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1. 发明申请

US20110007999A1 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US20110007999A1
公开(公告)日：2011-01-13
申请号：US12923143
申请日：2010-09-03
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/13 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K3/4691
摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.
摘要翻译：一种印刷电路板，包括具有电路图案的第一光波导和埋在其一侧的焊盘，堆叠在所述第一光波导的一侧上的第一绝缘层，堆叠在所述第一绝缘层上的第一绝缘材料，布线层堆叠在第一绝缘材料上，具有电路图案和埋在其一侧的焊盘的第二光波导，堆叠在第二光波导的一侧上的第二绝缘层，堆叠在第二绝缘层上的第二绝缘材料层叠在所述第二绝缘材料上的第二电布线层，插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层，使得附接所述第一光波导和所述第二光波导;以及穿过第一光波导和第二光波导的通孔。

2. 发明申请

US20090133444A1 Method of manufacturing optical board 审中-公开
标题翻译：制造光板的方法
公开(公告)号：US20090133444A1
公开(公告)日：2009-05-28
申请号：US12149517
申请日：2008-05-02
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
IPC分类号： C03B37/022
CPC分类号： G02B6/136 , G02B6/4214 , G02B6/43 , H05K1/0274 , H05K3/4611
摘要： A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.
摘要翻译：公开了一种制造光学板的方法。制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层在倾斜的表面上。

3. 发明申请

US20090130390A1 Optical wiring board and manufacturing method thereof 审中-公开
标题翻译：光接线板及其制造方法
公开(公告)号：US20090130390A1
公开(公告)日：2009-05-21
申请号：US12149952
申请日：2008-05-09
申请人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： B32B3/00 , B29D11/00
CPC分类号： B29D11/00663 , B29D11/00807 , G02B6/136 , H05K1/0274 , Y10T428/24612
摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.
摘要翻译：公开了一种光布线板及其制造方法。制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。本发明的实施例可用于容易地控制芯的厚度。

4. 发明授权

US07505661B2 Optical waveguide, package board having the same, and manufacturing method thereof 失效
标题翻译：光波导，具有该光波导的封装板及其制造方法
公开(公告)号：US07505661B2
公开(公告)日：2009-03-17
申请号：US12078948
申请日：2008-04-08
申请人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
发明人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
IPC分类号： G02B6/10 , H01L21/00
CPC分类号： B29D11/00663 , G02B6/136 , G02B6/43 , H05K1/0274 , H05K3/3436 , H05K2201/10121 , Y10T29/49155
摘要： An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.
摘要翻译：公开了一种光波导，具有光波导的封装板及其制造方法。制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在第一包层的一侧上以预定距离设置 ; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 以及在所述第一包层的所述一侧上堆叠第二包层，使得所述第二包层覆盖所述第一反射凸起，所述第二反射凸起和所述芯。利用该方法，可以通过在下包层上层叠金属层然后选择性地蚀刻金属层来形成倾斜表面，这可以减少交货时间并且能够在设计上实现高自由度。

5. 发明授权

US08048324B2 Method of manufacturing optical waveguide and method of manufacturing package board 有权
标题翻译：制造光波导的方法及制造封装板的方法
公开(公告)号：US08048324B2
公开(公告)日：2011-11-01
申请号：US12076359
申请日：2008-03-17
申请人： Han-Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han-Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/10
CPC分类号： G02B6/43 , G02B6/1221 , G02B6/136 , H01L2224/16225
摘要： A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.
摘要翻译：一种制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在其之间设置有预定距离，载体抛光第一反射凸块和第二反射凸块的表面; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 在载体的上侧上堆叠上覆层以覆盖第一反射凸块，第二反射凸块和芯; 移除载体; 并且在上部包层的下侧层叠下部包层。在导电载体上形成反射凸块，并且对反射凸块进行抛光以形成倾斜表面，可以减少交货时间并且可以提供高度的设计自由度。

6. 发明授权

US07991250B2 Printed circuit board 有权
公开(公告)号：US07991250B2
公开(公告)日：2011-08-02
申请号：US12923143
申请日：2010-09-03
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/13 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K3/4691
摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

7. 发明授权

US07809220B2 Printed circuit board and manufacturing method thereof 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US07809220B2
公开(公告)日：2010-10-05
申请号：US12219135
申请日：2008-07-16
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/13 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K3/4691
摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.
摘要翻译：公开了印刷电路板和印刷电路板的制造方法。印刷电路板可以包括：光波导，其一侧埋有电路图案和垫; 层叠在光波导一侧的绝缘层; 堆叠在所述绝缘层上的第一绝缘材料; 堆叠在所述第一绝缘材料上的第一电布线层; 层叠在所述光波导的另一侧的第二绝缘材料; 层叠在所述第二绝缘材料上的第二电布线层; 以及穿过光波导的通孔。本发明的某些实施例能够有效地传输光信号和电信号，减少传输到光电转换器的光信号的损耗，并且允许更有效的设计用于电路板中的配线。

8. 发明申请

US20090072419A1 Method of manufacturing optical waveguide and method of manufacturing package board 有权
标题翻译：制造光波导的方法及制造封装板的方法
公开(公告)号：US20090072419A1
公开(公告)日：2009-03-19
申请号：US12076359
申请日：2008-03-17
申请人： Han-Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han-Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/10
CPC分类号： G02B6/43 , G02B6/1221 , G02B6/136 , H01L2224/16225
摘要： A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.
摘要翻译：一种制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在其之间设置有预定距离，载体抛光第一反射凸块和第二反射凸块的表面; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 在载体的上侧上堆叠上覆层以覆盖第一反射凸块，第二反射凸块和芯; 移除载体; 并且在上部包层的下侧层叠下部包层。在导电载体上形成反射凸块，并且对反射凸块进行抛光以形成倾斜表面，可以减少交货时间并且可以提供高度的设计自由度。

9. 发明申请

US20080037929A1 Optical printed circuit board and fabricating method thereof 失效
标题翻译：光学印刷电路板及其制造方法
公开(公告)号：US20080037929A1
公开(公告)日：2008-02-14
申请号：US11889327
申请日：2007-08-10
申请人： Joon-Sung Kim , Je-Gwang Yoo , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Je-Gwang Yoo , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： G02B6/13
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274
摘要： An optical printed circuit board which can transfer optical signal and electric signals simultaneously, and a method of fabricating the optical printed circuit board. An optical printed circuit board which includes an upper cladding layer, a core layer positioned in the upper cladding layer that has a first reflecting surface and a second reflecting surface at both ends to guide optical signals, a lower cladding layer of which one side is in contact with the upper cladding layer and which has a circuit pattern and light connecting bumps on the other side corresponding to the first reflecting surface and the second reflecting surface, may provide the advantage of high optical connection efficiency.
摘要翻译：可以同时传送光信号和电信号的光学印刷电路板，以及制造光学印刷电路板的方法。一种光学印刷电路板，包括上包层，位于上包层中的芯层，其具有第一反射表面和两端的第二反射表面以引导光信号;一侧的下包层与上包层接触并且具有电路图案和在与第一反射表面和第二反射表面相对应的另一侧上的光连接凸块可提供高的光连接效率的优点。

10. 发明授权

US08159824B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US08159824B2
公开(公告)日：2012-04-17
申请号：US12230700
申请日：2008-09-03
申请人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
发明人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
IPC分类号： H05K1/00
CPC分类号： G02B6/4246 , G02B6/4214 , H05K1/0274 , H05K3/429 , H05K3/4691 , H05K2201/10121
摘要： A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board unit and the other side stacked on the second board unit, where the flexible optical board includes a core through which the optical signals travel, a cladding surrounding the core, and a circuit pattern buried in the cladding which transmits electrical signals. By forming the rigid boards and the flexible optical board as an integrated structure, the need for separate connectors is obviated, and thus the cost of the product can be lowered.
摘要翻译：公开了印刷电路板。印刷电路板包括第一板单元和设置在其间的间隙的第二板单元和被配置为传输光信号的柔性光板，所述光信号具有堆叠在第一板单元上的一侧，而另一侧堆叠在第二板单元，其中柔性光学板包括光信号行进的芯，围绕芯的包层以及掩埋在包层中的传输电信号的电路图案。通过将刚性板和柔性光学板形成为一体结构，可以避免对单独的连接器的需要，从而可以降低产品的成本。

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