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    • 7. 发明授权
    • Method for monitoring thermal control
    • 监控热控制的方法
    • US08087823B2
    • 2012-01-03
    • US12193497
    • 2008-08-18
    • Francois AubeTimothy M. CurtinMatthew S. GradyThomas P. ScanlonEric N. Smith
    • Francois AubeTimothy M. CurtinMatthew S. GradyThomas P. ScanlonEric N. Smith
    • G01K1/00G01K7/00G01K3/00H01L35/00
    • G01K7/01G01K15/00G01R31/2874
    • A structure has a heat dissipating feature, an internal temperature measurement device, and a memory. The structure generates heat as power is supplied to the structure, and a threshold voltage of the internal temperature measurement device changes as the temperature of the temperature measurement device changes. The embodiments herein establish a linear relationship between temperature and threshold voltage by heating the structure to a first temperature and recording a first threshold voltage, and then heating the structure to a second temperature and recording a second threshold voltage. From this, the embodiments herein calculate a linear relationship between temperature and threshold voltage. Further, the embodiments herein can calculate the temperatures of the structure based only upon the linear relationship and threshold voltages measured from internal temperature measurement device.
    • 结构具有散热特征,内部温度测量装置和存储器。 该结构在向结构供电时产生热量,并且内部温度测量装置的阈值电压随温度测量装置的温度变化而变化。 本文的实施例通过将结构加热到第一温度并记录第一阈值电压,然后将结构加热到第二温度并记录第二阈值电压来建立温度和阈值电压之间的线性关系。 由此,这里的实施例计算温度和阈值电压之间的线性关系。 此外,这里的实施例可以仅基于从内部温度测量装置测量的线性关系和阈值电压来计算结构的温度。
    • 8. 发明授权
    • Integrated circuit test optimization using adaptive test pattern sampling algorithm
    • 使用自适应测试模式采样算法的集成电路测试优化
    • US08689066B2
    • 2014-04-01
    • US13172179
    • 2011-06-29
    • Matthew S. GradyMark C. JohnsonBradley D. PepperDean G. PercyJoseph C. Pranys
    • Matthew S. GradyMark C. JohnsonBradley D. PepperDean G. PercyJoseph C. Pranys
    • G01R31/28
    • G06F11/263G01R31/31835
    • A method of implementing integrated circuit device testing includes performing baseline testing of a first group of chips using a full set of test patterns, and for chip identified as failing, determining, a score for each test pattern in the full set. The score is indicative of an ability of the test pattern to uniquely identify a failing chip with respect to other test patterns. Following the baseline testing, streamlined testing on a second group of chips is performed, using a reduced set of the test patterns having highest average scores as determined by the baseline testing. Following the streamlined testing, full testing on a third group of chips is performed using the full set of test patterns, and updating the average score for each pattern. Further testing alternates between the streamlined testing and the full testing for additional groups of chips.
    • 实现集成电路设备测试的方法包括使用全套测试模式来执行第一组芯片的基线测试,以及对于被识别为故障的芯片,确定全集中每个测试模式的得分。 该分数表示测试图案相对于其他测试图案唯一地识别故障芯片的能力。 在基线测试之后,使用由基线测试确定的具有最高平均分数的测试模式的一组减少的集合来执行第二组芯片的简化测试。 在精简测试之后,使用完整的测试模式进行第三组芯片的全面测试,并更新每种模式的平均分数。 进一步的测试在简化的测试和对另外一组芯片的完整测试之间进行了交替。