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1. 发明授权

US07697800B2 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US07697800B2
公开(公告)日：2010-04-13
申请号：US12453616
申请日：2009-05-15
申请人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/12 , G02B6/10 , H01L21/00
CPC分类号： G02B6/1221 , G02B6/136 , G02B6/28 , G02B6/4214 , H05K1/0274 , H05K3/20 , Y10T29/49155
摘要： A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
摘要翻译：一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

2. 发明授权

US07546002B2 Printed circuit board and manufacturing method thereof 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US07546002B2
公开(公告)日：2009-06-09
申请号：US11889477
申请日：2007-08-14
申请人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/12 , G02B6/10
CPC分类号： G02B6/1221 , G02B6/136 , G02B6/28 , G02B6/4214 , H05K1/0274 , H05K3/20 , Y10T29/49155
摘要： A printed circuit board and a method of manufacturing a printed circuit board are disclosed. A printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
摘要翻译：公开了印刷电路板和制造印刷电路板的方法。一种印刷电路板，其中形成光波导以与电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在传输电信号的包层中的布线图案可以提供通过使包层作为绝缘层并将布线图案嵌入包层中，可以提高光学连接效率并降低材料成本。

3. 发明申请

US20080044129A1 Printed circuit board and manufacturing method thereof 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20080044129A1
公开(公告)日：2008-02-21
申请号：US11889477
申请日：2007-08-14
申请人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/12 , H05K3/00
CPC分类号： G02B6/1221 , G02B6/136 , G02B6/28 , G02B6/4214 , H05K1/0274 , H05K3/20 , Y10T29/49155
摘要： A printed circuit board and a method of manufacturing a printed circuit board are disclosed. A printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
摘要翻译：公开了印刷电路板和制造印刷电路板的方法。一种印刷电路板，其中形成光波导以与电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在传输电信号的包层中的布线图案可以提供通过使包层作为绝缘层并将布线图案嵌入包层中，可以提高光学连接效率并降低材料成本。

4. 发明授权

US08457450B2 Printed circuit board and manufacturing method thereof 失效
公开(公告)号：US08457450B2
公开(公告)日：2013-06-04
申请号：US12314449
申请日：2008-12-10
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K3/4691 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

5. 发明申请

US20090133444A1 Method of manufacturing optical board 审中-公开
标题翻译：制造光板的方法
公开(公告)号：US20090133444A1
公开(公告)日：2009-05-28
申请号：US12149517
申请日：2008-05-02
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
IPC分类号： C03B37/022
CPC分类号： G02B6/136 , G02B6/4214 , G02B6/43 , H05K1/0274 , H05K3/4611
摘要： A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.
摘要翻译：公开了一种制造光学板的方法。制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层在倾斜的表面上。

6. 发明申请

US20090130390A1 Optical wiring board and manufacturing method thereof 审中-公开
标题翻译：光接线板及其制造方法
公开(公告)号：US20090130390A1
公开(公告)日：2009-05-21
申请号：US12149952
申请日：2008-05-09
申请人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： B32B3/00 , B29D11/00
CPC分类号： B29D11/00663 , B29D11/00807 , G02B6/136 , H05K1/0274 , Y10T428/24612
摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.
摘要翻译：公开了一种光布线板及其制造方法。制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。本发明的实施例可用于容易地控制芯的厚度。

7. 发明授权

US07505661B2 Optical waveguide, package board having the same, and manufacturing method thereof 失效
标题翻译：光波导，具有该光波导的封装板及其制造方法
公开(公告)号：US07505661B2
公开(公告)日：2009-03-17
申请号：US12078948
申请日：2008-04-08
申请人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
发明人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
IPC分类号： G02B6/10 , H01L21/00
CPC分类号： B29D11/00663 , G02B6/136 , G02B6/43 , H05K1/0274 , H05K3/3436 , H05K2201/10121 , Y10T29/49155
摘要： An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.
摘要翻译：公开了一种光波导，具有光波导的封装板及其制造方法。制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在第一包层的一侧上以预定距离设置 ; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 以及在所述第一包层的所述一侧上堆叠第二包层，使得所述第二包层覆盖所述第一反射凸起，所述第二反射凸起和所述芯。利用该方法，可以通过在下包层上层叠金属层然后选择性地蚀刻金属层来形成倾斜表面，这可以减少交货时间并且能够在设计上实现高自由度。

8. 发明授权

US08056220B2 Printed circuit board and manufacturing method thereof 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08056220B2
公开(公告)日：2011-11-15
申请号：US12314450
申请日：2008-12-10
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
IPC分类号： H05K3/00 , G02B6/12
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K3/4691 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.
摘要翻译：公开了印刷电路板。一种印刷电路板，包括第一板部分，柔性板部分，其一侧与第一板部分耦合并且包括电布线层和光波导以传输电信号和光信号;以及第二板与柔性基板部分的另一侧耦合的部分，其中电布线层和光波导在其间具有间隙设置，可以通过使光波导和电布线层间隔开来提供更大的弯曲性和可靠性在板的柔性部分之间，通过使光波导分别制造，然后在板的制造过程中插入，可以以更高的精度制造光波导以获得更高的可靠性。

9. 发明申请

US20110007999A1 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US20110007999A1
公开(公告)日：2011-01-13
申请号：US12923143
申请日：2010-09-03
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/13 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K3/4691
摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.
摘要翻译：一种印刷电路板，包括具有电路图案的第一光波导和埋在其一侧的焊盘，堆叠在所述第一光波导的一侧上的第一绝缘层，堆叠在所述第一绝缘层上的第一绝缘材料，布线层堆叠在第一绝缘材料上，具有电路图案和埋在其一侧的焊盘的第二光波导，堆叠在第二光波导的一侧上的第二绝缘层，堆叠在第二绝缘层上的第二绝缘材料层叠在所述第二绝缘材料上的第二电布线层，插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层，使得附接所述第一光波导和所述第二光波导;以及穿过第一光波导和第二光波导的通孔。

10. 发明申请

US20090223044A1 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US20090223044A1
公开(公告)日：2009-09-10
申请号：US12453616
申请日：2009-05-15
申请人： Han Seo Cho , Je Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Seo Cho , Je Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： H05K3/10
CPC分类号： G02B6/1221 , G02B6/136 , G02B6/28 , G02B6/4214 , H05K1/0274 , H05K3/20 , Y10T29/49155
摘要： A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
摘要翻译：一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

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