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    • 1. 发明授权
    • Apparatus and method for measuring the molten metal level in electromagnetic continuous casting
    • 用于测量电磁连续铸造中熔融金属水平的装置和方法
    • US06517604B1
    • 2003-02-11
    • US09787187
    • 2001-03-15
    • Goo-Hwa KimKi-Jang OhHo-Young KimDong-Jun Shim
    • Goo-Hwa KimKi-Jang OhHo-Young KimDong-Jun Shim
    • B22D1116
    • B22D11/186B22D2/003G01F23/266
    • An apparatus and method for measuring the level of a free surface of molten metal in an electromagnetic continuous casting process using an AC electromagnetic field. A detection coil is provided to detect the sum of a magnetic field applied from an induction coil and an induced magnetic field based on eddy current in the molten metal. An arithmetic unit is provided to detect the surface level of the molten metal by removing a variation of the applied magnetic field with a variation in current to the induction coil from an output signal from the detection coil. The surface level of the molten metal can be accurately measured by determining whether a variation in the output of the detection coil results from a variation in the applied magnetic field or a variation in the surface level of the molten metal.
    • 一种用于在使用AC电磁场的电磁连续铸造工艺中测量熔融金属的自由表面的水平的装置和方法。 提供检测线圈,以检测基于熔融金属中的涡流的从感应线圈施加的磁场和感应磁场的和。 提供了一个算术单元,用于通过从检测线圈的输出信号中除去与感应线圈的电流变化的施加的磁场的变化来检测熔融金属的表面水平。 可以通过确定检测线圈的输出的变化是由所施加的磁场的变化或熔融金属的表面水平的变化导致的,来精确地测量熔融金属的表面水平。
    • 2. 发明授权
    • Apparatus and method for holding molten metal in continuous hot dip coating of metal strip
    • 用于将熔融金属保持在金属条的连续热浸涂层中的装置和方法
    • US06984357B2
    • 2006-01-10
    • US10297741
    • 2002-04-10
    • Ho-Young KimJong-Keun KimGoo-Hwa KimHee-Tae JeongMin-Su YoonAnastasia Kolesnichenko
    • Ho-Young KimJong-Keun KimGoo-Hwa KimHee-Tae JeongMin-Su YoonAnastasia Kolesnichenko
    • C21C5/42
    • C23C2/24
    • A molten metal holding apparatus for the continuous hot dip coating of a metal strip includes a vessel that is substantially rectangular in cross section having long sides and short sides and has formed a slot-shaped opening in a bottom surface, the vessel containing molten metal; subsidiary vessels formed following an outer circumference of an upper end of the vessal and for temporarily storing molten metal that overflows from the upper end of the vessel; chambers formed outwardly following long sides of a lower end of the vessel and that communicate with the vessel via slit-shaped branch openings formed at a predetermined slant toward the vessel; a plurality of subsidiary tubes communicating with the subsidiary vessels; and alternating current electromagnets including a core mounted adjacent to outside side surfaces of the vessel and between the subsidiary vessels and the chambers and a coil wound around the core and to which an alternating current is supplied.
    • 用于金属条的连续热浸涂层的熔融金属保持装置包括:具有长边和短边的截面基本上为矩形的容器,并且在底面形成有槽形开口,容器包含熔融金属; 辅助容器形成在容器的上端的外圆周上,并用于临时储存从容器的上端溢出的熔融金属; 在容器的下端的长边之后形成的腔室,并且通过形成在朝向容器的预定斜面的狭缝状分支开口与容器连通; 与辅助船舶通信的多个辅助管道; 以及包括安装在容器的外侧表面和辅助容器与腔室之间的芯的交流电磁铁,以及缠绕在芯上的线圈,并且供给交流电。
    • 6. 发明申请
    • Semiconductor memory device having shared temperature control circuit
    • 具有共享温度控制电路的半导体存储器件
    • US20100157709A1
    • 2010-06-24
    • US12589674
    • 2009-10-27
    • Ho-Young KimJung-Bae Lee
    • Ho-Young KimJung-Bae Lee
    • G11C7/04G11C8/00G11C7/00
    • G11C29/02G11C5/143G11C7/04G11C11/406G11C11/40626G11C29/028G11C2029/5002G11C2207/2254
    • A semiconductor memory device includes a plurality of memory banks; a plurality of temperature sensing circuits, and a shared control circuit. The temperature sensing circuits correspond to the memory banks and each is disposed in the vicinity of a corresponding memory bank. The shared control circuit is connected to the plurality of temperature sensing circuits and a plurality of refresh circuits for refreshing the plurality of memory banks, performs calibration on the plurality of temperature sensing circuits, performs digital processing on signals for separately controlling refresh intervals for the plurality of memory banks, and transmits the processed signals to the plurality of refresh circuits. Therefore, the refresh intervals for individual channels or banks are separately or selectively controlled. Further, since the plurality of temperature sensing circuits are connected to the shared temperature control circuit, the occupied area of the circuits in a chip is reduced or minimized.
    • 半导体存储器件包括多个存储体; 多个温度检测电路和共享控制电路。 温度感测电路对应于存储体,并且各自设置在相应的存储体的附近。 共享控制电路连接到多个温度检测电路和多个刷新电路,用于刷新多个存储体,对多个温度感测电路进行校准,对用于分别控制多个温度感测电路的刷新间隔的信号执行数字处理 的存储体,并且将处理的信号发送到多个刷新电路。 因此,单独或选择性地控制各通道或组的刷新间隔。 此外,由于多个温度检测电路连接到共享温度控制电路,芯片中的电路的占用面积减小或最小化。
    • 8. 发明授权
    • Display device and driving method thereof
    • 显示装置及其驱动方法
    • US09093027B2
    • 2015-07-28
    • US13751263
    • 2013-01-28
    • Guang hai JinDong-Gyu KimKwan-Wook JungHo-Young KimJune-Woo LeeIn-Ho Choi
    • Guang hai JinDong-Gyu KimKwan-Wook JungHo-Young KimJune-Woo LeeIn-Ho Choi
    • G09G3/32
    • G09G3/3233G09G3/3291G09G2300/0852G09G2300/0861
    • A display device includes a plurality of pixels, each pixel including an organic light emitting diode (OLED) and a driving transistor, a sustain power supply unit applying a first sustain voltage to a plurality of data lines connected to the plurality of pixels, and a data driver applying one of a data signal and a second sustain voltage to the plurality of data lines. For each pixel, the sustain power supply unit applies the first sustain voltage as a first level voltage to reset a gate voltage of the driving transistor and applies the first sustain voltage as a second level voltage to increase the gate voltage of the driving transistor. When an anode voltage of the OLED in each pixel is discharged to be reset, the anode voltage of the OLED is controlled according to a voltage difference between the first level voltage and the second level voltage.
    • 显示装置包括多个像素,每个像素包括有机发光二极管(OLED)和驱动晶体管,维持电源单元对连接到多个像素的多个数据线施加第一维持电压,以及 数据驱动器将数据信号和第二维持电压中的一个施加到多条数据线。 对于每个像素,维持电源单元施加第一维持电压作为第一电平电压以复位驱动晶体管的栅极电压,并施加第一维持电压作为第二电平电压以增加驱动晶体管的栅极电压。 当每个像素中的OLED的阳极电压被放电以被复位时,OLED的阳极电压根据第一电平电压和第二电平电压之间的电压差来控制。
    • 10. 发明授权
    • Semiconductor memory device having shared temperature control circuit
    • 具有共享温度控制电路的半导体存储器件
    • US08174921B2
    • 2012-05-08
    • US12589674
    • 2009-10-27
    • Ho-Young KimJung-Bae Lee
    • Ho-Young KimJung-Bae Lee
    • G11C7/00
    • G11C29/02G11C5/143G11C7/04G11C11/406G11C11/40626G11C29/028G11C2029/5002G11C2207/2254
    • A semiconductor memory device includes a plurality of memory banks; a plurality of temperature sensing circuits, and a shared control circuit. The temperature sensing circuits correspond to the memory banks and each is disposed in the vicinity of a corresponding memory bank. The shared control circuit is connected to the plurality of temperature sensing circuits and a plurality of refresh circuits for refreshing the plurality of memory banks, performs calibration on the plurality of temperature sensing circuits, performs digital processing on signals for separately controlling refresh intervals for the plurality of memory banks, and transmits the processed signals to the plurality of refresh circuits. Therefore, the refresh intervals for individual channels or banks are separately or selectively controlled. Further, since the plurality of temperature sensing circuits are connected to the shared temperature control circuit, the occupied area of the circuits in a chip is reduced or minimized.
    • 半导体存储器件包括多个存储体; 多个温度检测电路和共享控制电路。 温度感测电路对应于存储体,并且各自设置在相应的存储体的附近。 共享控制电路连接到多个温度检测电路和多个刷新电路,用于刷新多个存储体,对多个温度感测电路进行校准,对用于分别控制多个温度感测电路的刷新间隔的信号进行数字处理 的存储体,并且将处理的信号发送到多个刷新电路。 因此,单独或选择性地控制各通道或组的刷新间隔。 此外,由于多个温度感测电路连接到共享温度控制电路,所以芯片中的电路的占用面积减小或最小化。