专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4615224A Air sampling system for smoke detection 失效
标题翻译：用于烟雾探测的空气采样系统
公开(公告)号：US4615224A
公开(公告)日：1986-10-07
申请号：US764230
申请日：1985-08-09
申请人： Grant M. Smith , Samuel R. Romania , Vladimir M. Tamarkin
发明人： Grant M. Smith , Samuel R. Romania , Vladimir M. Tamarkin
IPC分类号： G01N1/26
CPC分类号： G01N1/26
摘要： The present disclosure describes an air sampling system which is particularly effective in detecting minute quantities of smoke caused by electrical short circuits in equipment housed in an air cooled cabinet. More, specifically, the system is useful where large number of rack-mounted printed circuit cards are employed. The system employs air sampling cylinders mounted in proximity to the cards, and through the establishment of a pressure differential, causes an air sample to be drawn into the tubes and through a detector box which includes a smoke detection unit. The presence of smoke is conveyed to a control box which responds by removing electrical power to the cards, thereby averting further damage to the cards or surrounding structures.
摘要翻译：本公开描述了一种空气采样系统，其特别有效地检测由容纳在空气冷却柜中的设备中的电气短路引起的微小烟雾。更具体地说，该系统在使用大量机架安装印刷电路卡时是有用的。该系统采用安装在卡附近的空气取样筒，并且通过建立压力差，使空气样品被吸入管中并通过包括烟雾检测单元的检测器盒。烟雾的存在被传送到控制箱，其通过去除卡的电力来进行响应，从而避免对卡或周围结构的进一步的损坏。

2. 发明授权

US4674004A Parallel-flow air system for cooling electronic equipment 失效
标题翻译：用于冷却电子设备的并流式空气系统
公开(公告)号：US4674004A
公开(公告)日：1987-06-16
申请号：US881725
申请日：1986-07-03
申请人： Grant M. Smith , Samuel R. Romania , Ronald T. Gibbs
发明人： Grant M. Smith , Samuel R. Romania , Ronald T. Gibbs
IPC分类号： H05K7/20
CPC分类号： H05K7/20572 , Y10S165/908
摘要： The present disclosure describes an air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card has its own ducting structure affixed thereto to form an integral unit. Cooling air streams are directed simultaneously from individual apertures in the ducting structure upon a respective plurality of integrated circuit package assemblies mounted on the card.
摘要翻译：本公开描述了一种空气冷却系统，其具有在当今高密度电子设备中保持可接受的温度水平的能力。更具体地，该系统提供了一种布置，其中每个印刷电路卡具有固定到其上的自己的导管结构以形成整体单元。冷却空气流同时从管道结构中的各个孔引导到安装在卡上的相应的多个集成电路封装组件。

3. 发明授权

US4421161A Heat exchanger for integrated circuit packages 失效
标题翻译：用于集成电路封装的热交换器
公开(公告)号：US4421161A
公开(公告)日：1983-12-20
申请号：US375491
申请日：1982-05-06
申请人： Samuel R. Romania , Grant M. Smith
发明人： Samuel R. Romania , Grant M. Smith
IPC分类号： H01L23/467 , F28F7/00
CPC分类号： H01L23/467 , H01L2924/0002
摘要： The present disclosure describes a heat exchange device for attachment to the external surface of a package containing an integrated circuit chip or die. The device has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present device is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically, the device is an integral structure comprised of a generally helical wire form affixed to a metallic frame-like member. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the device is attached.
摘要翻译：本公开描述了用于附接到包含集成电路芯片或管芯的封装的外表面的热交换装置。该装置在高密度电子封装配置中具有特殊应用，其中空间限制严重地限制了由此可以占用的体积。本装置的结构使得每给定体积的有效冷却面积和传热系数都最大化。基本上，该装置是整体结构，其包括固定在金属框架状构件上的大致螺旋形线形式。导线形式提供多个平行紧密间隔开的圆柱形部分，其能够设置在空气流中，用于耗散在装置所附接的集成电路封装中产生的热量。

4. 发明授权

US4465130A Wire form heat exchange element 失效
标题翻译：线形换热元件
公开(公告)号：US4465130A
公开(公告)日：1984-08-14
申请号：US395723
申请日：1982-07-06
申请人： Samuel R. Romania , Grant M. Smith
发明人： Samuel R. Romania , Grant M. Smith
IPC分类号： H01L23/367 , H01L23/467 , F28F7/00 , H01L23/34
CPC分类号： H01L23/467 , H01L23/3677 , H01L2924/0002
摘要： The present disclosure describes a heat exchange element for attachment to the external surface of a package containing an integrated circuit chip or die. The element has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present element is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically the element is an integral structure comprised of a generally helical wire form with substantially elliptic turns wrapped around a metallic plate in symmetrical fashion and in intimate contact with opposed edges of the latter. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the element is attached.
摘要翻译：本公开描述了用于附接到包含集成电路芯片或管芯的封装的外表面的热交换元件。该元件在高密度电子封装结构中具有特殊应用，其中空间限制严重地限制了由此可以占用的体积。本元件的结构使得每给定体积的有效冷却面积和传热系数都最大化。基本上，该元件是整体结构，其包括大致螺旋形的线形，其基本上椭圆形的匝以对称的方式缠绕在金属板上并且与后者的相对的边缘紧密接触。导线形式提供多个平行紧密间隔开的圆柱形部分，其能够设置在空气流中，以便散发在元件附接到的集成电路封装中产生的热量。

5. 发明授权

US4631637A Dual backplane interconnect system 失效
标题翻译：双背板互连系统
公开(公告)号：US4631637A
公开(公告)日：1986-12-23
申请号：US812834
申请日：1985-12-23
申请人： Samuel R. Romania , Grant F. Steen
发明人： Samuel R. Romania , Grant F. Steen
IPC分类号： H01R12/50 , H05K7/14 , H01R23/68
CPC分类号： H01R23/68 , H01R12/716 , H01R12/73 , H05K7/1444 , H01R23/70
摘要： The present disclosure describes a connector system for making electrical connections between connectors disposed at opposite extremities of a logic board to conductors in a respective pair of parallel, spaced-apart backplanes. Movable pin headers containing respective pluralities of pins are disposed on the outer surfaces of the backplanes. The pin headers are capable of assuming either a retracted or an extended position. In the former, the pins offer no interference to the insertion or removal of the logic board between the backplanes. In the latter, the pins traverse both feed-through holes in the backplanes and feed-through socket affixed to the opposed interior surfaces of the respective backplanes to electrically engage the connectors of the logic board, thereby completing circuit paths between the respective backplanes and the logic board.
摘要翻译：本公开描述了一种连接器系统，用于在布置在逻辑板的相对末端处的连接器之间进行电连接，以在相应的一对平行的间隔开的背板中的导体。包含相应多个销的可移动销钉头设置在背板的外表面上。销钉头能够承受缩回或延伸位置。在前者中，引脚不会对背板之间的逻辑板的插入或移除造成干扰。在后者中，销穿过背板中的两个馈通孔和固定到相应背板的相对内表面的馈通插座，以电连接逻辑板的连接器，从而完成各个背板与相应背板之间的电路路径逻辑板。

6. 发明授权

US4413413A Cutting tool for use on printed circuit board wiring 失效
标题翻译：用于印刷电路板布线的切割工具
公开(公告)号：US4413413A
公开(公告)日：1983-11-08
申请号：US366354
申请日：1982-04-07
申请人： Samuel R. Romania , Frank L. Watson
发明人： Samuel R. Romania , Frank L. Watson
IPC分类号： B26B27/00 , H05K3/04 , H05K3/22
CPC分类号： H05K3/225 , B26B27/00 , H05K3/043 , H05K2203/0242 , H05K2203/175 , Y10T29/49726
摘要： A tool is described for facilitating the cutting of printed circuit board wires necessitated by changes in the circuit design or the occurrence of electrical faults. The tool is particularly useful with circuit boards having high density wiring, where it virtually eliminates damage to printed wires adjacent to those being severed. Comprised of a guide pin centrally disposed with respect to an annular cutting edge, the tool uses the former for registration with the component and via holes in the circuit board, and the latter, to sever the printed wires from the electrically conductive pads surrounding the holes. The depth of the cut is carefully controlled by the tool and may be chosen to eliminate electrical faults lying below the surface in a multilayer board.
摘要翻译：描述了一种工具，用于便于切割由于电路设计的变化或电气故障的发生而需要的印刷电路板布线。该工具对于具有高密度布线的电路板特别有用，其实际上消除了与被切断的那些相邻的印刷线路的损坏。由一个相对于环形切割边缘中心设置的引导销组成，该工具使用前者与电路板中的部件和通孔对准，后者则将导线从围绕孔的导电焊盘切断。切割深度由工具仔细控制，可以选择以消除位于多层板的表面下方的电气故障。

7. 发明授权

US4251905A Label alignment application device 失效
标题翻译：标签对齐应用设备
公开(公告)号：US4251905A
公开(公告)日：1981-02-24
申请号：US63047
申请日：1979-08-02
申请人： Samuel R. Romania
发明人： Samuel R. Romania
IPC分类号： B65C9/08 , B65C9/18 , B23P19/04 , B25B7/00
CPC分类号： B65C9/08 , B65C9/1865 , Y10T29/539
摘要： A device is described for facilitating the application of an identifying label to a specific location on the surface of an integrated circuit package. In performing its function, the device permits an operator to lift a self-adhering label containing the desired indicia from its backing card while visually aligning it in the device. The operator then places one end of the integrated circuit package into the device, thereby effectively aligning the label with a desired location on the package surface so that it may be transferred thereto. The device finds particular application in an actual operative high density packaging system wherein the adjacent surfaces of a pair of integrated circuit packages are visible only through a narrow slot in a package hold-down member. Labels, such as those placed on generic PROM packages by operators immediately after programming, are thus precisely located so that their type designation can be seen through the aforementioned slot.
摘要翻译：描述了一种便于将识别标签应用于集成电路封装表面上的特定位置的装置。在执行其功能时，该装置允许操作者从其背板提起包含所需标记的自粘标签，同时在设备中将其目视对准。然后，操作者将集成电路封装的一端放置在设备中，从而有效地将标签与包装表面上的期望位置对准，使得其可以被转印到其上。该装置在实际的操作高密度封装系统中发现具体应用，其中一对集成电路封装的相邻表面仅通过封装压紧构件中的狭窄槽才可见。因此，在编程之后，由操作者立即放置在通用PROM包上的标签因此被精确地定位，使得可以通过前述插槽看到它们的类型指定。

8. 发明授权

US4189201A Latch assembly for clamping electronic components 失效
标题翻译：用于夹紧电子部件的闩锁组件
公开(公告)号：US4189201A
公开(公告)日：1980-02-19
申请号：US16807
申请日：1979-03-02
申请人： Samuel R. Romania
发明人： Samuel R. Romania
IPC分类号： H05K7/10
CPC分类号： H05K7/1061
摘要： A latch assembly is described for applying a high clamping force to an electronic component installed in a suitable connector. The latch assembly insures reliable electrical connection between the component circuit leads and the connector contact elements, as well as a good ground connection between the component and a cooling frame which also serves as the system ground. The present invention finds particular application in the clamping of an interconnect cable assembly. The latter includes flat or ribbon-type cables installed in a suitable housing and adapted to be mounted in a connector. The latch is universal in that it is effective with a single full cable assembly, a pair of split assemblies or a single split assembly. Moreover the latch may be easily applied and removed without the use of tools, thereby facilitating system operations which frequently involve the removal, substitution or interchange of cable assemblies.
摘要翻译：描述了用于对安装在合适的连接器中的电子部件施加高的夹紧力的闩锁组件。闩锁组件确保组件电路引线和连接器接触元件之间的可靠的电连接以及组件与也用作系统接地的冷却框架之间的良好接地连接。本发明特别适用于夹紧互连电缆组件。后者包括安装在合适的外壳中并适于安装在连接器中的扁平或带状电缆。闩锁是通用的，因为它对于单个完整的电缆组件，一对分离组件或单个分离组件是有效的。此外，闩锁可以容易地施加和移除而不使用工具，从而便于系统操作，其经常涉及电缆组件的移除，替换或交换。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式