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1. 发明专利

DE69839104D1 未知
公开(公告)号：DE69839104D1
公开(公告)日：2008-03-27
申请号：DE69839104
申请日：1998-04-14
申请人： HITACHI CHEMICAL CO LTD
发明人： KOBAYASHI KAZUHITO , KUMASHIRO YASUSHI , TAKAHASHI ATSUSHI , MORITA KOJI , TANABE TAKAHIRO , YAMAMOTO KAZUNORI , NAKASO AKISHI , ARIKE SHIGEHARU , OTSUKA KAZUHISA , URASAKI NAOYUKI , FUJIMOTO DAISUKE , TAKANO NOZOMU
IPC分类号： H05K3/46 , C09D5/00 , H05K1/03
摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

2. 发明专利

DE112005002748T5 未知
公开(公告)号：DE112005002748T5
公开(公告)日：2007-09-06
申请号：DE112005002748
申请日：2005-11-10
申请人： HITACHI CHEMICAL CO LTD
发明人： OGAWA NOBUYUKI , ONOZEKI HITOSHI , TANABE TAKAHIRO , TAKAI KENJI , MORIIKE NORIO , TAKANEZAWA SHIN , EJIRI TAKAKO , KUMAKURA TOSHIHISA
IPC分类号： H05K1/09
摘要： Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

3. 发明专利

MY143242A METAL FOIL PROVIDED WITH ADHESION AUXILIARY MATERIAL AND PRINTED WIRING BOARD USING SAME 未知
公开(公告)号：MY143242A
公开(公告)日：2011-04-15
申请号：MYPI20055281
申请日：2005-11-10
申请人： HITACHI CHEMICAL CO LTD
发明人： OGAWA NOBUYUKI , ONOZEKI HITOSHI , TANABE TAKAHIRO , TAKAI KENJI , MORIIKE NORIO , TAKANEZAWA SHIN , EJIRI TAKAKO , KUMAKURA TOSHIHISA
IPC分类号： C09J109/00
摘要： ADHESIVE ADJUVANT FTRM MTAL@ FOIL, AND PRTNTED-WIRING BOARD PROVIDED IS AN ADHESIVE ADJ UVANT F ITTEDMETAL FOIL, COMPRISING AN ADHESIVE ADJUVANT LAYER HAVING A. THICKNESS OF 0.1 TO LO W ON 5 A METAL WHOSE SURF ACE HAS A TEN-POINT AVERAGE ROUGHNESS RZ OF 2.0 WN OR LESS. WHEREIN THE ADHESIVE ADJUVANT LAYER IS FON-LED FROM AN ADHESIVE ADJUVANT COMPOSITION COM PRISING; (A) AN EPOXY RESIN BELACTED I FROM THE GROUP CONSISTING OF A NOVO.LAX EPOXY RESIN AND AN ARALKYL EPOXY RESIN: ARID (C) AN EPOXY RE ISIN CURING AGENT.

4. 发明专利

JP2001119153A ADHESIVE SHEET AND PRODUCTION METHOD THEREOF AND MULTILAYER PRINTED WIRING BOARD USING ADHESIVE SHEET AND PRODUCTION METHOD THEREOF 失效
公开(公告)号：JP2001119153A
公开(公告)日：2001-04-27
申请号：JP30035499
申请日：1999-10-22
申请人： HITACHI CHEMICAL CO LTD
发明人： TANABE TAKAHIRO
IPC分类号： H05K3/38 , C09J7/02 , C09J11/04 , C09J163/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet exhibiting excellent workability in producing a multilayer printed wiring board having fluidity to fill the gap between circuit conductors of an inner circuit completely, a uniform low coefficient of thermal expansion and a reasonable rigidity, and to provide a production method of the adhesive sheet and a multilayer printed wiring board using the adhesive sheet. SOLUTION: An adhesive sheet comprises a copper foil or a carrier film and an insulating resin layer containing two kinds or more of filler having different shape. The adhesive sheet is produced by coating one side of a copper foil or a carrier film with resin varnish, produced by dispersing two kinds or more of filler having different shape into thermosetting resin, and then semicuring it thermally. A multilayer printed wiring board contains two kinds or more of filler having different shape in a layer insulating an inner layer circuit and an outer layer circuit. An adhesive sheet dispersed with two kinds or more of filler having different shape is laid on an inner layer circuit board to touch the resin and integrated by hot press and then via holes are made and an outer layer circuit is formed thus producing a multilayer printed wiring board.

5. 发明专利

JP2000349446A MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JP2000349446A
公开(公告)日：2000-12-15
申请号：JP15506799
申请日：1999-06-02
申请人： HITACHI CHEMICAL CO LTD
发明人： TANABE TAKAHIRO , TOSAKA YUJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To allow heat radiation of mounted components by laminating a semi-solidified adhesive layer where electric insulating filler is dispersed in a thermo-setting resin on an inner layer circuit board. SOLUTION: A thermo-setting resin varnish comprising an epoxy resin, bistriazine resin, polyimide resin, phenol resin, silicon resin, or denaturated resin of them, wherein an electric insulating filler using whiskers aluminum, wollastonite, potassium titanate, basic magnesium sulfate, magnesium oxide is dispersed, is coated on a copper foil 1 of thickness 18 μm using a knife coater. This is heated and dried at 150 deg.C for the minutes so that a solvent in the thermo-setting resin varnish is removed, for an adhesive layer 2 to be in semi- solidified state, which is laminated on an inter-layer circuit board.

6. 发明专利

JPH1022640A MULTILAYERED PRINTED WIRING BOARD 失效
公开(公告)号：JPH1022640A
公开(公告)日：1998-01-23
申请号：JP17357096
申请日：1996-07-03
申请人： HITACHI CHEMICAL CO LTD
发明人： IKEDA KENICHI , SUZUKI TAKAYUKI , TANAKA MASASHI , TANABE TAKAHIRO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To prevent unevenness of inner layer material from appearing on the surface of an outer layer, by using a double-sided copper clad film as the inner layer material which film is formed by sticking copper foils on both surfaces of a heat-resistant plastic film, via adhesive agent which contains, as essential ingredient, bifunctional or more epoxy resin and high molecular weight epoxy polymer capable of forming a film, SOLUTION: On both surfaces of a heat-resistant plastic film, excellent adhesion and resin flow characteristics are obtained by setting the compound ratio of bifunctional or more epoxy resin and high molecular weight epoxy polymer capable of forming a film, as 100wt.% of high molecular epoxy polymer and 10-50wt.% of epoxy resin in which the total amount is at least 30wt.% of the whole adhesive agent component. By heating and pressing a double-sides copper clad film (interposing heat-resistant plastic films as inner layer material, outside the double-sided copper clad film, via adhesive agent cured until a B stage), with an oilhydraulic press, unevenness of the inner layer material can be prevented from appearing on the surface of an outer layer.

7. 发明专利

JP2012250543A Adhesion assisting agent fitted metal foil, printed wiring board using the same and process for producing the same 有权
标题翻译：粘合剂辅助剂接合的金属箔，使用其的印刷电路板及其制造方法
公开(公告)号：JP2012250543A
公开(公告)日：2012-12-20
申请号：JP2012198395
申请日：2012-09-10
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TANABE TAKAHIRO , OGAWA NOBUYUKI , KUMAKURA YOSHITOSHI
IPC分类号： B32B15/092 , B32B15/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide an adhesion assisting agent fitted metal foil allowing electroless plating, a printed wiring board advantageous in the formation of fine wiring, electric properties and production costs, high in reliability and excellent in moisture absorbing and heat resisting property, and a process for producing the same.SOLUTION: The adhesion assisting agent fitted metal foil has an adhesion assisting agent layer having a thickness of 0.1-10 μm on metal whose surface has a ten-point average roughness Rz=2.0 μm or less and allows electroless plating by chemically roughening an adhesion assisting agent surface with the metal chemically removed. The metal foil is a copper foil subjected to rustproofing by at least one kind selected from nickel, tin, zinc, chromium, molybdenum, cobalt and oxides thereof. The adhesion assisting agent contains (A) an epoxy resin, (B) a polymer component which is able to be chemically roughed, (C) an epoxy resin curing agent, and (D) a curing accelerator. Furtheremore, 10-80 wt.% of (A) the epoxy resin is a rubber-modified epoxy resin. The component (B) is at least one kind selected from acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber particles, core-shell particles of butadiene rubber-acrylic resin, polyvinyl acetal resin and carboxylic acid modified polyvinyl acetal resin. Furthermore, the printed wiring board produced by a usual method using the foil and the process for producing the same are provided.
摘要翻译：要解决的问题：为了提供一种能够进行化学镀的附着辅助剂配合金属箔，有利于形成精细布线，电性能和生产成本，高可靠性和优异的吸湿性和耐热性的印刷线路板属性及其制造方法。解决方案：粘合辅助剂配合的金属箔在其表面具有十点平均粗糙度Rz =2.0μm或更小的金属上具有厚度为0.1-10μm的粘附辅助剂层，并且允许通过化学粗糙化进行化学镀金属化学去除的附着助剂表面。金属箔是通过选自镍，锡，锌，铬，钼，钴及其氧化物中的至少一种进行防锈的铜箔。粘合辅助剂含有（A）环氧树脂，（B）能够被化学粗化的聚合物组分，（C）环氧树脂固化剂和（D）固化促进剂。此外，（A）环氧树脂的10-80重量％是橡胶改性的环氧树脂。组分（B）是选自丙烯腈丁二烯橡胶，羧酸改性丙烯腈丁二烯橡胶，羧酸改性丙烯腈丁二烯橡胶颗粒，丁二烯橡胶 - 丙烯酸树脂的核 - 壳颗粒，聚乙烯醇缩醛树脂和羧酸改性聚乙烯缩醛树脂。此外，提供了通过使用箔的通常方法制造的印刷线路板及其制造方法。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2000345103A INSULATION VARNISH AND MULTILAYERED PRINTED CIRCUIT BOARD USING THE SAME 失效
公开(公告)号：JP2000345103A
公开(公告)日：2000-12-12
申请号：JP15506699
申请日：1999-06-02
申请人： HITACHI CHEMICAL CO LTD
发明人： KAMISHIRO YASUSHI , KOBAYASHI KAZUHITO , TAKAHASHI ATSUSHI , MORITA TAKASHI , TANABE TAKAHIRO
IPC分类号： B05D5/12 , B05D7/24 , C09D5/25 , C09D163/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain the subject insulation varnish that has excellent insulation reliability and excellent handleability and is useful for multilayer printed circuit board, or the like, by using a polymer material with a specific number-average molecular weight. SOLUTION: This varnish consists of (A) a resin, (B) an electric insulation whisker and contains (C) a polymer material with a number-average molecular weight of >=10,000. It is preferable that the component C is a resin that is compatible to an epoxy resin or a phenoxy resin, a brominated phenoxy resin or a high molecular weight epoxy resin with a number-average molecular weight of >=30,000, particularly a super-high molecular weight epoxy resin with a number-average molecular weight of >=80,000, and the content of the component C is in the range of from 5 to 7 wt.% on the solid basis in the varnish resin and the component B is a ceramic whisker with an average diameter of 0.3-3.0 μm and with an average length of 3-50 μm.

9. 发明专利

JPH11317573A MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH11317573A
公开(公告)日：1999-11-16
申请号：JP12323998
申请日：1998-05-06
申请人： HITACHI CHEMICAL CO LTD
发明人： TANABE TAKAHIRO , TAKAHASHI ATSUSHI
IPC分类号： H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To realize a method of manufacturing a multilayer printed wiring board, which is provided with an insulating layer that is high in insulating properties, capable of filling up irregularities on an inner circuit, and superior in workability, as well as a prepreg formed of glass cloth. SOLUTION: Whisker-filled adhesive agent sheets, composed of thermosetting resin and whiskers dispersed into resin are laminated on an inner circuit board, and a high-molecular adhesive sheet is laminated thereon for the formation of a multilayer printed wiring board, wherein the high-molecular adhesive sheet contains straight-chain epoxy polymer that is obtained by polymerizing bifunctional epoxy resin and bifunctional phenol which are in an weight ratio of epoxy group/phenol group=1/(0.9 to 1.1).

10. 发明专利

JP2003147171A METHOD FOR PRODUCING INSULATING RESIN COMPOSITION, INSULATING RESIN COMPOSITION, AND COPPER-FOIL LAMINATED INSULATING MATERIAL AND COPPER-CLAD LAMINATE 审中-公开
公开(公告)号：JP2003147171A
公开(公告)日：2003-05-21
申请号：JP2001350368
申请日：2001-11-15
申请人： HITACHI CHEMICAL CO LTD
发明人： TANABE TAKAHIRO , FUJITA HIROAKI
IPC分类号： C08J3/20 , B32B15/08 , B32B15/092 , C08K3/22 , C08K3/28 , C08K5/00 , C08K5/521 , C08K7/02 , C08L29/14 , C08L63/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an insulating resin composition used as a multilayer printed wiring board with flame retardance without any halogen flame retardant, high rigidity and heat resistance, and excellent in workability and reliability in a component mounting, to provide a copper-foil laminated insulating material having a layer of the insulating resin composition, and to provide a copper-clad laminate prepared by laminating a prepreg or a core with the copper-foil laminated insulation material. SOLUTION: The process for producing an insulating resin composition comprises mixing at 60-100 deg.C a composition containing an epoxy resin, an epoxy resin curing agent, a polyvinyl acetal resin, electrical insulating whiskers, a metal hydroxide, a coupling agent, a phosphorus compound, and solvent.

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