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1. 发明授权

US07517808B2 Method for forming and removing a patterned silicone film 失效
标题翻译：用于形成和去除图案化硅胶膜的方法
公开(公告)号：US07517808B2
公开(公告)日：2009-04-14
申请号：US10565036
申请日：2003-07-28
申请人： Gregory Becker , Geoffrey Gardner , Brian Harkness
发明人： Gregory Becker , Geoffrey Gardner , Brian Harkness
IPC分类号： H01L21/469 , H01B13/00 , C03C15/00
CPC分类号： G03F7/0757 , G03F7/38 , G03F7/425
摘要： A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the non-exposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer; and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and abase.
摘要翻译：一种用于对半导体材料进行再加工的方法包括：（i）将硅氧烷组合物施加到基底的表面以形成膜，（ii）将膜的一部分暴露于辐射以产生具有覆盖一部分的非暴露区域的部分曝光的膜表面的一部分和覆盖表面的其余部分的暴露区域; （iii）将部分暴露的膜加热一段时间，使得暴露区域基本上不溶于显影溶剂，并且未曝光区域可溶于显影溶剂中; （iv）用显影溶剂去除加热膜的未曝光区域以形成图案化膜; （v）加热所述图案化膜足以形成固化的硅氧烷层的时间; 和（vi）通过暴露于包括有机溶剂和碱性的无水蚀刻溶液来除去固化的硅氧烷层的全部或一部分。

2. 发明申请

US20080090380A1 Temporary Wafer Bonding Method for Semiconductor Processing 失效
标题翻译：半导体处理的临时晶圆接合方法
公开(公告)号：US20080090380A1
公开(公告)日：2008-04-17
申请号：US11795423
申请日：2006-02-07
申请人： Geoffrey Gardner , Brian Harkness
发明人： Geoffrey Gardner , Brian Harkness
IPC分类号： H01L21/30
CPC分类号： H01L21/6835 , C08L83/00 , C09J5/06 , C09J183/04 , C09J2203/326 , C09J2205/302 , C09J2483/00 , H01L21/6836 , H01L21/76251 , H01L2221/68327 , H01L2221/6834
摘要： A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a solvent. The film prepared by curing the composition is removable with an etching solution.
摘要翻译：临时晶片接合的方法采用加成反应固化型粘合剂组合物。粘合剂组合物可以包括（A）每分子平均含有至少两个与硅键合的不饱和有机基团的聚有机硅氧烷，（B）每分子平均具有至少两个与硅键合的氢原子的有机硅化合物，其量足够固化组合物，（C）催化量的氢化硅烷化催化剂和（D）溶剂。通过固化组合物制备的膜可用蚀刻溶液除去。

3. 发明申请

US20060286809A1 Method for etching a patterned silicone layyer 失效
标题翻译：刻蚀图案硅胶层的方法
公开(公告)号：US20060286809A1
公开(公告)日：2006-12-21
申请号：US10565036
申请日：2003-07-28
申请人： Gregory Becker , Geoffrey Gardner , Brian Harkness
发明人： Gregory Becker , Geoffrey Gardner , Brian Harkness
IPC分类号： H01L21/302
CPC分类号： G03F7/0757 , G03F7/38 , G03F7/425
摘要： A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the nonexposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer, and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and a base.
摘要翻译：一种用于对半导体材料进行再加工的方法包括：（i）将硅氧烷组合物施加到基底的表面以形成膜，（ii）将膜的一部分暴露于辐射以产生具有覆盖一部分的非暴露区域的部分曝光的膜表面的一部分和覆盖表面的其余部分的暴露区域; （iii）将部分暴露的膜加热一段时间，使得暴露区域基本上不溶于显影溶剂，并且未曝光区域可溶于显影溶剂中; （iv）用显影溶剂去除加热膜的未曝光区域以形成图案化膜; （v）加热所述图案化膜足以形成固化的硅氧烷层的时间量，以及（vi）通过暴露于包括有机溶剂和碱的无水蚀刻溶液中去除所有或部分固化的硅氧烷层。

4. 发明申请

US20050232557A1 Method of preparing a planar optical waveguide assembly 审中-公开
标题翻译：制备平面光波导组件的方法
公开(公告)号：US20050232557A1
公开(公告)日：2005-10-20
申请号：US11098239
申请日：2005-04-04
申请人： Geoffrey Gardner , Randall Schmidt
发明人： Geoffrey Gardner , Randall Schmidt
IPC分类号： G03F7/075 , G02B1/04 , G02B6/12 , G02B6/13 , G02B6/138 , G02B6/44
CPC分类号： G02B6/138 , G02B1/046 , G02B2006/12069 , C08L83/04
摘要： A method of preparing a planar optical waveguide assembly, comprising the steps of: (i) applying a silicone composition to a surface of a substrate to form a silicone film; (ii) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (iii) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (iv) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23° C. for light having a wavelength of 589 nm; wherein the substrate has a refractive index less than the refractive index of the silicone core.
摘要翻译：一种制备平面光波导组件的方法，包括以下步骤：（i）将硅氧烷组合物施加到基底的表面以形成硅酮膜; （ii）将硅氧烷膜的至少一个选定区域暴露于波长为150至800nm的辐射以产生具有至少一个曝光区域和至少一个未曝光区域的部分曝光的膜; （iii）用显影溶剂去除部分曝光的膜的未曝光区域以形成图案化膜; 和（iv）加热所述图案化膜足以在23℃下对波长为589nm的光形成折射率为1.3至1.7的至少一个硅氧烷芯的时间; 其中所述衬底具有小于所述硅氧烷芯的折射率的折射率。

5. 发明申请

US20070160936A1 Adhesion method using gray-scale photolithography 审中-公开
标题翻译：使用灰度光刻的粘附方法
公开(公告)号：US20070160936A1
公开(公告)日：2007-07-12
申请号：US10556191
申请日：2004-05-19
申请人： Geoffrey Gardner , Yeong Lee
发明人： Geoffrey Gardner , Yeong Lee
IPC分类号： G03C5/00
CPC分类号： H01L24/32 , G03F7/0757 , G03F7/201 , G03F7/40 , G03F7/405 , H01L23/3128 , H01L24/29 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29393 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8301 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/0104 , H01L2924/01041 , H01L2924/01043 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01056 , H01L2924/01058 , H01L2924/01068 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/04642 , H01L2924/04563 , H01L2924/0542 , H01L2924/05432 , H01L2924/05032 , H01L2924/0532 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method for adhering substrates using gray-scale photolithography includes: (a) applying a photopatternable corn-position to a surface of a substrate to form a film; (b) exposing a portion of the film to radiation having a wavelength of from 150 to 800 nm through a gray-scale photomask to produce an exposed film having non-exposed regions covering at least a portion of the surface; (c) heating the exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the nonexposed regions are soluble in the developing solvent; (d) removing the non-exposed regions of the heated film with the developing solvent to form a patterned film; (e) heating the patterned film for an amount of time sufficient to form a cured patterned film having a surface; (f) activating the surface of the cured patterned film and a surface of an adherend; (g) contacting the activated surface of the cured patterned film with the activated surface of the adherend. The photopatternable composition includes: (A) an organopolysiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, and (C) a catalytic amount of a photoactivated hydrosilylation catalyst.
摘要翻译：使用灰度光刻法粘合基板的方法包括：（a）将光可图案化的玉米位置施加到基板的表面以形成膜; （b）通过灰度光掩模将一部分薄膜暴露于具有150至800nm波长的辐射，以产生具有覆盖表面的至少一部分的未曝光区域的曝光膜; （c）将暴露的膜加热一定量的时间，使得暴露区域基本上不溶于显影溶剂，并且非曝光区域可溶于显影溶剂中; （d）用显影溶剂去除加热膜的未曝光区域以形成图案化膜; （e）加热所述图案化膜足以形成具有表面的固化的图案化膜的时间; （f）活化固化的图案化膜的表面和被粘物的表面; （g）将固化的图案化膜的活化表面与被粘物的活化表面接触。光致图案组合物包括：（A）每分子平均含有至少两个与硅键合的不饱和有机基团的有机聚硅氧烷，（B）每分子平均具有至少两个与硅键合的氢原子的有机硅化合物，其浓度足够固化组合物，和（C）催化量的光活化氢化硅烷化催化剂。

6. 发明申请

US20050175301A1 Planar optical waveguide assembly 有权
标题翻译：平面光波导组件
公开(公告)号：US20050175301A1
公开(公告)日：2005-08-11
申请号：US11104814
申请日：2005-04-13
申请人： Geoffrey Gardner , Randall Schmidt
发明人： Geoffrey Gardner , Randall Schmidt
IPC分类号： G02B6/13 , C03C17/34 , G02B1/04 , G02B6/12 , G02B6/132 , G02B6/138 , G03F7/00 , G03F7/075 , G03F7/26
CPC分类号： G03F7/001 , C03C17/3405 , G02B1/046 , G02B6/132 , G02B6/138 , G02B2006/12097 , G02B2006/121 , G03F7/0005 , G03F7/0757 , C08L83/04
摘要： A planar optical waveguide assembly prepared by a method comprising the steps of (i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23° C. for light having a wavelength of 589 nm; wherein the lower clad layer has a refractive index less than the refractive index of the silicone core.
摘要翻译：一种平面光波导组件，其通过包括以下步骤的方法制备：（i）将可固化聚合物组合物施加到基材的表面以形成聚合物膜; （ii）固化聚合物膜以形成下包层; （iii）将硅氧烷组合物施加到下包层以形成硅酮膜; （iv）将硅氧烷膜的至少一个选定区域暴露于波长为150至800nm的辐射以产生具有至少一个暴露区域和至少一个未曝光区域的部分曝光的膜; （v）用显影溶剂去除部分曝光的膜的未曝光区域以形成图案化膜; 和（vi）加热所述图案化膜足以在23℃下对波长为589nm的光形成至少一个具有1.3至1.7的折射率的硅氧烷芯的时间; 其中所述下包层具有小于所述硅芯的折射率的折射率。

7. 发明申请

US20050031795A1 Method for creating adhesion during fabrication of electronic devices 审中-公开
标题翻译：在电子设备制造过程中产生附着力的方法
公开(公告)号：US20050031795A1
公开(公告)日：2005-02-10
申请号：US10909892
申请日：2004-08-02
申请人： Manoj Chaudhury , Andrew Goodwin , Yeong Lee , Bhukandas Parbhoo , Geoffrey Gardner
发明人： Manoj Chaudhury , Andrew Goodwin , Yeong Lee , Bhukandas Parbhoo , Geoffrey Gardner
IPC分类号： H01L21/52 , C09J5/02 , H01L21/48 , H01L21/58 , H05K3/30 , H05K3/38 , H05H1/00
CPC分类号： H01L24/83 , C09J5/02 , C09J2400/226 , C09J2483/006 , H01L21/481 , H01L24/29 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19042 , H01L2924/30107 , H05K3/305 , H05K3/381 , H01L2924/0715 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.
摘要翻译：用于产生粘合的方法包括等离子体处理两个基板，然后接触基板。该方法可用于各种干燥表面。该方法用于粘附非粘附表面，例如具有陶瓷或半导体的固化的硅氧烷。

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