleeve 33 outside the fiber array and part of the flank of the housing 31 are fixed by being welded.

7. 发明专利

JPH07106607A OPTICAL RECEIVER MODULE 失效
公开(公告)号：JPH07106607A
公开(公告)日：1995-04-21
申请号：JP24656693
申请日：1993-10-01
申请人： HITACHI LTD
发明人： KITO SHIGEFUMI , KANEKO SATOSHI , KONO TSUTOMU , TAKAYAMA KAZUTOSHI
IPC分类号： G02B6/42 , H01L31/02
摘要： PURPOSE:To shorten the assembling time by providing a wiring pattern in a package incorporating a light receiving element without using any submount and soldering the light receiving element directly to the wiring pattern thereby reducing the number of components and the work steps. CONSTITUTION:A wiring pattern 7 for connecting a light receiving element array 1 electrically with a driver IC 5 is formed on a package 3. The IC 5 and the light receiving array 1 are then mounted on the package 3 and connected electrically through an Au wire 6. When the light receiving array 1 is mounted on the package 3, each electrode of a plurality of light receiving elements is soldered to each electrode of the wiring pattern 7 formed on the package 3. When the optical axis is adjusted to transmit the light while keeping one and one correspondence between the light receiving element and an optical fiber before fixing thereof, number of the compositions members can be decreased and the assembling time is shortened resulting in an inexpensive light receiving module.

8. 发明专利

JPH06331857A PHOTODETECTOR MODULE 失效
公开(公告)号：JPH06331857A
公开(公告)日：1994-12-02
申请号：JP11953693
申请日：1993-05-21
申请人： HITACHI LTD
发明人： KANEKO SATOSHI , KONO TSUTOMU , MOGI SACHIHIRO , KITO SHIGEFUMI , TAKAYAMA KAZUTOSHI
IPC分类号： G02B6/42
摘要： PURPOSE:To make a photodetector module small in size and low in cost by fixing a submount, on which plural (or 1ch) photodetectors are mounted, and the ferrule subjected to tip treatment of plural (or single-core) optical fibers while holding optical transmission relations. CONSTITUTION:Light propagated in an optical fiber array 4 is thrown to a photo diode array 2 which is arranged and fixed so as to have optical transmission relations, and this light is transformed into an electric signal. In this case, the array 4 and the array 2 are optically coupled directly, and they are mechanically joined by a submount 1 and a ferrule 3. The submount 1 is formed like L, and an electrode pattern is formed on the mounting face for the array 2. The ferrule 3 is provided with a step in the front end and is joined to the submount 1 by solder or the like.

9. 发明专利

JPH05323159A PHOTOSEMICONDUCTOR MODULE AND ITS MANUFACTURE 失效
公开(公告)号：JPH05323159A
公开(公告)日：1993-12-07
申请号：JP13042392
申请日：1992-05-22
申请人： HITACHI LTD
发明人： KANEKO SATOSHI , MOGI SACHIHIRO , KITO SHIGEFUMI , YOSHIYA TSUTOMU
IPC分类号： G02B6/32 , G02B6/38 , G02B6/42
摘要： PURPOSE:To easily align the optical axes of an optical element array and a lens array with each other and to prolong the life of the module when the photosemiconductor module which couples the optical element array with the optical fiber array through the lens array is put in a package in an airtightly sealed state. CONSTITUTION:Light is projected from a semiconductor laser array 1, coupled with the lens array 2, and further coupled with the optical fiber array of an optical fiber package engaged with a semiconductor laser array package through the lens array 2. At this time, the semiconductor laser array 1 is airtightly charged in the package 3 with the lens array 2 and a lid 8. The optical axes of the lens array 2 and semiconductor laser array 1 are positioned by making the elements at both ends of the semiconductor laser array 1 illuminate by using a dummy electrode formed in a block 5 and measuring the light emission intensity of the laser light projected from the lens 2 by a camera. Inert gas is charged in the package 3.

10. 发明专利

JPH05218506A OPTICAL TRANSMITTING MODULE 失效
公开(公告)号：JPH05218506A
公开(公告)日：1993-08-27
申请号：JP1867592
申请日：1992-02-04
申请人： HITACHI LTD
发明人： KITO SHIGEFUMI , MOGI SACHIHIRO , KANEKO SATOSHI
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/00
摘要： PURPOSE:To realize a compact optical transmitting module of good producibility by providing an electric circuit for controlling a photosensitive or light emitting element and the array-like element on the same wiring board, by projecting a wiring board outside a package and by supporting an electrode terminal outside a module package. CONSTITUTION:An electric circuit 12 (A light emitting element is a driving IC and a photosensitive element is an amplifying IC.) for controlling an array- like light emitting element or photodetector 11 is fixed by soldering, etc., to an about 1mm-thick Cu, CuW, or ceramic wiring board 14 and connected to an electrode pattern 13 by wire bonding, etc. The array-like element 11 is fixed to the wiring board 14 by soldering, etc., and connected to the electric circuit 12 for controlling by connecting with an electrode pattern 13 on the wiring board 14. An electrode pattern 13 is provided by vacuum deposition of about 1000Angstrom using Cr as a foundation layer and manufactured by patterning by photolithography after Ni of about 2mum is plated thereon.

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