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1. 发明申请

US20120229908A1 RECESSED OPTICAL SURFACES 失效
标题翻译：残留的光学表面
公开(公告)号：US20120229908A1
公开(公告)日：2012-09-13
申请号：US13481329
申请日：2012-05-25
申请人： Gregory J. Kintz , Michael R. Feldman , James E. Morris , Paul Elliott , David Keller , W. Hudson Welch , David Ovrutsky , Jeremy Huddleston , Mark Hiatt
发明人： Gregory J. Kintz , Michael R. Feldman , James E. Morris , Paul Elliott , David Keller , W. Hudson Welch , David Ovrutsky , Jeremy Huddleston , Mark Hiatt
IPC分类号： G02B27/12
CPC分类号： B29D11/00365 , B29D11/00413 , G02B3/0031 , G02B3/0062
摘要： An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.
摘要翻译：光学块包括具有第一和第二相对表面的基板，所述基板是第一材料，在所述基板中在所述第一和第二相对表面之间延伸的多个通孔，与所述第一材料不同的第二材料，的通孔，并且在通孔的外部的基板的第一表面的一部分上延伸，以及在第二材料中的第一透镜结构，并且对应于每个通孔。

2. 发明授权

US08189277B2 Recessed optical surfaces 有权
标题翻译：嵌入式光学表面
公开(公告)号：US08189277B2
公开(公告)日：2012-05-29
申请号：US13050354
申请日：2011-03-17
申请人： Gregory J. Kintz , Michael R. Feldman , James E. Morris , Paul Elliott , David Keller , W. Hudson Welch , David Ovrutsky , Jeremy Huddleston , Mark Hiatt
发明人： Gregory J. Kintz , Michael R. Feldman , James E. Morris , Paul Elliott , David Keller , W. Hudson Welch , David Ovrutsky , Jeremy Huddleston , Mark Hiatt
IPC分类号： G02B27/00
CPC分类号： B29D11/00365 , B29D11/00413 , G02B3/0031 , G02B3/0062
摘要： An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.
摘要翻译：光学块包括具有第一和第二相对表面的基板，所述基板是第一材料，在所述基板中在所述第一和第二相对表面之间延伸的多个通孔，与所述第一材料不同的第二材料，的通孔，并且在通孔的外部的基板的第一表面的一部分上延伸，以及在第二材料中的第一透镜结构，并且对应于每个通孔。

3. 发明授权

US08687294B2 Recessed optical surfaces 失效
标题翻译：嵌入式光学表面
公开(公告)号：US08687294B2
公开(公告)日：2014-04-01
申请号：US13481329
申请日：2012-05-25
申请人： Gregory J. Kintz , Michael R. Feldman , James E. Morris , Paul Elliott , David Keller , W. Hudson Welch , David Ovrutsky , Jeremy Huddleston , Mark Hiatt
发明人： Gregory J. Kintz , Michael R. Feldman , James E. Morris , Paul Elliott , David Keller , W. Hudson Welch , David Ovrutsky , Jeremy Huddleston , Mark Hiatt
IPC分类号： G02B27/00
CPC分类号： B29D11/00365 , B29D11/00413 , G02B3/0031 , G02B3/0062
摘要： An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.
摘要翻译：光学块包括具有第一和第二相对表面的基板，所述基板是第一材料，在所述基板中在所述第一和第二相对表面之间延伸的多个通孔，与所述第一材料不同的第二材料，的通孔，并且在通孔的外部的基板的第一表面的一部分上延伸，以及在第二材料中的第一透镜结构，并且对应于每个通孔。

4. 发明申请

US20110222171A1 RECESSED OPTICAL SURFACES 有权
标题翻译：残留的光学表面
公开(公告)号：US20110222171A1
公开(公告)日：2011-09-15
申请号：US13050354
申请日：2011-03-17
申请人： Gregory J. KINTZ , Michael R. Feldman , James E. Morris , Paul Elliott , David Keller , W. Hudson Welch , David Ovrutsky , Jeremy Huddleston , Mark Hiatt
发明人： Gregory J. KINTZ , Michael R. Feldman , James E. Morris , Paul Elliott , David Keller , W. Hudson Welch , David Ovrutsky , Jeremy Huddleston , Mark Hiatt
IPC分类号： G02B11/02 , G02B3/00 , B29D11/00
CPC分类号： B29D11/00365 , B29D11/00413 , G02B3/0031 , G02B3/0062
摘要： An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.
摘要翻译：光学块包括具有第一和第二相对表面的基板，所述基板是第一材料，在所述基板中在所述第一和第二相对表面之间延伸的多个通孔，与所述第一材料不同的第二材料，的通孔，并且在通孔的外部的基板的第一表面的一部分上延伸，以及在第二材料中的第一透镜结构，并且对应于每个通孔。

5. 发明授权

US06426698B1 Lot signalling device 有权
标题翻译：批信号装置
公开(公告)号：US06426698B1
公开(公告)日：2002-07-30
申请号：US09573949
申请日：2000-05-19
申请人： Larry Edward Frisa , Clinton Haris , Mark Hiatt
发明人： Larry Edward Frisa , Clinton Haris , Mark Hiatt
IPC分类号： G08B108
CPC分类号： G08B21/0216 , G08B13/1427 , G08B21/0227
摘要： An apparatus related to a lot signalling device used to find misplaced lots. A remote control signalling device comprises a receiver section (5) for receiving an RF-command including a unique address of at least one of said plurality of remote control signalling devices (3) from a central control unit (1), an address memory (6) for storing the address of said remote control signalling device, an output section (7) for signalling an alarm upon receiving the RF-command, if said address included in the RF-command matches the stored address in said address memory (6). A method for processing items at different process stages comprises the steps of: transmitting RF-commands including a unique address of at least one of said plurality of remote control signalling devices by a central control unit (1), signalling an alarm by said remote control signalling device (3) upon reception of an RF-command from said central control unit (1).
摘要翻译：与用于发现错位的批次信号装置相关的装置。遥控信令装置包括接收机部分（5），用于从中央控制单元（1）接收包括所述多个远程控制信令装置（3）中的至少一个的唯一地址的RF命令，地址存储器 6），用于存储所述遥控信令装置的地址;如果包括在所述RF指令中的所述地址与所述地址存储器（6）中存储的地址匹配，则用于在接收到所述RF命令时用于发出警报的输出部分（7）。一种用于在不同处理阶段处理物品的方法包括以下步骤：通过中央控制单元（1）发送包括至少一个所述多个远程控制信令装置的唯一地址的RF指令，通过所述遥控器信令装置（3）在从所述中央控制单元（1）接收到RF命令时。

6. 发明申请

US20110233777A1 THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS 失效
标题翻译：用于光电子和存储器波形的通过波形互连
公开(公告)号：US20110233777A1
公开(公告)日：2011-09-29
申请号：US13154550
申请日：2011-06-07
申请人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
发明人： Salman Akram , Charles Watkins , Mark Hiatt , David Hembree , James Wark , Warren Farnworth , Mark Tuttle , Sidney Rigg , Steven Oliver , Kyle Kirby , Alan Wood , Lu Velicky
IPC分类号： H01L23/498 , H01L23/48
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译：公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

7. 发明授权

US07955946B2 Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices 有权
标题翻译：确定包括集成电路的半导体衬底的x-y空间取向的方法，包括集成电路的半导体衬底的定位方法，半导体衬底的处理方法以及半导体器件
公开(公告)号：US07955946B2
公开(公告)日：2011-06-07
申请号：US11439078
申请日：2006-05-22
申请人： Dave Pratt , Kyle Kirby , Steve Oliver , Mark Hiatt
发明人： Dave Pratt , Kyle Kirby , Steve Oliver , Mark Hiatt
IPC分类号： H01L21/76
CPC分类号： H01L21/682 , H01L21/67259 , H01L21/76898 , H01L23/544 , H01L2223/5442 , H01L2924/0002 , Y10S438/975 , H01L2924/00
摘要： The invention includes methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices. In one implementation, a method of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit includes providing a semiconductor substrate comprising at least one integrated circuit die. The semiconductor substrate comprises a circuit side, a backside, and a plurality of conductive vias extending from the circuit side to the backside. The plurality of conductive vias on the semiconductor substrate backside is examined to determine location of portions of at least two of the plurality of conductive vias on the semiconductor substrate backside. From the determined location, x-y spatial orientation of the semiconductor substrate is determined. Other aspects and implementations are contemplated.
摘要翻译：本发明包括确定包括集成电路的半导体衬底的x-y空间取向的方法，包括集成电路的半导体衬底的定位方法，半导体衬底的处理方法和半导体器件。在一个实现中，确定包括集成电路的半导体衬底的x-y空间取向的方法包括提供包括至少一个集成电路管芯的半导体衬底。半导体衬底包括电路侧，背面以及从电路侧延伸到背面的多个导电通路。检查半导体衬底背面上的多个导电通孔以确定半导体衬底背面上的多个导电通孔中的至少两个的部分的位置。从确定的位置确定半导体衬底的x-y空间取向。考虑了其他方面和实现。

8. 发明申请

US20070269994A1 Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices 有权
标题翻译：确定包括集成电路的半导体衬底的x-y空间取向的方法，包括集成电路的半导体衬底的定位方法，半导体衬底的处理方法以及半导体器件
公开(公告)号：US20070269994A1
公开(公告)日：2007-11-22
申请号：US11439078
申请日：2006-05-22
申请人： Dave Pratt , Kyle Kirby , Steve Oliver , Mark Hiatt
发明人： Dave Pratt , Kyle Kirby , Steve Oliver , Mark Hiatt
IPC分类号： H01L21/00
CPC分类号： H01L21/682 , H01L21/67259 , H01L21/76898 , H01L23/544 , H01L2223/5442 , H01L2924/0002 , Y10S438/975 , H01L2924/00
摘要： The invention includes methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices. In one implementation, a method of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit includes providing a semiconductor substrate comprising at least one integrated circuit die. The semiconductor substrate comprises a circuit side, a backside, and a plurality of conductive vias extending from the circuit side to the backside. The plurality of conductive vias on the semiconductor substrate backside is examined to determine location of portions of at least two of the plurality of conductive vias on the semiconductor substrate backside. From the determined location, x-y spatial orientation of the semiconductor substrate is determined. Other aspects and implementations are contemplated.
摘要翻译：本发明包括确定包括集成电路的半导体衬底的x-y空间取向的方法，包括集成电路的半导体衬底的定位方法，半导体衬底的处理方法以及半导体器件。在一个实现中，确定包括集成电路的半导体衬底的x-y空间取向的方法包括提供包括至少一个集成电路管芯的半导体衬底。半导体衬底包括电路侧，背面以及从电路侧延伸到背面的多个导电通路。检查半导体衬底背面上的多个导电通孔以确定半导体衬底背面上的多个导电通孔中的至少两个的部分的位置。从确定的位置确定半导体衬底的x-y空间取向。考虑了其他方面和实现。

9. 发明申请

US20070213671A1 Infusion catheter system with telescoping cannula 审中-公开
标题翻译：输液导管系统带伸缩套管
公开(公告)号：US20070213671A1
公开(公告)日：2007-09-13
申请号：US11515705
申请日：2006-09-05
申请人： Mark Hiatt
发明人： Mark Hiatt
IPC分类号： A61M5/178
CPC分类号： A61M25/007 , A61M25/0075 , A61M25/0108 , A61M2025/0008 , A61M2025/0076
摘要： An infusion catheter system includes an elongated catheter body and an inner elongated cannula body. The catheter body has a sidewall perforated with a plurality of side ports and the cannula body may have an outlet opening in a distal end. The side ports of the catheter body are selectively in fluid communication with the outlet opening of the cannula by moving the cannula between a first and second position within the catheter body.
摘要翻译：输液导管系统包括细长的导管主体和内部细长的插管主体。导管主体具有穿孔多个侧端口的侧壁，并且插管主体可以在远端具有出口开口。通过在导管主体内的第一和第二位置之间移动插管，导管主体的侧面选择性地与插管的出口开口流体连通。

10. 发明授权

US06881264B2 Configuration and a method for reducing contamination with particles on a substrate in a process tool 失效
标题翻译：配置和减少处理工具中的基板上的颗粒污染的方法
公开(公告)号：US06881264B2
公开(公告)日：2005-04-19
申请号：US10643820
申请日：2003-08-19
申请人： Mark Hiatt , Karl Mautz , Ralf Schuster
发明人： Mark Hiatt , Karl Mautz , Ralf Schuster
IPC分类号： H05K3/46 , H01L21/00 , B05C11/06 , B05C11/02
CPC分类号： H01L21/6704
摘要： A process tool, preferably a spin coater, includes a set of at least three arms and an adjustable rinse nozzle. The arms lift a substrate, e.g. a semiconductor wafer, from a chuck inside the process chamber after having performed the corresponding manufacturing step, e.g. coating. The contact area between the arms and the substrate is as small as possible. The rinse nozzle dispenses a solvent liquid onto the backside of the substrate, thereby removing contaminating particles located at the area of contact between the vacuum channels of the chuck and the substrate. The set of arms rotates for a homogeneous cleaning. A gas flowing out of vacuum ports of the chuck prevents the vacuum ports from being obstructed with particles. While the substrate is being lifted, the chuck can also be cleaned by dispensing the solvent liquid onto the chuck.
摘要翻译：工艺工具，优选旋转涂布机，包括一组至少三个臂和可调整的冲洗喷嘴。臂提起基底，例如在执行相应的制造步骤之后，来自处理室内的卡盘的半导体晶片，例如，涂层。臂和基板之间的接触面积尽可能小。冲洗喷嘴将溶剂液体分配到基板的背面，从而去除位于卡盘的真空通道与基板之间的接触区域的污染颗粒。该组臂旋转以进行均匀清洁。从卡盘的真空端口流出的气体防止真空口被颗粒堵塞。当基板被提起时，也可以通过将溶剂液体分配到卡盘上来清洁卡盘。

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