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    • 2. 发明专利
    • SAMPLE SUPPORTING DEVICE
    • JPH10317171A
    • 1998-12-02
    • JP13193597
    • 1997-05-22
    • HITACHI LTD
    • ONUKI HISAOOISHI SEITAROTANAKA SHIGERUSEKIMOTO SHINYA
    • C23F4/00H01L21/302H01L21/3065H01L21/68H01L21/683
    • PROBLEM TO BE SOLVED: To increase the number of samples to be attached in the same area, and to easily attach/detach the samples by pressing the sample arranged between an inner pressing piece and an outer pressing piece mounted on a sample stage against the pressing piece on one side by the pressing piece on the other side, and fixing the sample. SOLUTION: In a vacuum chamber, a sample mounted on a sample stage of a rotating sample holder is irradiated with the ion beam in which the introduced ion gas is accelerated by acceleration electrodes. An inner pressing piece 30 and an outer pressing piece 31 are movably mounted by screws 32 on a sample stage 14A of a sample supporting device of an ion beam machining equipment. A plurality of samples 13A-13D are arranged between the pressing pieces, held and temporarily fixed thereto. The screws 32 of the outer pressing piece 31 are loosened while the inner pressing piece 30 is fixed, the samples 13A-13D are pressed against the inner pressing piece 30 through the outer pressing piece 31, and then, the screws 32 are tightened to fix the samples between the pressing pieces.
    • 3. 发明专利
    • ION BEAM MILLING DEVICE
    • JPH0941165A
    • 1997-02-10
    • JP19069995
    • 1995-07-26
    • HITACHI LTD
    • FUJISHIRO MASAHARUOISHI SEITAROISHIZAKI HIROSHITOGAWA EISEI
    • C23F4/00H01L21/302H01L21/3065
    • PROBLEM TO BE SOLVED: To perform etching accurately by a target etching amount in the device using a gaseous reactant as a gas to be formed into a plasma. SOLUTION: In this device, when a gaseous reactant is formed into a plasma, a carbide is produced and deposited on a decelerating electrode 11 and, accordingly, the decelerated current value is increased to change the etching rate. At this time, the decelerated current value Idec , is measured with a decelerated current measuring device 14 and, based on this measured decelerated current value Idec , the actual etching amount Etb at a reduced etching rate due to the increase in decelerated current is estimated by an etching amount estimation section 34. The deviation Etc of the actual etching amount Etb from a target etching amount E is determined by a deviation calculation section 35 and the milling time Tm1 is newly determined by a milling time calculation section 36 so that the deviation Etc becomes substantially zero and the determined milling time Tm1 is instructed to respective power source circuits by a controlled variable instruction section 32.