专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4674004A Parallel-flow air system for cooling electronic equipment 失效
标题翻译：用于冷却电子设备的并流式空气系统
公开(公告)号：US4674004A
公开(公告)日：1987-06-16
申请号：US881725
申请日：1986-07-03
申请人： Grant M. Smith , Samuel R. Romania , Ronald T. Gibbs
发明人： Grant M. Smith , Samuel R. Romania , Ronald T. Gibbs
IPC分类号： H05K7/20
CPC分类号： H05K7/20572 , Y10S165/908
摘要： The present disclosure describes an air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card has its own ducting structure affixed thereto to form an integral unit. Cooling air streams are directed simultaneously from individual apertures in the ducting structure upon a respective plurality of integrated circuit package assemblies mounted on the card.
摘要翻译：本公开描述了一种空气冷却系统，其具有在当今高密度电子设备中保持可接受的温度水平的能力。更具体地，该系统提供了一种布置，其中每个印刷电路卡具有固定到其上的自己的导管结构以形成整体单元。冷却空气流同时从管道结构中的各个孔引导到安装在卡上的相应的多个集成电路封装组件。

2. 发明授权

US4465130A Wire form heat exchange element 失效
标题翻译：线形换热元件
公开(公告)号：US4465130A
公开(公告)日：1984-08-14
申请号：US395723
申请日：1982-07-06
申请人： Samuel R. Romania , Grant M. Smith
发明人： Samuel R. Romania , Grant M. Smith
IPC分类号： H01L23/367 , H01L23/467 , F28F7/00 , H01L23/34
CPC分类号： H01L23/467 , H01L23/3677 , H01L2924/0002
摘要： The present disclosure describes a heat exchange element for attachment to the external surface of a package containing an integrated circuit chip or die. The element has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present element is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically the element is an integral structure comprised of a generally helical wire form with substantially elliptic turns wrapped around a metallic plate in symmetrical fashion and in intimate contact with opposed edges of the latter. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the element is attached.
摘要翻译：本公开描述了用于附接到包含集成电路芯片或管芯的封装的外表面的热交换元件。该元件在高密度电子封装结构中具有特殊应用，其中空间限制严重地限制了由此可以占用的体积。本元件的结构使得每给定体积的有效冷却面积和传热系数都最大化。基本上，该元件是整体结构，其包括大致螺旋形的线形，其基本上椭圆形的匝以对称的方式缠绕在金属板上并且与后者的相对的边缘紧密接触。导线形式提供多个平行紧密间隔开的圆柱形部分，其能够设置在空气流中，以便散发在元件附接到的集成电路封装中产生的热量。

3. 发明授权

US4421161A Heat exchanger for integrated circuit packages 失效
标题翻译：用于集成电路封装的热交换器
公开(公告)号：US4421161A
公开(公告)日：1983-12-20
申请号：US375491
申请日：1982-05-06
申请人： Samuel R. Romania , Grant M. Smith
发明人： Samuel R. Romania , Grant M. Smith
IPC分类号： H01L23/467 , F28F7/00
CPC分类号： H01L23/467 , H01L2924/0002
摘要： The present disclosure describes a heat exchange device for attachment to the external surface of a package containing an integrated circuit chip or die. The device has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present device is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically, the device is an integral structure comprised of a generally helical wire form affixed to a metallic frame-like member. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the device is attached.
摘要翻译：本公开描述了用于附接到包含集成电路芯片或管芯的封装的外表面的热交换装置。该装置在高密度电子封装配置中具有特殊应用，其中空间限制严重地限制了由此可以占用的体积。本装置的结构使得每给定体积的有效冷却面积和传热系数都最大化。基本上，该装置是整体结构，其包括固定在金属框架状构件上的大致螺旋形线形式。导线形式提供多个平行紧密间隔开的圆柱形部分，其能够设置在空气流中，用于耗散在装置所附接的集成电路封装中产生的热量。

4. 发明授权

US4615224A Air sampling system for smoke detection 失效
标题翻译：用于烟雾探测的空气采样系统
公开(公告)号：US4615224A
公开(公告)日：1986-10-07
申请号：US764230
申请日：1985-08-09
申请人： Grant M. Smith , Samuel R. Romania , Vladimir M. Tamarkin
发明人： Grant M. Smith , Samuel R. Romania , Vladimir M. Tamarkin
IPC分类号： G01N1/26
CPC分类号： G01N1/26
摘要： The present disclosure describes an air sampling system which is particularly effective in detecting minute quantities of smoke caused by electrical short circuits in equipment housed in an air cooled cabinet. More, specifically, the system is useful where large number of rack-mounted printed circuit cards are employed. The system employs air sampling cylinders mounted in proximity to the cards, and through the establishment of a pressure differential, causes an air sample to be drawn into the tubes and through a detector box which includes a smoke detection unit. The presence of smoke is conveyed to a control box which responds by removing electrical power to the cards, thereby averting further damage to the cards or surrounding structures.
摘要翻译：本公开描述了一种空气采样系统，其特别有效地检测由容纳在空气冷却柜中的设备中的电气短路引起的微小烟雾。更具体地说，该系统在使用大量机架安装印刷电路卡时是有用的。该系统采用安装在卡附近的空气取样筒，并且通过建立压力差，使空气样品被吸入管中并通过包括烟雾检测单元的检测器盒。烟雾的存在被传送到控制箱，其通过去除卡的电力来进行响应，从而避免对卡或周围结构的进一步的损坏。

5. 发明授权

US06992894B1 Method and apparatus for EMI shielding 失效
标题翻译： EMI屏蔽方法和装置
公开(公告)号：US06992894B1
公开(公告)日：2006-01-31
申请号：US10390419
申请日：2003-03-17
申请人： Keith D. Mease , Mark W. Wessel , Grant M. Smith , Terry W. Louth , Daniel A. Jochym , Ronald T. Gibbs
发明人： Keith D. Mease , Mark W. Wessel , Grant M. Smith , Terry W. Louth , Daniel A. Jochym , Ronald T. Gibbs
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H05K9/0016 , G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.
摘要翻译：提供了一种用于从安装在导电外壳中的电子部件散热并用于屏蔽由电子部件产生的电磁辐射的装置和方法。散热器被配置成与电子部件热接触地安装。电导体可操作地连接到散热器并且被配置为在散热器和导电外壳的表面之间提供电接触，从而至少部分地屏蔽由电子部件产生的电磁辐射。

6. 发明授权

US06788538B1 Retention of heat sinks on electronic packages 失效
标题翻译：在电子封装上保留散热片
公开(公告)号：US06788538B1
公开(公告)日：2004-09-07
申请号：US10390244
申请日：2003-03-17
申请人： Ronald T. Gibbs , Grant M. Smith
发明人： Ronald T. Gibbs , Grant M. Smith
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A structure for removing heat from a packaged electronic component. The structure includes three, main elements. First, a heat sink has a pedestal with opposing ends and a plurality of fins separated by spaces and disposed on the pedestal. The heat sink dissipates heat generated by the packaged electronic component. Second, parallel rails are disposed adjacent the opposing ends of the pedestal, each rail having a catch. Third, a spring clip has (a) end hooks which engage the catches to retain the spring clip on the rails, and (b) a strut extending between the hooks, fitting into the space between adjacent fins, and including an apex which contacts substantially centrally the pedestal and applies a force pressing the heat sink toward the packaged electronic component. Thus, the heat sink is removably attached at least indirectly to the packaged electronic component. Also disclosed is a method of using the structure.
摘要翻译：用于从封装的电子部件除去热量的结构。结构包括三个主要元素。首先，散热器具有具有相对端部的基座和由空间隔开并设置在基座上的多个翅片。散热器散发由封装的电子元件产生的热量。第二，平行轨道邻近基座的相对端设置，每个轨道具有卡扣。第三，弹簧夹具有（a）端钩，其接合卡扣以将弹簧夹保持在轨道上，以及（b）支撑件之间延伸的钩状物，嵌合在相邻翅片之间的空间中，并且包括基本上接触的顶点在基座的中央并施加一个力将散热器朝向封装的电子部件推压。因此，散热器至少间接地可拆卸地附接到封装的电子部件。还公开了使用该结构的方法。

7. 发明授权

US06847525B1 Forced convection heat sink system with fluid vector control 失效
标题翻译：带流体矢量控制的强制对流散热系统
公开(公告)号：US06847525B1
公开(公告)日：2005-01-25
申请号：US10155266
申请日：2002-05-24
申请人： Grant M. Smith , Mark W. Wessel
发明人： Grant M. Smith , Mark W. Wessel
IPC分类号： F28F3/02 , H01L23/467 , H05K1/02 , H05K7/20
CPC分类号： H01L23/467 , F28F3/02 , H01L2924/0002 , H05K1/0272 , H01L2924/00
摘要： A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect to the upstream path of flowing air. Redirection of the flowing air from the upstream path to at least one downstream path is thereby facilitated.
摘要翻译：提供散热器用于将热量传递到从上游路径流动的空气。散热器包括支撑部分和从支撑部分延伸的多个翅片。翅片和支撑部分一起限定通道，其中至少一个具有相对于流动空气的上游路径成角度的部分。流动空气从上游路径重新定向到至少一个下游路径从而便利。

8. 发明授权

US06664463B1 Apparatus and method for shielding electromagnetic radiation 失效
标题翻译：用于屏蔽电磁辐射的装置和方法
公开(公告)号：US06664463B1
公开(公告)日：2003-12-16
申请号：US09525411
申请日：2000-03-15
申请人： Mark R. Treiber , Peter Klein , Grant M. Smith
发明人： Mark R. Treiber , Peter Klein , Grant M. Smith
IPC分类号： H05K900
CPC分类号： H01L23/552 , G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is provided for dissipating heat from an electronic component, such as a processor, that is mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. The apparatus includes a heat sink that is configured to be mounted to a surface of the electronic component. The apparatus also includes a conductor connected to the heat sink. The conductor is configured to provide electrical contact between the heat sink and a surface of the conductive enclosure. Accordingly, the apparatus at least partially shields the electromagnetic radiation generated by the electronic component. A corresponding method is also provided.
摘要翻译：提供一种用于从诸如处理器的电子部件散热的装置，其安装在导电外壳中并用于屏蔽由电子部件产生的电磁辐射。该装置包括被配置为安装到电子部件的表面的散热器。该装置还包括连接到散热器的导体。导体被配置为在散热器和导电外壳的表面之间提供电接触。因此，该装置至少部分地屏蔽由电子部件产生的电磁辐射。还提供了相应的方法。

9. 发明授权

US06862181B1 Apparatus and method for shielding a circuit board 失效
标题翻译：屏蔽电路板的装置和方法
公开(公告)号：US06862181B1
公开(公告)日：2005-03-01
申请号：US10390461
申请日：2003-03-17
申请人： Grant M. Smith , Daniel A. Jochym , Mark W. Wessel
发明人： Grant M. Smith , Daniel A. Jochym , Mark W. Wessel
IPC分类号： H05K7/20 , H05K9/00
CPC分类号： H05K9/0022 , H05K7/20154
摘要： An apparatus directs airflow adjacent a circuit board to provide cooling and provides shielding for the circuit board to reduce EMI. The apparatus comprises a barrier for directing airflow and a conductive layer, electrically grounded and physical associated with the barrier, for providing shielding for the circuit board to reduce EMI.
摘要翻译：一种装置引导邻近电路板的气流以提供冷却并为电路板提供屏蔽以减少EMI。该装置包括用于引导气流的屏障和导电层，电接地并且与屏障相关联的物理，用于为电路板提供屏蔽以降低EMI。

10. 发明授权

US6049467A Stackable high density RAM modules 有权
标题翻译：可堆叠高密度RAM模块
公开(公告)号：US6049467A
公开(公告)日：2000-04-11
申请号：US144322
申请日：1998-08-31
申请人： Vladimir K. Tamarkin , Grant M. Smith
发明人： Vladimir K. Tamarkin , Grant M. Smith
IPC分类号： H01L25/10 , H05K1/14 , H05K7/02
CPC分类号： H05K1/144 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/0002
摘要： A stacked circuit assembly is provided for mounting memory modules in close proximity to an integrated circuit. The assembly includes an integrated circuit mounted on a printed circuit board and at least one stacked printed circuit board mounted in substantially parallel arrangement with respect to the printed circuit board on which the integrated circuit is mounted. A memory module is mounted for electrical connection on a surface of the stacked printed circuit board and an interface connector is mounted on facing surfaces of the printed circuit board and the stacked printed circuit board, thereby providing means for both mechanical and electrical connection between the boards. The integrated circuit and the memory module are mounted in parallel relationship with respect to one another for electrical interconnection through the boards and the interface connectors, thereby reducing the physical distance between the integrated circuit and the memory module.
摘要翻译：提供了用于将存储器模块安装在紧密集成电路的堆叠电路组件。组件包括安装在印刷电路板上的集成电路和至少一个堆叠的印刷电路板，该印刷电路板相对于其上安装集成电路的印刷电路板基本上平行地布置。安装存储器模块用于在堆叠的印刷电路板的表面上电连接，并且接口连接器安装在印刷电路板和堆叠的印刷电路板的相对表面上，由此提供用于板之间的机械和电连接的装置。集成电路和存储器模块相对于彼此并联安装，以通过电路板和接口连接器进行电互连，从而减小集成电路和存储器模块之间的物理距离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式