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1. 发明专利

JP2012250543A Adhesion assisting agent fitted metal foil, printed wiring board using the same and process for producing the same 有权
标题翻译：粘合剂辅助剂接合的金属箔，使用其的印刷电路板及其制造方法
公开(公告)号：JP2012250543A
公开(公告)日：2012-12-20
申请号：JP2012198395
申请日：2012-09-10
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TANABE TAKAHIRO , OGAWA NOBUYUKI , KUMAKURA YOSHITOSHI
IPC分类号： B32B15/092 , B32B15/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide an adhesion assisting agent fitted metal foil allowing electroless plating, a printed wiring board advantageous in the formation of fine wiring, electric properties and production costs, high in reliability and excellent in moisture absorbing and heat resisting property, and a process for producing the same.SOLUTION: The adhesion assisting agent fitted metal foil has an adhesion assisting agent layer having a thickness of 0.1-10 μm on metal whose surface has a ten-point average roughness Rz=2.0 μm or less and allows electroless plating by chemically roughening an adhesion assisting agent surface with the metal chemically removed. The metal foil is a copper foil subjected to rustproofing by at least one kind selected from nickel, tin, zinc, chromium, molybdenum, cobalt and oxides thereof. The adhesion assisting agent contains (A) an epoxy resin, (B) a polymer component which is able to be chemically roughed, (C) an epoxy resin curing agent, and (D) a curing accelerator. Furtheremore, 10-80 wt.% of (A) the epoxy resin is a rubber-modified epoxy resin. The component (B) is at least one kind selected from acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber particles, core-shell particles of butadiene rubber-acrylic resin, polyvinyl acetal resin and carboxylic acid modified polyvinyl acetal resin. Furthermore, the printed wiring board produced by a usual method using the foil and the process for producing the same are provided.
摘要翻译：要解决的问题：为了提供一种能够进行化学镀的附着辅助剂配合金属箔，有利于形成精细布线，电性能和生产成本，高可靠性和优异的吸湿性和耐热性的印刷线路板属性及其制造方法。解决方案：粘合辅助剂配合的金属箔在其表面具有十点平均粗糙度Rz =2.0μm或更小的金属上具有厚度为0.1-10μm的粘附辅助剂层，并且允许通过化学粗糙化进行化学镀金属化学去除的附着助剂表面。金属箔是通过选自镍，锡，锌，铬，钼，钴及其氧化物中的至少一种进行防锈的铜箔。粘合辅助剂含有（A）环氧树脂，（B）能够被化学粗化的聚合物组分，（C）环氧树脂固化剂和（D）固化促进剂。此外，（A）环氧树脂的10-80重量％是橡胶改性的环氧树脂。组分（B）是选自丙烯腈丁二烯橡胶，羧酸改性丙烯腈丁二烯橡胶，羧酸改性丙烯腈丁二烯橡胶颗粒，丁二烯橡胶 - 丙烯酸树脂的核 - 壳颗粒，聚乙烯醇缩醛树脂和羧酸改性聚乙烯缩醛树脂。此外，提供了通过使用箔的通常方法制造的印刷线路板及其制造方法。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012187933A Metal foil with adhesion-assisting agent and printed wiring board using the same, and method of manufacturing the printed wiring board 有权
标题翻译：具有粘合辅助剂的金属箔和使用其的印刷线路板以及制造印刷线路板的方法
公开(公告)号：JP2012187933A
公开(公告)日：2012-10-04
申请号：JP2012142234
申请日：2012-06-25
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： OGAWA NOBUYUKI , ONOZEKI HITOSHI , TANABE TAKAHIRO , TAKAI KENJI , MORIIKE MICHIO
IPC分类号： B32B15/092 , B32B15/08 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which has the advantage of the formation of microwiring, electric characteristics and a manufacturing cost and, further, has high reliability and preferable high-frequency characteristics.SOLUTION: A metal foil with adhesion-assisting agent has an adhesion-assisting agent layer which is made of an epoxy resin composition comprising an aralkyl type epoxy resin (A) and an aralkyl type resin (B) with a phenolic hydroxyl group serving as an epoxy resin curing agent, and which has a thickness of 0.1 to 10 μm on a metal foil having a surface ten-point average roughness Rz of 2.0 μm or less.
摘要翻译：要解决的问题：提供一种具有形成微连线，电特性和制造成本的优点的印刷电路板，并且还具有高可靠性和优选的高频特性。解决方案：具有粘合助剂的金属箔具有粘合助剂层，其由包含芳烷基型环氧树脂（A）和具有酚羟基的芳烷基型树脂（B）的环氧树脂组合物制成作为环氧树脂固化剂，在表面十点平均粗糙度Rz为2.0μm以下的金属箔上具有0.1〜10μm的厚度。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012235135A Metallic foil with adhesion auxiliary agent, printed-wiring board using the same, and manufacturing method for printed-wiring board 有权
标题翻译：具有粘合辅助剂的金属箔，使用其的印刷电路板以及印刷电路板的制造方法
公开(公告)号：JP2012235135A
公开(公告)日：2012-11-29
申请号：JP2012142230
申请日：2012-06-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OGAWA NOBUYUKI , ONOZEKI HITOSHI , TANABE TAKAHIRO , TAKAI KENJI , MORIIKE MICHIO
IPC分类号： H05K1/03 , C09J7/02 , C09J121/00 , C09J161/06 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which has advantages of fine wiring formation, electric characteristics and a manufacturing cost, and which has high reliability and satisfactory high-frequency characteristics.SOLUTION: An adhesion auxiliary layer has a thickness of 0.1-10 μm, and is composed of an epoxy resin composition which contains (A) an aralkyl type epoxy resin, and (B) an aralkyl type resin having a phenolic hydroxyl group as an epoxy resin hardener, on a metallic foil in which a ten-point mean roughness Rz of a surface is 2.0 μm or less.
摘要翻译：要解决的问题：提供具有精细布线形成，电特性和制造成本的优点并且具有高可靠性和令人满意的高频特性的布线板。粘合辅助层的厚度为0.1-10μm，由含有（A）芳烷基型环氧树脂的环氧树脂组合物和（B）具有酚羟基的芳烷基型树脂组成作为环氧树脂硬化剂，在表面的十点平均粗糙度Rz为2.0μm以下的金属箔上。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2009248409A Two-layer laminate having metal foil clad on one side surface and its production process, and also single side printed wiring board and its production process 有权
标题翻译：在单面表面上具有金属箔层的双层层压板及其生产工艺，还有单面印刷线路板及其生产工艺
公开(公告)号：JP2009248409A
公开(公告)日：2009-10-29
申请号：JP2008097808
申请日：2008-04-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ONOZEKI HITOSHI , TANABE TAKAHIRO , SAITO KIYOSHI
IPC分类号： B32B15/08 , B32B7/06 , H05K3/00
CPC分类号： H05K3/022 , H05K3/0097 , H05K3/06 , H05K3/244 , H05K2201/0355 , H05K2203/1536 , Y10T29/49124 , Y10T428/269
摘要： PROBLEM TO BE SOLVED: To provide: a two-layer laminate having a metal foil clad on one side surface and its production process, wherein the two-layer laminate causes no fluid chemical infiltration in the production process, is good in releasing of a release material, and does not cause detachment in a joining surface of releasing film at a high temperature treatment; and a single side printed wiring board and its production process. SOLUTION: The two-layer laminate having the metal foil clad on one side surface comprises two structures each comprising a prepreg 1 or a laminate of two or more prepregs and a metal foil 2 clad on one side surface of the prepreg or the laminate, wherein the two structures are laminated on each other through a mold release material 3 by heat compression so that each prepreg faces inward, the mold release material 3 is a film comprising a resin material or the like, and the laminate has a thickness of 10 to 200 μm; and that the mold release material has a thermal shrinkage of 1.5% or less at a temperature at which the heat compression is conducted. The production process of the laminate is provided. There are also provided the single-sided printed wiring board using the two-layer laminate having the metal foil clad on its one side surface and its production process. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供：在一个侧面上具有包覆金属箔的双层层压体及其制造方法，其中在生产过程中双层层压体不导致流体化学渗透，释放性良好的脱模剂，并且在高温处理时不会使脱模膜的接合面发生剥离; 和单面印刷线路板及其制造工艺。解决方案：具有包覆在一个侧表面上的金属箔的两层层压体包括两个结构，每个结构包括预浸料坯1或两个或更多个预浸料的层压体和在预浸料坯的一个侧表面上包覆的金属箔2 层叠体，其中两个结构通过热压缩通过脱模材料3彼此层叠，使得每个预浸料坯向内，脱模材料3是包含树脂材料等的膜，并且层压体的厚度为 10〜200μm; 并且脱模材料在进行热压缩的温度下的热收缩率为1.5％以下。提供了层压板的生产工艺。还提供了使用具有在其一个侧表面上包覆金属箔的双层层压板的单面印刷线路板及其制造方法。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2006159900A Metal foil with adhesive auxiliary agent and printed wiring board using it 有权
标题翻译：带粘合剂辅助剂的金属箔和使用它的印刷电路板
公开(公告)号：JP2006159900A
公开(公告)日：2006-06-22
申请号：JP2005326347
申请日：2005-11-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OGAWA NOBUYUKI , TAKAI KENJI , MORIIKE MICHIO , EJIRI TAKAKO , TAKANEZAWA SHIN , TANABE TAKAHIRO
IPC分类号： B32B15/092 , C09J109/00 , C09J129/14 , C09J151/04 , C09J161/06 , C09J163/00 , C09J201/00 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which is advantageous to refined wiring formation, electrical property, and manufacturing cost, in addition to provide the wiring board which has high reliability and a good high-frequency property. SOLUTION: A metal foil with an adhesive auxiliary agent comprises a layer of adhesive auxiliary agent having the thickness of 0.1-10 μm on the metal having the surface of the ten-point average roughness of not more than Rz=2.0 μm, wherein the above adhesive auxiliary agent comprises: (A) an epoxy resin; (B) a polymer component in which a chemical coarsening treatment is possible; (C) an epoxy resin curing agent; and (D) a hardening accelerator. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种有利于精细布线形成，电气性能和制造成本的布线板，以及提供具有高可靠性和良好高频特性的布线板。解决方案：具有粘合剂的金属箔包括在具有十点平均粗糙度的表面不大于Rz =2.0μm的金属上具有0.1-10μm厚度的粘合剂助剂层，其中所述粘合助剂包括：（A）环氧树脂; （B）可以进行化学粗化处理的聚合物成分; （C）环氧树脂固化剂; 和（D）硬化促进剂。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2003281940A Insulation resin composition, insulator with copper foil, and laminated plate with copper foil 审中-公开
标题翻译：绝缘树脂组合物，铜箔绝缘体和铜箔层压板
公开(公告)号：JP2003281940A
公开(公告)日：2003-10-03
申请号：JP2002083389
申请日：2002-03-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TANABE TAKAHIRO , TOSAKA YUJI
IPC分类号： B32B15/08 , C08K3/22 , C08K7/02 , C08L63/00 , C08L101/00 , C09J7/00 , C09J7/02 , C09J11/00 , C09J163/00 , C09J201/00 , H01B3/00 , H01B3/30 , H01B3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable and heat resisting insulation resin composition which is machined well by a small diameter laser beam, corresponding minute machining, to provide a sheet with the insulation resin composition, and to provide an insulator with a copper leaf. SOLUTION: The insulation resin compound comprises, electrically insulating whiskers, an inorganic filling material such as metal hydroxide, a coloring component which has an absorbing band around a specified wave length, a hardening, and a hardening agent in which other components are mixed. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供通过小直径激光束良好加工的相当小的加工性，提供具有绝缘树脂组合物的片材的高可靠性和耐热绝缘树脂组合物，并提供绝缘体一片铜叶。解决方案：绝缘树脂化合物包括电绝缘晶须，无机填充材料如金属氢氧化物，具有围绕特定波长的吸收带的着色组分，硬化和硬化剂，其中其它组分是混合版权所有（C）2004，JPO

7. 发明专利

JP2003273524A Multilayer printed wiring board and method for manufacturing the same 审中-公开
标题翻译：多层印刷线路板及其制造方法
公开(公告)号：JP2003273524A
公开(公告)日：2003-09-26
申请号：JP2002076492
申请日：2002-03-19
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TANABE TAKAHIRO
IPC分类号： H05K1/02 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board whose impact in disconnection is relaxed, and whose cracking quantity is reduced, and to provide a method for manufacturing it.
SOLUTION: A multilayer printed wiring board is provided with a plurality of non-through holes at the disconnection scheduled sites of an outermost insulating layer. This method for manufacturing a multilayer printed wiring board comprises a process (a) for molding a multilayer printed wiring board by disposing multilayer insulating layers and multilayer wiring conductive layers, a process (b) for carrying out necessary circuit working, and a process (c) for forming a plurality of non-through holes at the disconnection scheduled sites of the outermost insulating layer.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种其断开冲击松弛并且其开裂量降低的多层印刷线路板，并提供其制造方法。解决方案：多层印刷线路板在最外层绝缘层的断开预定位置处设置有多个非通孔。这种制造多层印刷电路板的方法包括：通过设置多层绝缘层和多层布线导电层来成型多层印刷布线板的工艺（a），用于进行必要的电路加工的工艺（b）和工艺（c ），用于在最外层绝缘层的断开预定位置处形成多个非通孔。版权所有（C）2003，JPO

8. 发明专利

JP2011051247A Metal foil with thermosetting resin composition layer, metal clad laminated plate, and printed wiring board 审中-公开
标题翻译：具有热固性树脂组合物层，金属层压板和印刷布线板的金属箔
公开(公告)号：JP2011051247A
公开(公告)日：2011-03-17
申请号：JP2009202526
申请日：2009-09-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ONOZEKI HITOSHI , TANABE TAKAHIRO
IPC分类号： B32B15/08 , B32B15/092 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide metal foil with a thermosetting resin composition layer enabling fine wiring and enabling the formation of a fine surface having surface roughness (Rz) below 3 μm in the case of roughening a resin surface, and to provide a metal clad laminated plate and a printed wiring board.
SOLUTION: The metal foil with the thermosetting resin composition layer includes a 1.0 to 5.0 μm thick layer of the thermosetting resin composition containing an epoxy resin (A), at least one kind (B) selected from a polyvinyl acetal resin and a carboxylic acid-modified polyvinyl acetal resin, an epoxy resin curing agent (C), a curing accelerator (D), and a nano particle filler (E) having a central particle diameter of 10 to 50 nm and the maximum particle diameter of ≤100 nm on the metal foil having a ten-point average roughness (Rz) of ≤2.0 μm.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了使金属箔具有能够精细布线的热固性树脂组合物层，并且在使树脂表面粗糙化的情况下能够形成表面粗糙度（Rz）低于3μm的细小表面，并且提供金属叠层板和印刷线路板。解决方案：具有热固性树脂组合物层的金属箔包括1.0-5.0μm厚的含有环氧树脂（A）的热固性树脂组合物层，至少一种（B）选自聚乙烯醇缩醛树脂和羧酸改性聚乙烯醇缩醛树脂，环氧树脂固化剂（C），固化促进剂（D）和中心粒径为10〜50nm，最大粒径≤100的纳米粒子填料（E）具有十点平均粗糙度（Rz）≤2.0μm的金属箔上的nm。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010083072A Copper-clad laminated sheet and printed circuit board 审中-公开
标题翻译：铜箔层压板和印刷电路板
公开(公告)号：JP2010083072A
公开(公告)日：2010-04-15
申请号：JP2008256365
申请日：2008-10-01
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ONOZEKI HITOSHI , TANABE TAKAHIRO
IPC分类号： B32B15/08 , C09J11/06 , C09J129/14 , C09J161/06 , C09J163/00 , C09J201/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper-clad laminated sheet which solves the nonconformity of conventional methods and has excellent blanking workability such as crack resistance and interlayer exfoliation resistance, and to provide a printed circuit board.
SOLUTION: The copper-clad laminated sheet is obtained by heating and pressure-molding a resin-containing prepreg and copper foil with an adhesive layer wherein the thickness of the adhesive layer is 0.5 to 10 μm and the average roughness of a surface of the copper foil in contact with the adhesive layer is 2.0 μm or lower. In the copper-clad laminated sheet, a rate of the total elongation of the resin at 20°C after the curing of the prepreg is 7% or smaller and a rate of the total elongation of the adhesive layer at 20°C is larger than that of the prepreg by 3% or more. The printed circuit board is manufactured by using the copper-clad laminated sheet.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种解决常规方法不合格并且具有优异的冲切加工性如耐裂纹性和层间剥离性的覆铜层压板，并提供印刷电路板。解决方案：通过对含树脂的预浸料坯和粘合剂层的铜箔进行加热和加压成型，其中粘合剂层的厚度为0.5〜10μm，表面的平均粗糙度为与粘合剂层接触的铜箔为2.0μm以下。在覆铜层压板中，预浸料坯固化后20℃下的树脂总伸长率为7％以下，粘合层在20℃下的总伸长率大于预浸料的3％以上。印刷电路板通过使用覆铜层压板制造。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2008016794A Manufacturing method of printed wiring board 有权
标题翻译：印刷线路板的制造方法
公开(公告)号：JP2008016794A
公开(公告)日：2008-01-24
申请号：JP2006310154
申请日：2006-11-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OGAWA NOBUYUKI , KAMIYAMA KENICHI , TANABE TAKAHIRO , ONOZEKI HITOSHI
IPC分类号： H05K3/28 , H05K3/26
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board of high reliability, being advantageous in formation of a fine wiring, electric characteristics, and manufacturing cost. SOLUTION: The manufacturing method of a printed wiring board, in which a metal foil whose ten-point average roughness (Rz) of a surface is 2.0 μm or less is used, includes a process in which a roughening process is executed as a pre-process when applying or laminating a solder resist. COPYRIGHT: (C)2008,JPO&INPIT

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