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    • 1. 发明专利
    • CLOSE CONTACT LINE SENSOR
    • JPH0376371A
    • 1991-04-02
    • JP21131989
    • 1989-08-18
    • HITACHI LTD
    • MURAKAMI MOTOJIHARA HIDEKAZUSEKINO SHIGEJI
    • H04N1/028H01L27/146
    • PURPOSE:To attain drying at an average speed for the entire part at the drying process after rinsing by providing a pseudo pattern provided to a close contact type line sensor to a thin wiring pattern pattern so as to eliminate dense and thin parts of the pattern thereby uniformizing the pattern. CONSTITUTION:A pseudo pattern 4 is formed by means of the lithography technology being the known pattern forming method by using the same mask pattern as for a conductor thin film layer 12 and a lower electrode pattern and a wire pattern 3 for a picture element 1 formed in advance on an insulation substrate 6. Through the constitution above, a chevron shaped pseudo pattern, in this embodiment, is formed between wiring pattern groups 3 at both ends of each drive system IC 2 and all patterns are formed dense other than the surrounding of the picture element 1. Thus, the residua at drying are moved from the surrounding to the pseudo pattern and the residua around the picture element (lower electrode) are remarkably reduced in comparison with the case without the pseudo pattern.
    • 2. 发明专利
    • HEAT SENSITIVE RECORDING HEAD
    • JPH0257359A
    • 1990-02-27
    • JP20835088
    • 1988-08-24
    • HITACHI LTD
    • KISHIDA JUICHINAKAYAMA HIROTAKEHARA HIDEKAZU
    • B41J2/335
    • PURPOSE:To prevent the quality of a picture from deteriorating by forming an adhesive layer made of any of molybdenum, titanium, nickel, chromium or their alloy on the uppermost layer of a common electrode in contact with a wear resistant protective layer. CONSTITUTION:After many heat generating resistors 21 and wirings 30 are formed in one row in a direction perpendicular to this sheet face on the high resistance board 10 of a heat sensitive recording head, a protective layer 40 is formed, four layers of lower layer chromium 51 having good adhesive properties with a lower layer metal, copper 52 of one of solder connecting metal layers, gold 53 for improving solderability by preventing the surface of the copper from oxidizing, and an upper layer chromium 54 having satisfactory adhesive properties with the gold and silicon nitride are formed by a sputtering method continuously in the same chamber, and a common electrode 50 to be connected to external wirings and a heat generating resistor driving IC connecting electrode 60 are formed. As a result, even after a silicon nitride film 71 of a common wear resistant protective layer is formed on the electrode 50 and the resistor 21 by a plasma CVD method, it can prevent the film 71 on the electrode 50 from peeling and prevent the quality of an image from decreasing.
    • 6. 发明专利
    • Driving system for thermal recording head
    • 热记录头驱动系统
    • JPS59187877A
    • 1984-10-25
    • JP6215383
    • 1983-04-11
    • Hitachi Ltd
    • YORITOMI YOSHIFUMITANAKA MINORUIKEDA TAKAHISAHARA HIDEKAZU
    • H05B3/00B41J2/36B41J2/375H04N1/23
    • B41J2/36
    • PURPOSE:To achieve both clear image quality and prolonging the useful life of heating resistors, by a method wherein an electric current passed to heating resistors for developing the color of a thermal recording paper is divided into a plurality of parts for recording of a single dot, and a current passing time for the first section is set to be longer than that for the other sections. CONSTITUTION:The electric current passed to the heating resistors is divided into several - several tens of parts, and the current passing time for the first section is set to be longer than that for the second and later sections. Preferably, for example, the current passing time for the first section is set to be 0.25ms, and thereafter, an OFF period of 60mus and an ON period of 20mus are repeated 9 times. Accordingly, the curve of the temperature of the heating resistors against the current passing time becomes trapezoidal in shape, so that the maximum temperature reached can be lowered, as compared with that for a triangular temperature curve obtained in conventional cases of a single passage of electric current.
    • 目的:为了实现清晰的图像质量和延长加热电阻器的使用寿命,通过一种方法,其中传递到用于显影热敏记录纸的颜色的加热电阻器的电流被划分成用于记录单个点的多个部分 并且将第一部分的电流通过时间设置为比其他部分的电流通过时间长。 构成:传递到加热电阻器的电流分为几十个部分,第一部分的电流通过时间设置为比第二部分和后续部分的电流通过时间长。 优选地,例如,将第一部分的电流通过时间设定为0.25ms,此后重复9次关闭周期为60mus,ON周期为20mus。 因此,加热电阻器的温度相对于电流通过时间的曲线在形状上变为梯形,从而与单次电通过的常规情况下获得的三角温度曲线相比,达到的最高温度可以降低 当前。
    • 7. 发明专利
    • Thermal head unit
    • 热头单元
    • JPS58188674A
    • 1983-11-04
    • JP7127182
    • 1982-04-30
    • Hitachi Ltd
    • HARA HIDEKAZU
    • B41J2/345H04N1/032H05K3/34H05K3/36
    • B41J2/345H05K3/3405H05K3/3447H05K3/36
    • PURPOSE:To provide a thermal head unit formed into a structure capable of soldering a base plate equipped with a heat generating element and the block terminal thereof and a print base plate equipped with matrix wiring, a connecting terminal and a connector by flowing flow solder. CONSTITUTION:A ceramic base plate 9 having a heat generating element, a two- layered wiring part and a block terminal 8 is adhered to a heat sink 7 while a print base plate 12 having a connecting terminal 10 and a connector 11 is attached thereto so as to coincide the block terminal 8 and the connecting terminal 10 and both of them are soldered. Wiring patterns 13, 14 are provided to the front and the back surfaces of the print base plate 12 and matrix wiring from the block terminal to corrector terminal of a transistor is constituted with respect to said patterns. The connecting terminal 10 connects the block terminal 8 and the wiring pattern 14 on the print base plate 12. The connecting terminal 10 of the base plate 12, the block terminal 8 and the connector 11 can be soldered by flowing flow solder only by one process.
    • 目的:提供一种热敏头单元,其形成为能够焊接配备有发热元件的基板及其阻挡端子的结构,以及通过流动焊料流动地配置有矩阵布线,连接端子和连接器的印刷基板。 构成:具有发热元件,二层布线部分和块状端子8的陶瓷基板9粘附到散热器7,同时具有连接端子10和连接器11的印刷基板12附接到散热器7, 以使块端子8和连接端子10一致,并且它们都被焊接。 布线图案13,14设置在打印基板12的前表面和后表面上,并且相对于所述图案构成了从晶体管端子到晶体管的校正端子的矩阵布线。 连接端子10连接打印基板12上的块端子8和布线图案14.基板12,块端子8和连接器11的连接端子10可以仅通过一个流程焊接流动焊料 。
    • 8. 发明专利
    • Package method for diode matrix
    • 二极体矩阵的包装方法
    • JPS54148470A
    • 1979-11-20
    • JP5669678
    • 1978-05-15
    • Hitachi Ltd
    • IKEDA TAKAHISAHARA HIDEKAZUMATSUMOTO HISASHIISHI ICHIROU
    • H05K1/14H01L25/07H03K17/76H05K1/00H05K1/18
    • H03K17/76H05K1/0393H05K1/182
    • PURPOSE:To secure an easy packaging of the diode through the automatic inserter and the automatic soldering device by providing both the load side land and the power source side land for the diode and then inserting the diode. CONSTITUTION:Conductor strip 32 is formed on flexible substrate 3 with its one end connected to the electrode of the heat-sensitive head, and load side land 323 of diode 5 is provided at the other end of strip 32. And power source side land 324 of diode 5 is provided in parallel to land 323 as if diode 5 covered over strip 32 which is formed into blocks with every fixed number. At the same time, the lead wire of diode 5 is inserted through the pierced hole formed on diode substrate 2 to be bent on land 323 and 324 of substrate 3. Thus, the lead wire of the diode is inserted from one direction to ensure use of the automatic inserter. Furthermore, all soldering work can be carried out through the automatic soldering device.
    • 目的:通过为二极管提供负载侧焊盘和电源侧焊盘,然后插入二极管,确保二极管通过自动插入器和自动焊接装置的简单封装。 构成:导体条32形成在柔性基板3上,其一端连接到热敏头的电极,二极管5的负载侧焊盘323设置在带32的另一端。电源侧焊盘324 二极管5与平台323平行地设置,好像二极管5覆盖在条32上,每个固定数量形成块。 同时,二极管5的引线通过形成在二极管基板2上的穿孔插入,以在基板3的焊盘323和324上弯曲。因此,二极管的引线从一个方向插入以确保使用 的自动插入器。 此外,所有焊接工作都可以通过自动焊接装置进行。
    • 9. 发明专利
    • THERMAL HEAD
    • JPS54139558A
    • 1979-10-30
    • JP4646078
    • 1978-04-21
    • HITACHI LTD
    • HARA HIDEKAZUISHII YOSHIYUKIIWAMOTO HIDEO
    • B41J2/335
    • PURPOSE:To make effective use of the respective advantages that thin film system and thick film system possess by making heating element parts by the thin film system and common lead multilayer wiring parts and driver multilayer wiring parts by the thick film system. CONSTITUTION:In the thermal head provided with the heating element part consisting of a multiplicity of heating resistance elements and mulilayer wiring parts for high speed driving of the heating resistance elements by dividing them to blocks on a high resistance substrate; a thin film substrate 10 formed with heating resistance elements 8 and electrodes 9 by a thin film system, a thick film substrate 11 formed with the mount portions of separating diodes 2 on ceramics, common lead multilayer wiring part 3, common lead terminal part 4 on ceramics by a thick film system and a thick film substrate 12 formed with the mount portions of the separating diodes 2, driver multilayer wiring part 5, driver terminal part 6 by a thick film system on ceramics are disposed and bonded by means of adhesives on a heat sink 7 composed of metal of good heat conductivity as a substrate.
    • 10. 发明专利
    • PRODUCTION OF THERMAL HEAD
    • JPS54139557A
    • 1979-10-30
    • JP4645178
    • 1978-04-21
    • HITACHI LTD
    • HARA HIDEKAZUISHII YOSHIYUKIIWAMOTO HIDEO
    • H01L49/00B41J2/335B41J2/345
    • PURPOSE:To solve the difficulty of pattern alignment and improve the yield of thermal heads by providing dimensional allowances to the patterns of a heating element forming photo mask and the patterns of an electrode forming photo mask. CONSTITUTION:A Ta2N film is formed on a high resistance substrate and photo resist is exposed by using a heating resistor forming photo mask of a pattern width W1 and integroove spacing G1, whereby the shaded light transmission parts are sensitized. When the resist is removed after the etching, the Ta2N film remains as the patterns of the heating resistors 3 as shown by shaded line. Next. a NiCr-Au film is evaporated thereon and the photo resist is exposed by using an electrode photo mask of a pattern width W2 smaller than the width W1 and of an interpattern spacing G2 smaller than the spacing G1, whereby the shaded light transmission parts are sensitized. When the resist is removed after the etching, the NiCr-Au film remains like the shading as the patterns of the electrodes 4, whereby the heating resistor patterns and lead wire patterns are formed.