专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060286809A1 Method for etching a patterned silicone layyer 失效
标题翻译：刻蚀图案硅胶层的方法
公开(公告)号：US20060286809A1
公开(公告)日：2006-12-21
申请号：US10565036
申请日：2003-07-28
申请人： Gregory Becker , Geoffrey Gardner , Brian Harkness
发明人： Gregory Becker , Geoffrey Gardner , Brian Harkness
IPC分类号： H01L21/302
CPC分类号： G03F7/0757 , G03F7/38 , G03F7/425
摘要： A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the nonexposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer, and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and a base.
摘要翻译：一种用于对半导体材料进行再加工的方法包括：（i）将硅氧烷组合物施加到基底的表面以形成膜，（ii）将膜的一部分暴露于辐射以产生具有覆盖一部分的非暴露区域的部分曝光的膜表面的一部分和覆盖表面的其余部分的暴露区域; （iii）将部分暴露的膜加热一段时间，使得暴露区域基本上不溶于显影溶剂，并且未曝光区域可溶于显影溶剂中; （iv）用显影溶剂去除加热膜的未曝光区域以形成图案化膜; （v）加热所述图案化膜足以形成固化的硅氧烷层的时间量，以及（vi）通过暴露于包括有机溶剂和碱的无水蚀刻溶液中去除所有或部分固化的硅氧烷层。

2. 发明授权

US07517808B2 Method for forming and removing a patterned silicone film 失效
标题翻译：用于形成和去除图案化硅胶膜的方法
公开(公告)号：US07517808B2
公开(公告)日：2009-04-14
申请号：US10565036
申请日：2003-07-28
申请人： Gregory Becker , Geoffrey Gardner , Brian Harkness
发明人： Gregory Becker , Geoffrey Gardner , Brian Harkness
IPC分类号： H01L21/469 , H01B13/00 , C03C15/00
CPC分类号： G03F7/0757 , G03F7/38 , G03F7/425
摘要： A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the non-exposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer; and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and abase.
摘要翻译：一种用于对半导体材料进行再加工的方法包括：（i）将硅氧烷组合物施加到基底的表面以形成膜，（ii）将膜的一部分暴露于辐射以产生具有覆盖一部分的非暴露区域的部分曝光的膜表面的一部分和覆盖表面的其余部分的暴露区域; （iii）将部分暴露的膜加热一段时间，使得暴露区域基本上不溶于显影溶剂，并且未曝光区域可溶于显影溶剂中; （iv）用显影溶剂去除加热膜的未曝光区域以形成图案化膜; （v）加热所述图案化膜足以形成固化的硅氧烷层的时间; 和（vi）通过暴露于包括有机溶剂和碱性的无水蚀刻溶液来除去固化的硅氧烷层的全部或一部分。

3. 发明申请

US20080090380A1 Temporary Wafer Bonding Method for Semiconductor Processing 失效
标题翻译：半导体处理的临时晶圆接合方法
公开(公告)号：US20080090380A1
公开(公告)日：2008-04-17
申请号：US11795423
申请日：2006-02-07
申请人： Geoffrey Gardner , Brian Harkness
发明人： Geoffrey Gardner , Brian Harkness
IPC分类号： H01L21/30
CPC分类号： H01L21/6835 , C08L83/00 , C09J5/06 , C09J183/04 , C09J2203/326 , C09J2205/302 , C09J2483/00 , H01L21/6836 , H01L21/76251 , H01L2221/68327 , H01L2221/6834
摘要： A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a solvent. The film prepared by curing the composition is removable with an etching solution.
摘要翻译：临时晶片接合的方法采用加成反应固化型粘合剂组合物。粘合剂组合物可以包括（A）每分子平均含有至少两个与硅键合的不饱和有机基团的聚有机硅氧烷，（B）每分子平均具有至少两个与硅键合的氢原子的有机硅化合物，其量足够固化组合物，（C）催化量的氢化硅烷化催化剂和（D）溶剂。通过固化组合物制备的膜可用蚀刻溶液除去。

4. 发明授权

US08647964B2 Temporary wafer bonding method for semiconductor processing 失效
标题翻译：半导体处理的临时晶圆接合方法
公开(公告)号：US08647964B2
公开(公告)日：2014-02-11
申请号：US13583007
申请日：2010-12-15
申请人： Brian Harkness
发明人： Brian Harkness
IPC分类号： H01L21/30
CPC分类号： H01L21/6835 , C08G77/12 , C08G77/20 , C08K5/56 , C08L83/00 , C09J5/06 , C09J183/04 , C09J2203/326 , C09J2205/302 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6835
摘要： A method for temporary wafer bonding employs a curable adhesive composition and a degradation agent combined with the curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a base. The film prepared by curing the composition is degradable and removable by heating.
摘要翻译：用于临时晶片粘合的方法使用可固化粘合剂组合物和与可固化粘合剂组合物结合的降解剂。粘合剂组合物可以包括（A）每分子平均含有至少两个与硅键合的不饱和有机基团的聚有机硅氧烷，（B）每分子平均具有至少两个与硅键合的氢原子的有机硅化合物，其量足够固化组合物，（C）催化量的氢化硅烷化催化剂和（D）碱。通过固化组合物制备的膜可通过加热降解和去除。

5. 发明申请

US20100276721A1 Light Emitting Device Encapsulated with Silicones and Curable Silicone Compositions for Preparing the Silicones 有权
标题翻译：用硅酮封装的发光装置和用于制备硅氧烷的可固化硅酮组合物
公开(公告)号：US20100276721A1
公开(公告)日：2010-11-04
申请号：US12223133
申请日：2007-02-01
申请人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
发明人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
IPC分类号： H01L33/62 , C08L83/05
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
摘要翻译：组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。通过将组合物施加到光源上然后固化来制造发光器件。组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

6. 发明申请

US20100206470A1 Polar Polydimethysiloxane Molds, Methods of Making the Molds, and Methods of Using the Molds for Pattern Transfer 有权
标题翻译：极性聚二甲硅氧烷模具，制造模具的方法以及使用模具进行图案转移的方法
公开(公告)号：US20100206470A1
公开(公告)日：2010-08-19
申请号：US12669834
申请日：2008-10-23
申请人： Wei Chen , Brian Harkness , Jae Woong Lim , Michael Stanga
发明人： Wei Chen , Brian Harkness , Jae Woong Lim , Michael Stanga
IPC分类号： B29C65/70 , B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , C08G77/045 , C08G77/06 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/46 , C08L83/04 , C08L2666/14
摘要： A method includes the steps of (I) fabricating a cured silicone product and (II) using the cured silicone product in a patterning technique. The cured silicone product is a reaction product of (A) a silicone cure package and (B) is a polar additive having a polyalkylene oxide functionality and a reactive functionality. The method is useful in soft lithography applications.
摘要翻译：一种方法包括以下步骤：（I）在图案化技术中制造固化的硅氧烷产品和（II）使用固化的硅氧烷产品。固化的硅氧烷产品是（A）硅氧烷固化包的反应产物，（B）是具有聚环氧烷官能度和反应性官能团的极性添加剂。该方法在软光刻应用中是有用的。

7. 发明申请

US20070269747A1 Lithography Technique Using Silicone Molds 审中-公开
标题翻译：硅胶模具的平版印刷技术
公开(公告)号：US20070269747A1
公开(公告)日：2007-11-22
申请号：US11659989
申请日：2005-08-31
申请人： Maneesh Bahadur , Wei Chen , John Albaugh , Brian Harkness , James Tonge
发明人： Maneesh Bahadur , Wei Chen , John Albaugh , Brian Harkness , James Tonge
IPC分类号： G03F7/00 , G03F7/004 , G03F7/027
CPC分类号： B82Y10/00 , B82Y40/00 , C08F220/18 , C08F220/22 , C08F222/1006 , G03F7/0002 , G03F7/0046 , G03F7/027
摘要： A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.
摘要翻译：一种方法包括以下步骤：A）用可固化（甲基）丙烯酸酯配方填充具有图案化表面的硅氧烷模具，B）固化可固化（甲基）丙烯酸酯配方以形成图案化特征，C）将硅氧烷模具和图案化特征，任选地D）蚀刻图案化特征，以及可选地E）重复步骤A）至D）重新使用硅酮模具。可固化（甲基）丙烯酸酯配方含有氟官能（甲基）丙烯酸酯，（甲基）丙烯酸酯和光引发剂。

8. 发明授权

US08734708B2 Polar polydimethysiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer 有权
标题翻译：极性聚二甲基硅氧烷模具，制造模具的方法以及使用模具进行图案转印的方法
公开(公告)号：US08734708B2
公开(公告)日：2014-05-27
申请号：US12669834
申请日：2008-10-23
申请人： Wei Chen , Brian Harkness , Jae Woong Lim , Michael Stanga
发明人： Wei Chen , Brian Harkness , Jae Woong Lim , Michael Stanga
IPC分类号： B29C35/08
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , C08G77/045 , C08G77/06 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/46 , C08L83/04 , C08L2666/14
摘要： A method includes the steps of (I) fabricating a cured silicone product and (II) using the cured silicone product in a patterning technique. The cured silicone product is a reaction product of (A) a silicone cure package and (B) is a polar additive having a polyalkylene oxide functionality and a reactive functionality. The method is useful in soft lithography applications.
摘要翻译：一种方法包括以下步骤：（I）在图案化技术中制造固化的硅氧烷产品和（II）使用固化的硅氧烷产品。固化的硅氧烷产品是（A）硅氧烷固化包的反应产物，（B）是具有聚环氧烷官能度和反应性官能团的极性添加剂。该方法在软光刻应用中是有用的。

9. 发明授权

US08227181B2 Method of preparing a patterned film with a developing solvent 有权
标题翻译：用显影溶剂制备图案化膜的方法
公开(公告)号：US08227181B2
公开(公告)日：2012-07-24
申请号：US12377246
申请日：2007-08-08
申请人： Herman C. G. D. C. Meynen , Brian Harkness
发明人： Herman C. G. D. C. Meynen , Brian Harkness
IPC分类号： G03F7/00 , G03F7/26 , G03F7/32 , G03F7/40
CPC分类号： G03F7/0757 , G03F7/325 , Y10T428/24802
摘要： A method of preparing a patterned film on a substrate includes applying a silicone composition onto a substrate to form a film of the silicone composition. A portion of the film is exposed to radiation to produce a partially exposed film having an exposed region and a non-exposed region. The partially exposed film is heated for a sufficient amount of time and at a sufficient temperature to substantially insolubilize the exposed region in a developing solvent that includes a siloxane component. The non-exposed region of the partially exposed film is removed with the developing solvent to reveal a film-free region on the substrate and to form the patterned film including the exposed region that remains on the substrate. The film-free regions is substantially free of residual silicone due to the presence of the siloxane component in the developing solvent.
摘要翻译：在衬底上制备图案化膜的方法包括将硅氧烷组合物施加到衬底上以形成硅氧烷组合物的膜。将一部分膜暴露于辐射以产生具有暴露区域和非暴露区域的部分曝光的膜。将部分曝光的膜加热足够的时间和足够的温度以使包含硅氧烷组分的显影溶剂中的暴露区域基本上不溶解。用显影溶剂去除部分曝光的膜的未曝光区域，以在衬底上露出无薄膜区域，并形成包含保留在衬底上的暴露区域的图案化膜。由于显影溶剂中硅氧烷组分的存在，无膜区域基本上没有剩余的硅氧烷。

10. 发明申请

US20150051345A1 Filled Silicone Composition, In Situ Preparation And Use Thereof 有权
标题翻译：填充硅酮组合物，其原位制备和使用
公开(公告)号：US20150051345A1
公开(公告)日：2015-02-19
申请号：US14344623
申请日：2011-10-11
申请人： Lei Fang , Brian Harkness , Xiucuo Li , Lauren Tonge , James Tonge
发明人： Lei Fang , Brian Harkness , Xiucuo Li , Lauren Tonge , James Tonge
IPC分类号： C08K9/06 , C08L83/04
CPC分类号： C08K9/06 , C08G77/12 , C08G77/20 , C08G77/50 , C08K3/36 , C08L83/00 , C08L83/04 , C08L83/14 , C09D183/04 , C09D183/14 , C09J183/04
摘要： Filled silicone composition, in situ preparation and use thereof are provided. The composition comprises a mixture of (A) an in situ-prepared treated silica, (B) an in situ-prepared (siloxane-alkylene)-endblocked polydiorganosiloxane, (c) a cure catalyst and (D) a crosslinker. Moreover, the composition can be used as adhesive, coating and sealant.
摘要翻译：提供了填充的硅氧烷组合物，其原位制备和使用。组合物包含（A）原位制备的处理二氧化硅，（B）原位制备的（硅氧烷 - 亚烷基）封端的聚二有机硅氧烷，（c）固化催化剂和（D）交联剂的混合物。此外，组合物可用作粘合剂，涂料和密封剂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式