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1. 发明授权

US08916911B2 Semiconductor devices having backside illuminated image sensors 有权
标题翻译：具有背面照明图像传感器的半导体器件
公开(公告)号：US08916911B2
公开(公告)日：2014-12-23
申请号：US13180898
申请日：2011-07-12
申请人： Gil-Sang Yoo , Chang-Rok Moon , Byung-Jun Park , Sang-Hoon Kim , Seung-Hun Shin
发明人： Gil-Sang Yoo , Chang-Rok Moon , Byung-Jun Park , Sang-Hoon Kim , Seung-Hun Shin
IPC分类号： H01L27/148 , H01L27/146 , H04N5/225
CPC分类号： H01L27/14636 , H01L27/14603 , H01L27/14618 , H01L27/1464 , H01L27/14645 , H01L27/14689 , H01L2224/13 , H04N5/2253 , H04N5/2254
摘要： A semiconductor substrate includes a photodiode on a support substrate. An insulating layer is provided between the support substrate and the semiconductor substrate. A first conductive pattern is provided in the insulating layer. A first through electrode penetrates the support substrate to be in contact with the first conductive pattern.
摘要翻译：半导体衬底包括在支撑衬底上的光电二极管。在支撑基板和半导体基板之间设置绝缘层。第一导电图案设置在绝缘层中。第一穿透电极穿透支撑衬底以与第一导电图案接触。

2. 发明申请

US20120091515A1 Semiconductor Devices Having Backside Illuminated Image Sensors 有权
标题翻译：具有背面照明图像传感器的半导体器件
公开(公告)号：US20120091515A1
公开(公告)日：2012-04-19
申请号：US13180898
申请日：2011-07-12
申请人： Gil-Sang Yoo , Chang-Rok Moon , Byung-Jun Park , Sang-Hoon Kim , Seung-Hun Shin
发明人： Gil-Sang Yoo , Chang-Rok Moon , Byung-Jun Park , Sang-Hoon Kim , Seung-Hun Shin
IPC分类号： H01L31/0224 , H01L23/48 , H01L31/0232
CPC分类号： H01L27/14636 , H01L27/14603 , H01L27/14618 , H01L27/1464 , H01L27/14645 , H01L27/14689 , H01L2224/13 , H04N5/2253 , H04N5/2254
摘要： A semiconductor substrate includes a photodiode on a support substrate. An insulating layer is provided between the support substrate and the semiconductor substrate. A first conductive pattern is provided in the insulating layer. A first through electrode penetrates the support substrate to be in contact with the first conductive pattern.
摘要翻译：半导体衬底包括在支撑衬底上的光电二极管。在支撑基板和半导体基板之间设置绝缘层。第一导电图案设置在绝缘层中。第一穿透电极穿透支撑衬底以与第一导电图案接触。

3. 发明授权

US08633557B2 Image sensors 有权
标题翻译：图像传感器
公开(公告)号：US08633557B2
公开(公告)日：2014-01-21
申请号：US13599960
申请日：2012-08-30
申请人： Sang-Hoon Kim , Chang-Rok Moon
发明人： Sang-Hoon Kim , Chang-Rok Moon
IPC分类号： H01L31/0232
CPC分类号： H01L27/14636 , H01L27/1464 , H01L27/14689
摘要： Image sensors include a first insulation interlayer structure on a first surface of a substrate and having a multi-layered structure. A first wiring structure is in the first insulation interlayer structure. A via contact plug extends from a second surface of the substrate and penetrates the substrate to be electrically connected to the first wiring structure. Color filters and micro lenses are stacked on the second surface in a first region of the substrate. A second insulation interlayer structure is on the second surface in a second region of the substrate. A second wiring structure is in the second insulation interlayer structure to be electrically connected to the via contact plug. A pad pattern is electrically connected to the second wiring structure and having an upper surface through which an external electrical signal is applied. Photodiodes are between the first and second wiring structures in the first region.
摘要翻译：图像传感器包括在基板的第一表面上的具有多层结构的第一绝缘夹层结构。第一布线结构处于第一绝缘夹层结构中。通孔接触插塞从基板的第二表面延伸并穿透基板以电连接到第一布线结构。彩色滤光器和微透镜在衬底的第一区域中的第二表面上堆叠。第二绝缘层间结构位于衬底的第二区域中的第二表面上。第二布线结构在第二绝缘层间结构中，以电连接到通孔接触插塞。焊盘图案电连接到第二布线结构，并且具有施加外部电信号的上表面。光电二极管位于第一区域中的第一和第二布线结构之间。

4. 发明授权

US08457450B2 Printed circuit board and manufacturing method thereof 失效
公开(公告)号：US08457450B2
公开(公告)日：2013-06-04
申请号：US12314449
申请日：2008-12-10
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K3/4691 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

5. 发明申请

US20130009236A1 THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES USING DIRECT STRAPPING LINE CONNECTIONS 有权
标题翻译：使用直接连接线连接的三维半导体存储器件
公开(公告)号：US20130009236A1
公开(公告)日：2013-01-10
申请号：US13543312
申请日：2012-07-06
申请人： Bongyong Lee , Sang-Hoon Kim , Ae-Jeong Lee , Dongchan Kim
发明人： Bongyong Lee , Sang-Hoon Kim , Ae-Jeong Lee , Dongchan Kim
IPC分类号： H01L29/78
CPC分类号： H01L27/11551 , H01L27/11556 , H01L27/11578 , H01L27/11582
摘要： Memory devices include a plurality of elongate gate stacks extending in parallel on a substrate and at least one insulation region disposed in a trench between adjacent ones of the gate stacks. The at least one insulation region has linear first portions having a first width and widened second portions having a second width greater than the first width. A common source region is disposed in the substrate underlying the at least one insulation region. The devices further include respective conductive plugs passing through respective ones of the widened second portions of the at least one insulation region and electrically connected to the common source region and at least one strapping line disposed on the conductive plugs between the adjacent ones of the gate stacks and in direct contact with the conductive plugs.
摘要翻译：存储器件包括在衬底上平行延伸的多个细长栅极叠层和设置在相邻栅极叠层之间沟槽中的至少一个绝缘区域。所述至少一个绝缘区具有具有第一宽度的线性第一部分和具有大于第一宽度的第二宽度的加宽的第二部分。公共源极区域设置在至少一个绝缘区域下方的衬底中。这些器件还包括各自的导电插塞，其穿过至少一个绝缘区域的加宽的第二部分中的相应导电插塞并且电连接到公共源极区域，以及设置在相邻栅极叠层之间的导电插塞上的至少一个捆扎线并与导电插头直接接触。

6. 发明申请

US20110073271A1 STRIP EDGE SHAPE CONTROL APPARATUS AND METHOD IN STRIP CASTING PROCESS 审中-公开
标题翻译：条纹边缘形状控制装置和条纹铸造工艺中的方法
公开(公告)号：US20110073271A1
公开(公告)日：2011-03-31
申请号：US12676796
申请日：2008-09-25
申请人： Yoon-Ha Kim , Sang-Hoon Kim , Han-Nam Cheong
发明人： Yoon-Ha Kim , Sang-Hoon Kim , Han-Nam Cheong
IPC分类号： B22D11/16 , B22D2/00
CPC分类号： B22D11/16 , B22D11/0622 , B22D11/066
摘要： Disclosed herein are an apparatus and method for controlling the edge shape of a strip in a twin-roll strip casting process, which improve the quality of the strip by using cameras to photograph the edge portions of the strip being cast by strip casting, analyzing the photographs, and then controlling edge dams according to the edge shape of the strip. The apparatus comprises: an edge dam driving unit which is attached to edge dams attached to both sides of casting rolls so as to control the pressing force of the edge dams against the casting rolls and the upward shift of the edge dams according to the wear and upward shift rate of the edge dams; cameras which are disposed at the strip outlet side of the casting rolls so as to photograph the edge portions of the strip; and a control unit which analyzes the edge shape of the strip from images photographed by the cameras and outputs a signal controlling the wear and upward shift of the edge dams.
摘要翻译：本文公开了一种用于控制双辊带钢铸造工艺中条带的边缘形状的装置和方法，其通过使用照相机通过带钢铸造来拍摄待铸造的带材的边缘部分来提高条带的质量，分析照片，然后根据条的边缘形状控制边坝。该装置包括：边缘坝驱动单元，其附接到附接到铸辊两侧的边坝，以便根据磨损控制边缘坝抵靠铸辊的压力和边坝的向上移动，边坝上升率; 照相机，其设置在铸辊的带出口侧，以便拍摄条带的边缘部分; 以及控制单元，其从由照相机拍摄的图像分析条带的边缘形状，并输出控制边缘坝的磨损和向上移动的信号。

7. 发明申请

US20090133444A1 Method of manufacturing optical board 审中-公开
标题翻译：制造光板的方法
公开(公告)号：US20090133444A1
公开(公告)日：2009-05-28
申请号：US12149517
申请日：2008-05-02
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
IPC分类号： C03B37/022
CPC分类号： G02B6/136 , G02B6/4214 , G02B6/43 , H05K1/0274 , H05K3/4611
摘要： A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.
摘要翻译：公开了一种制造光学板的方法。制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层在倾斜的表面上。

8. 发明申请

US20090130390A1 Optical wiring board and manufacturing method thereof 审中-公开
标题翻译：光接线板及其制造方法
公开(公告)号：US20090130390A1
公开(公告)日：2009-05-21
申请号：US12149952
申请日：2008-05-09
申请人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： B32B3/00 , B29D11/00
CPC分类号： B29D11/00663 , B29D11/00807 , G02B6/136 , H05K1/0274 , Y10T428/24612
摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.
摘要翻译：公开了一种光布线板及其制造方法。制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。本发明的实施例可用于容易地控制芯的厚度。

9. 发明授权

US07505661B2 Optical waveguide, package board having the same, and manufacturing method thereof 失效
标题翻译：光波导，具有该光波导的封装板及其制造方法
公开(公告)号：US07505661B2
公开(公告)日：2009-03-17
申请号：US12078948
申请日：2008-04-08
申请人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
发明人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
IPC分类号： G02B6/10 , H01L21/00
CPC分类号： B29D11/00663 , G02B6/136 , G02B6/43 , H05K1/0274 , H05K3/3436 , H05K2201/10121 , Y10T29/49155
摘要： An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.
摘要翻译：公开了一种光波导，具有光波导的封装板及其制造方法。制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在第一包层的一侧上以预定距离设置 ; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 以及在所述第一包层的所述一侧上堆叠第二包层，使得所述第二包层覆盖所述第一反射凸起，所述第二反射凸起和所述芯。利用该方法，可以通过在下包层上层叠金属层然后选择性地蚀刻金属层来形成倾斜表面，这可以减少交货时间并且能够在设计上实现高自由度。

10. 发明授权

US07431466B2 Solar simulator using a combination of mercury and halogen lamps 有权
标题翻译：使用汞和卤素灯组合的太阳能模拟器
公开(公告)号：US07431466B2
公开(公告)日：2008-10-07
申请号：US11177852
申请日：2005-07-08
申请人： Jae-Myung Lee , Gun-Young Park , Sang-Hwa Baek , Jeong-Yong Lee , Gil-Sang Nam , Sang-Hoon Kim , Baek-Hee Jeong
发明人： Jae-Myung Lee , Gun-Young Park , Sang-Hwa Baek , Jeong-Yong Lee , Gil-Sang Nam , Sang-Hoon Kim , Baek-Hee Jeong
IPC分类号： F21V9/02
CPC分类号： G01N21/255
摘要： A solar simulator combines mercury lamps and halogen lamps, to improve upon conventional solar simulators using halogen and infrared lamps which cannot recreate an environment close to that under real sunlight, and upon solar simulators using expensive and fragile metal halide lamps and arc xenon lamps. An environment recreation laboratory for solar simulation includes a lamp bank mounted at an upper portion thereof and including a plurality of halogen lamps, halogen filter lamps being halogen lamps provided with an infrared filter, respectively, and mercury lamps. A temperature control unit includes a cooling unit that discharges air to cool the lamp bank, and an air conditioner that distributes the air discharged by the cooling unit. An electrical panel controls operations of the lamp bank and the temperature control unit, such that an environment within the environment recreation laboratory may very closely simulate the environment under real sunlight.
摘要翻译：太阳能模拟器将汞灯和卤素灯组合在一起，以改进使用卤素灯和红外灯的常规太阳能模拟器，这些灯不能重现与真正阳光下的环境接近的环境，以及使用昂贵且脆弱的金属卤化物灯和电弧氙灯的太阳能模拟器。用于太阳能模拟的环境娱乐实验室包括安装在其上部并包括多个卤素灯的灯组，分别设置有红外滤光器的卤素灯的卤素过滤灯和汞灯。温度控制单元包括排出空气以冷却灯组的冷却单元和分配由冷却单元排出的空气的空调。电气面板控制灯组和温度控制单元的操作，使得环境娱乐实验室内的环境可以非常模拟真实阳光下的环境。

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