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    • 2. 发明授权
    • Logic circuit including at least one resistor or one transistor having a
saturable resistor field effect transistor structure
    • 逻辑电路包括至少一个电阻器或一个具有可饱和电阻器场效应晶体管结构的晶体管
    • US4394589A
    • 1983-07-19
    • US323535
    • 1981-11-20
    • Ngu T. PhamGerard Nuzillat
    • Ngu T. PhamGerard Nuzillat
    • H01L29/73H01L21/331H01L21/338H01L27/06H01L27/095H01L27/26H01L29/80H01L29/812H01L47/00H03K19/0952H03K19/094
    • H03K19/0952H01L27/26H01L47/00
    • A logic circuit including an input stage, wherein a first field-effect transistor is in series with a first saturable resistor interposed on the drain side in the supply of the first transistor, and an output stage including a second transistor which is identical with the first and has a supply on the drain side which is common with the input stage supply. The gate of the second transistor is connected to the drain of the first transistor. The supply circuit of the second transistor is closed across a forward-biased diode, and a second saturable resistor on the ground of the common supply is connected to the source of the first transistor. At least a selected of the field effect transistors or the saturable resistors has a saturable resistor structure formed of a layer of semiconductor material on a semi-insulating substrate. The material is doped to set up a dipolar domain in respect of an electric field which is higher than a so-called critical value. The saturable resistor structure further includes a groove cut in the semiconductor layer between two ohmic contacts so as to define a residual channel in the material. The dimensions of the groove are such that the critical value of the electric field is overstepped in respect of a value of the order of one volt of the voltage between the ohmic contacts.
    • 一种包括输入级的逻辑电路,其中第一场效应晶体管与插在第一晶体管的电源中的漏极侧的第一可饱和电阻串联,以及包括与第一晶体管相同的第二晶体管的输出级 并且在漏极侧具有与输入级电源相同的电源。 第二晶体管的栅极连接到第一晶体管的漏极。 第二晶体管的电源电路跨越正向偏置二极管闭合,并且公共电源的基极上的第二可饱和电阻器连接到第一晶体管的源极。 至少选择的场效应晶体管或可饱和电阻器具有由半绝缘基板上的半导体材料层形成的可饱和电阻器结构。 该材料被掺杂以在高于所谓的临界值的电场上建立偶极区域。 可饱和电阻器结构还包括在两个欧姆接触之间的半导体层中切割的槽,以便在该材料中限定残余通道。 凹槽的尺寸使得电场的临界值相对于欧姆接触之间的电压的一伏的值是超过的。
    • 5. 发明授权
    • Method of manufacturing a logic circuit including at least one
field-effect transistor structure of the normally-off type and at least
one saturable resistor
    • 制造逻辑电路的方法,该逻辑电路包括至少一个常关型的场效晶体管结构和至少一个可饱和电阻
    • US4402127A
    • 1983-09-06
    • US295108
    • 1981-08-21
    • Ngu T. PhamGerard Nuzillat
    • Ngu T. PhamGerard Nuzillat
    • H01L29/73H01L21/331H01L21/338H01L27/06H01L27/095H01L27/26H01L29/80H01L29/812H01L47/00H03K19/0952H01L21/302
    • H03K19/0952H01L27/26H01L47/00
    • A method of manufacturing a logic circuit having at least one field effect transistor connected in series with at least one saturable resistor, wherein an active semiconductor layer is formed with a predetermined thickness on a semi-insulating substrate, ohmic contacts are deposited to produce source and drain regions for the resistor and the transistor, a Schottky contact is deposited between the resistor source and drain ohmic contacts to form a gate region which is then electrically connected to the resistor source contact by means of a metal connection, whereupon the localized thickness of the active layer is measured by measuring the drain-source current to the resistor upon application of a predetermined voltage thereto and a groove then cut between the source and drain contacts of the field effect transistor to obtain a predetermined channel depth from the bottom of the groove to the semi-insulating substrate. Then, a Schottky contact is deposited in the groove of the field effect transistor and the logic circuit completed conventionally.
    • 一种制造逻辑电路的方法,所述逻辑电路具有与至少一个可饱和电阻器串联连接的至少一个场效应晶体管,其中在半绝缘衬底上形成具有预定厚度的有源半导体层,沉积欧姆接触以产生源极和 用于电阻器和晶体管的漏极区域,在电阻器源极和漏极欧姆触点之间沉积肖特基接触,以形成栅极区域,然后通过金属连接电连接到电阻器源极触点,于是, 通过在施加预定电压时测量到电阻器的漏极 - 源极电流来测量有源层,然后在场效应晶体管的源极和漏极接触之间切割沟槽,以从槽的底部获得预定的沟道深度 半绝缘基板。 然后,在场效应晶体管的沟槽中沉积肖特基接触,并且常规地完成逻辑电路。
    • 8. 发明授权
    • Process for producing an integrated circuit
    • 集成电路的制造方法
    • US4263340A
    • 1981-04-21
    • US17955
    • 1979-03-06
    • Gerard NuzillatChristian Arnodo
    • Gerard NuzillatChristian Arnodo
    • H01L21/338H01L21/768H01L27/06H01L29/20H01L29/812H01L29/48
    • H01L29/20H01L21/768H01L21/76834H01L27/0605
    • An integrated circuit and process for producing an integrated circuit. The circuit includes two interconnection layers, a lower layer being separated from the substrate by a thin dielectric layer, and separated from the upper layer by a thick dielectric layer, the interconnections between the two interconnection layers being situated outside the zone of the active elements of the integrated circuit. The circuit comprises active elements deposited for example on portions of an n-type layer supported by a substrate of semi-insulating gallium arsenide. Ohmic and Schottky contacts are connected either to the lower interconnection layer or to the upper interconnection layer. The thin dielectric layer is for example a silica layer whose thickness is less than 1,000 Angstroms, the thick dielectric layer having a thickness of 5,000 to 10,000 Angstroms.
    • 一种用于制造集成电路的集成电路和工艺。 电路包括两个互连层,下层通过薄的电介质层与衬底分离,并由上层由厚介电层分开,两个互连层之间的互连位于有源元件的区域之外 集成电路。 该电路包括例如沉积在由半绝缘砷化镓的衬底支撑的n型层的部分上的有源元件。 欧姆和肖特基触点连接到下互连层或上互连层。 薄介电层例如是厚度小于1000埃的二氧化硅层,厚介电层的厚度为5,000至10,000埃。