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    • 4. 发明专利
    • ION BEAM MILLING DEVICE
    • JPH0941165A
    • 1997-02-10
    • JP19069995
    • 1995-07-26
    • HITACHI LTD
    • FUJISHIRO MASAHARUOISHI SEITAROISHIZAKI HIROSHITOGAWA EISEI
    • C23F4/00H01L21/302H01L21/3065
    • PROBLEM TO BE SOLVED: To perform etching accurately by a target etching amount in the device using a gaseous reactant as a gas to be formed into a plasma. SOLUTION: In this device, when a gaseous reactant is formed into a plasma, a carbide is produced and deposited on a decelerating electrode 11 and, accordingly, the decelerated current value is increased to change the etching rate. At this time, the decelerated current value Idec , is measured with a decelerated current measuring device 14 and, based on this measured decelerated current value Idec , the actual etching amount Etb at a reduced etching rate due to the increase in decelerated current is estimated by an etching amount estimation section 34. The deviation Etc of the actual etching amount Etb from a target etching amount E is determined by a deviation calculation section 35 and the milling time Tm1 is newly determined by a milling time calculation section 36 so that the deviation Etc becomes substantially zero and the determined milling time Tm1 is instructed to respective power source circuits by a controlled variable instruction section 32.