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    • 1. 发明申请
    • SYSTEM FOR CONVERSING THERMAL ENERGY INTO ELECTRICAL ENERGY
    • 将热能转化为电能的系统
    • US20150115769A1
    • 2015-04-30
    • US14232092
    • 2012-07-09
    • Guillaume SavelliPhilippe CoronelStephane MonfrayThomas Skotnicki
    • Guillaume SavelliPhilippe CoronelStephane MonfrayThomas Skotnicki
    • F03G7/06H02N2/18
    • F03G7/06F03G7/065H01L41/1136H02N2/18H02N2/188
    • An assembly converting thermal energy into electrical energy including: at least one temperature sensitive bimetallic strip arranged in a space delimited by a hot source and a cold source facing each other, the bimetallic strip extending along a longitudinal axis; at least one suspended element fixed in movement to the sensitive element and extending laterally from the sensitive element and including a free end; and at least one piezoelectric element suspended from a part fixed relative to the sensitive element and vibrated by the suspended element such that it is vibrated when the bimetallic strip changes configuration and the suspended element comes into contact with the piezoelectric element, the piezoelectric element being located outside the space defined between the bimetallic strip and the hot source and outside the space between the bimetallic strip and the cold source.
    • 一种将热能转换成电能的组件,包括:至少一个温度敏感的双金属条,布置在由热源和相互面对的冷源界定的空间中,双金属条沿着纵轴延伸; 固定在所述敏感元件上并且从所述敏感元件横向延伸并且包括自由端的至少一个悬挂元件; 以及至少一个压电元件,其从相对于所述敏感元件固定的部分悬挂并由所述悬挂元件振动,使得当所述双金属条改变构型并且所述悬挂元件与所述压电元件接触时,所述压电元件被振动,所述压电元件位于 在双金属条和热源之间限定的空间之外以及双金属条和冷源之间的空间之外。
    • 3. 发明授权
    • Surround-gate semiconductor device encapsulated in an insulating medium
    • 封装在绝缘介质中的环绕栅极半导体器件
    • US06969878B2
    • 2005-11-29
    • US10409653
    • 2003-04-08
    • Philippe CoronelStephane MonfrayThomas Skotnicki
    • Philippe CoronelStephane MonfrayThomas Skotnicki
    • H01L21/336H01L29/786H01L21/84
    • H01L29/66772H01L29/78648H01L29/78654
    • A semiconductor device is provided that includes a semiconductor channel region extending above a semiconductor substrate in a longitudinal direction between a semiconductor source region and a semiconductor drain region, and a gate region extending in the transverse direction, coating the channel region, and insulated from the channel region. The source, channel, and drain regions are formed in a continuous semiconductor layer that is approximately plane and parallel to the upper surface of the substrate. Additionally, the source, drain, and gate regions are coated in an insulating coating so as to provide electrical insulation between the gate region and the source and drain regions, and between the substrate and the source, drain, gate, and channel regions. Also provided is an integrated circuit that includes such a semiconductor device, and a method for manufacturing such a semiconductor device.
    • 提供一种半导体器件,其包括在半导体源极区域和半导体漏极区域之间沿纵向方向在半导体衬底上方延伸的半导体沟道区域和在横向方向上延伸的栅极区域,涂覆沟道区域并与 渠道区域。 源极,沟道和漏极区域形成在大致平面并平行于衬底的上表面的连续半导体层中。 此外,源极,漏极和栅极区域被涂覆在绝缘涂层中,以便在栅极区域和源极和漏极区域之间以及衬底与源极,漏极,栅极和沟道区域之间提供电绝缘。 还提供了一种包括这种半导体器件的集成电路及其制造方法。